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2026-06-08
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2026-06-08
simplywall.st
2026-06-08
simplywall.st
United States/Semiconductors/NasdaqGS:NVDA
AI Chips Today - NVIDIA and SK hynix: Advancing AI Infrastructure Together
June 08, 2026
Simply Wall St
NVIDIA and SK hynix have announced a multiyear technology partnership aimed at developing next-generation memory to support the global buildout of AI factories. This collaboration is set to enhance memory supply aligned with NVIDIA's AI infrastructure
2026-06-08
www.canonrumors.com
2026-06-08
Canon Rumors
www.canonrumors.com
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2026-06-08
www.koreaherald.com
2026-06-08
The Korea Herald
SK Group Chairman Chey Tae-won (left) and Jensen Huang, CEO of Nvidia, participate in a press briefing held at SK Group's headquarters in Seoul on Monday. (Yonhap)
SK hynix Inc. has ordered new high-bandwidth memory (HBM) production equipment from Hanmi Semiconductor in a deal worth 44.2 billion won (US$28.7 million), a regulatory filing showed Monday, in a possible bid to expand production of HB
2026-06-08
economictimes.indiatimes.com
2026-06-08
The Economic Times
Synopsis
Samsung's co-CEO Jun Young-hyun met with Nvidia CEO Jensen Huang in Seoul to discuss future semiconductor cooperation. The companies are already collaborating on autonomous driving and AI accelerator chips, and explored long-term partnerships for next-generation foundry chips, including HBM4E and HBM5.
ANI
Samsung Electronics' co-CEO and head of its chip division, Jun Young-hyun, said on
2026-06-08
economictimes.indiatimes.com
2026-06-08
The Economic Times
Synopsis
Samsung's co-CEO Jun Young-hyun met with Nvidia CEO Jensen Huang in Seoul to discuss future semiconductor cooperation. The companies are already collaborating on autonomous driving and AI accelerator chips, and explored long-term partnerships for next-generation foundry chips, including HBM4E and HBM5.
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ANI
Samsung Electronics' co-CEO an
2026-06-08
en.yna.co.kr
2026-06-08
Yonhap News Agency
SEOUL, June 8 (Yonhap) -- The head of Samsung Electronics' memory business said Monday he met with Nvidia CEO Jensen Huang and discussed long-term cooperation in next-generation high-bandwidth memory (HBM) products.
Jun Young-hyun, who leads Samsung Electronics' device solutions division, made the remarks to reporters after meeting Huang during his visit to South Korea to meet industry leaders to
2026-06-08
www.arcweb.com
2026-06-08
ARC Advisory
JUNE 8, 2026
BYDAVID HUMPHREY
CATEGORY:
ACQUISITION OR PARTNERSHIP
Siemens AG and Infineon Technologies AG are partnering to advance electrical protection and ensure reliable operations in data centers, production facilities, and battery storage systems. As part of the collaboration, Infineon will supply silicon carbide (SiC) power modules to Siemens for use in its SENTRON 3QD2 semiconductor circ
2026-06-08
www.tomshardware.com
2026-06-08
Tom's Hardware
PC Components GPUs
Amazon is offering a $324 Nvidia RTX 5060 GPU deal in a lightning sale, making it the cheapest model available — 1080p gaming on a budget
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By Stewart Bendle published 10 hours ago
Perfect for 1080p and some 1440p gaming
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2026-06-08
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2026-06-08
Investing.com
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2026-06-08
www.reuters.com
2026-06-08
Reuters
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2026-06-08
finance.yahoo.com
2026-06-08
Yahoo Finance
Samsung Elec's chip chief says he discussed next-generation foundry with Nvidia CEO
FILE PHOTO: FILE PHOTO: Samsung Electronics logo is seen in Seoul · Reuters
Reuters
Mon, June 8, 2026 at 3:48 AM PDT 1 min read
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SEOUL, June 8 (Reuters) - Samsung Electronics' co-CEO and head of its chip division, Jun Young-hyun, said on Mo
2026-06-08
www.theinformation.com
2026-06-08
The Information
Big Read: SpaceX’s CFO Is the Quiet VIP of a Wild IPO
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2026-06-08
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2026-06-08
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2026-06-08
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2026-06-08
Business Wire
2026-06-08
sg.finance.yahoo.com
2026-06-08
Yahoo Finance Singapore
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Mitsubishi Electric and Semikron Danfoss Jointly Develop New Standard Package for Power Semiconductor Modules
Business Wire
Mon, 8 June 2026 at 6:00 am GMT-4 1 min read
6503.T
-5.75%
New LV100-type standard package with integrated 3-level circuit contributes to standardized inverter designs
TOKYO, Ju
2026-06-08
www.thelec.net
2026-06-08
thelec.net
A conceptual diagram of ITM Semiconductor's motor controller SiP. (Graphic: ITM Semiconductor)
ITM Semiconductor said on June 8 that it will develop next-generation motor control technology for robots and drones after being selected as the lead company for South Korea's Ministry of Trade, Industry and Energy-backed "Next-Generation System-in-Package (SiP) Core Technology Development" program.
Un
2026-06-08
www.tradingview.com
2026-06-08
TradingView
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Reuters
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Samsung Elec's chip chief says discussed next-generation foundry, HBM cooperation with Nvidia CEO
Samsung Elec's chip chief says discussed next-generation foundry, HBM cooperation with Nvidia CEO
RefinitivLess than 1 min read
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2026-06-08
www.iotinsider.com
2026-06-08
IOT Insider
SMART WORLD
Infineon targets wearable payments market with SECORA Connect X and tokenisation platform
NEWS DESK
4 MINUTES AGO
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Infineon Technologies has launched a new platform designed to bring secure contactless payments to smart wearables, as semiconductor suppliers seek to capitalise on growing demand for connected devices capable of operating independently of smartphones.
The German chipm
2026-06-08
www.bloomberg.com
2026-06-08
Bloomberg.com
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