Semiconductor News & Analysis Feed

548 articles
2026-05-27
www.techspot.com 2026-05-27 TechSpot
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2026-05-27
boisedev.com 2026-05-27 Boise Dev
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2026-05-27
boisedev.com 2026-05-27 Boise Dev
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2026-05-27
tomshardware.com 2026-05-27 Aaron Klotz
Nvidia has finally retired its 20-year-old control panel for GeForce GPUs. From now on, new GeForce drivers will only include the Nvidia App.
2026-05-27
tomshardware.com 2026-05-27 Ben Stockton
Updated daily, this list shows the lowest US prices on major SSD models.
2026-05-27
tomshardware.com 2026-05-27 Luke James
The Suwon District Court rejected the injunction filed by five employees from Samsung’s Device eXperience division.
2026-05-27
tomshardware.com 2026-05-27 Jowi Morales
Some Chinese AI industry leaders must get the green light from Beijing before they can take that international vacation.
2026-05-26
247wallst.com 2026-05-26 24/7 Wall St.
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2026-05-26
finance.yahoo.com 2026-05-26 Yahoo Finance
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2026-05-26
newsroom.st.com 2026-05-26 STMicroelectronics
700V PowerGaN devices improve energy efficiency and enable more compact power designs for AI servers, robotics, industrial systems and advanced consumer applications including home appliances Alexander Jurman Technical Media Relations Tel. +420602748611 alexander.jurman@st.com To receive frequent updates via email, subscribe to our press releases. New gallium nitride (GaN)-based power semicondu
2026-05-26
eetimes.com 2026-05-26
Huawei's answer to Moore's Law without EUV promises 14A performance by 2031.
2026-05-26
www.marketscreener.com 2026-05-26 marketscreener.com
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2026-05-26
www.marketscreener.com 2026-05-26 marketscreener.com
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2026-05-26
finance.yahoo.com 2026-05-26 Yahoo Finance
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2026-05-26
www.investing.com 2026-05-26 Investing.com
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2026-05-26
www.fool.com 2026-05-26 The Motley Fool
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2026-05-26
www.linkedin.com 2026-05-26 LinkedIn
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2026-05-26
www.ad-hoc-news.de 2026-05-26 AD HOC NEWS
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2026-05-26
biz.chosun.com 2026-05-26 Chosunbiz
By  Hwang Min-gyu Published 2026.05.26. 09:13 A concept diagram of iHBM technology released by SK hynix. /Courtesy of SK hynix SK hynix unveiled next-generation technology that reduces heat by inserting a cooling element inside a high bandwidth memory (HBM) package. On the 26th, SK hynix said it introduced "iHBM," a technology that embeds an integrated cooling element, ICE, in an HBM package. IC
2026-05-26
digitimes.com 2026-05-26
South Korea and the Netherlands are looking to broaden their semiconductor partnership beyond ASML's EUV lithography machines, as silicon photonics (SiPh) emerges as a potential next field of cooperation amid rising power and bandwidth demands from AI data centers.