Semiconductor News & Analysis Feed
137 articles
2026-06-26
digitimes.com
2026-06-26
US-based automated test equipment supplier Teradyne plans to expand its presence in India and has appointed Alpa Sood as India Manager, as the company seeks to deepen engagement in a semiconductor ecosystem moving toward manufacturing scale.
2026-06-26
marklapedus.substack.com
2026-06-26
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IBM Debuts Nanostack Technology For Sub-1nm Chips
Big Blue has unveiled a sub-1nm chip technology, featuring a new transistor
2026-06-24
digitimes.com
2026-06-24
Cloud service providers are accelerating in-house AI chip development, lifting demand for application-specific integrated circuits, or ASICs, and reshaping collaboration across the semiconductor supply chain.
2026-06-24
marklapedus.substack.com
2026-06-24
Semiecosystem
Quantum Computing Acquires NHanced Semiconductors
Quantum Computing Inc., a quantum optics and photonics company, has acquired NHanced Semiconductors, a U.S-based advanced packaging vendor
SEMIECOSYSTEM
JUN 24, 2026
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By Mark LaPedus
Quantum Computing Inc. (QCi), a quantum optics and photonics company, has acquired NHanced Semiconductors, a U.S-based advanced packaging vendor.
Under t
2026-06-23
eetimes.com
2026-06-23
Spain is turning Europe’s theoretical talk of digital sovereignty into practical reality.
2026-06-23
news.google.com
2026-06-23
EE Times Asia
2026-06-23
seekingalpha.com
2026-06-23
Seeking Alpha
__fail__
2026-06-22
www.electronicsweekly.com
2026-06-22
Electronics Weekly
__fail__
2026-06-19
marklapedus.substack.com
2026-06-19
Semiecosystem
Intel Names New Advanced Packaging Chief
Intel has reorganized its foundry unit, naming a new executive to lead its packaging business
SEMIECOSYSTEM
JUN 19, 2026
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By Mark LaPedus
Intel has reorganized its foundry unit and appointed a new executive to lead its efforts in the advanced packaging business.
Seok-Hee Lee, formerly president and chief executive of SK On, has been appointed a
2026-06-19
www.benzinga.com
2026-06-19
Benzinga
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2026-06-18
stories.prf.org
2026-06-18
Purdue Research Foundation
This article has been translated by Google Translate. To read the original article, click here.
To deepen Taiwan-US cooperation in science and technology, talent and industry, a delegation from Purdue University visited the Ministry of Education and the Ministry of Economic Affairs on June 17 and had in-depth exchanges with GeChi Compound Semiconductor on issues such as third-generation semicondu
2026-06-18
finance.yahoo.com
2026-06-18
Yahoo Finance
This is a paid press release. Contact the press release distributor directly with any inquiries.
PurePlay ETFs Makes Debut with the PurePlay NVIDIA Ecosystem Picks & Shovels Index ETF, the First ETF Designed to Track the NVIDIA Value Chain
Business Wire
Thu, June 18, 2026 at 6:00 AM PDT 4 min read
NVDA
+0.84%
Trade NVIDIA on Coinbase
Trading disclosure
DETROIT, June 18, 2026--(BUSINESS WIRE)--Pur
2026-06-18
news.google.com
2026-06-18
Business Wire
2026-06-18
eetimes.com
2026-06-18
Catalonia is unifying its fragmented tech ecosystem into a coordinated semiconductor cluster spanning photonics, packaging, AI, and chip research.
2026-06-18
digitimes.com
2026-06-18
Beyond its established role in assembly, testing and packaging (ATP), Penang's next stage of development will depend on its ability to deepen capabilities in precision engineering, automation and system integration, while moving into higher-value equipment manufacturing and R&D. Following the opening of Galatek's new facility in Penang, Malaysia, DIGITIMES spoke with Galatek Malaysia general manag
2026-06-17
marklapedus.substack.com
2026-06-17
Semiecosystem
Intel Foundry Describes New 18A-P Process
The 2nm-class process enables high-performance chips. It features a dual contact, low resistance transistor option
SEMIECOSYSTEM
JUN 17, 2026
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By Mark LaPedus
At this week’s VLSI Symposium, Intel Foundry provided an update on its process roadmap, including the status of its new 18A-P technology.
Targeted for the foundry market, Intel’s 18A-P p
2026-06-17
marklapedus.substack.com
2026-06-17
Semiecosystem
TSMC, Amkor Form Packaging/Test Partnership
This establishes a collaboration framework for TSMC to procure from Amkor advanced packaging and testing services
SEMIECOSYSTEM
JUN 17, 2026
5
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By Mark LaPedus
TSMC and Amkor Technology have formed a major and long-term partnership in the advanced packaging and test arena in the United States.
The 10-year agreement establishes a collaboration f
2026-06-16
news.google.com
2026-06-16
Business Wire
2026-06-16
news.google.com
2026-06-16
Yahoo! Finance Canada
2026-06-16
digitimes.com
2026-06-16
TSMC is accelerating its advanced packaging roadmap for AI chips, expanding CoWoS capacity while publicly disclosing new progress in glass substrate technology. The company is also signaling that next-generation packaging competition is shifting from CoWoS toward CoPoS as it builds out a fuller ecosystem ahead of rivals.