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2026-06-16
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2026-06-16
foreignpolicyjournal.com
Qualcomm (NASDAQ: QCOM) is reportedly in advanced talks to acquire AI chip startup Tenstorrent in a deal valued between $8 billion and $10 billion, according to Reuters.
The potential acquisition would mark a significant strategic expansion for Qualcomm, pushing the chipmaker beyond its traditional mobile processor and connectivity chip stronghold.
Trump plans massive July 4 celebration, ICE age
2026-06-16
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2026-06-16
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2026-06-16
The Motley Fool
Micron Technology is a widely followed artificial intelligence (AI) infrastructure stock, as it supplies a critical component in the form of memory chips that go into a variety of AI accelerator chips.
The company's revenue and earnings have been growing rapidly, driven by an acute shortage of memory chips. Micron is poised to release its fiscal 2026 third-quarter results on June 24, and there is
2026-06-16
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2026-06-16
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WASHINGTON, June 16 (Reuters) - U.S. President Donald Trump has invoked the Defense Production Act to address constraints in weapons supply and development for munitions production and supply chains, according to a memo made public on Tuesday.
The move comes amid growing concern in Washington about the capacity of U.S. weapons manufacturers to meet demand.
Solid rocket motors, igniters and guida
2026-06-16
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2026-06-16
AD HOC NEWS
Resonac, JP3521500008
New SiC power module push, Resonac Hipo™ MOSFET aims at next-gen EV inverters
16.06.2026 - 13:43:03 | ad-hoc-news.de
Resonac is expanding its silicon carbide portfolio with the Hipo SiC MOSFET module line, targeting high-efficiency inverters for electric vehicles and industrial drives. The modules focus on low loss, high reliability and support for 800-volt architectures in
2026-06-16
tomshardware.com
2026-06-16
Anton Shilov
Next-generation data center processors from AMD and Intel with 16 DDR5 memory channels are even bigger than today’s designs.
2026-06-16
tomshardware.com
2026-06-16
Jowi Morales
Will Finland be successful in convicting a crew suspected of damaging its undersea infrastructure this time?
2026-06-16
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2026-06-16
CNBC
2026-06-16
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2026-06-16
Tom's Hardware
Tech Industry Manufacturing Semiconductors
TSMC says panel packaging won't replace CoWoS anytime soon for the largest future AI processors — wafer-level tech can scale to 58 massive dies in one package
News
By Anton Shilov published 16 hours ago
CoPoS may enable larger chips, but CoWoS is still better.
(Image credit: Intel)
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TSMC highlights CoWoS strength over panel packaging for largest AI chips
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June 16, 2026
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At TSMC's European Technology Symposium, Kevin Zhang, TSMC's senior vice president of business development and global sales and deputy co-COO, said that panel-l
2026-06-16
tomshardware.com
2026-06-16
Anton Shilov
CoPoS may enable larger chips, but CoWoS is still better.
2026-06-16
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2026-06-16
Eagle-Tribune
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