Semiconductor News & Analysis Feed
686 articles
2026-05-29
seekingalpha.com
2026-05-29
Seeking Alpha
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2026-05-29
www.neowin.net
2026-05-29
Neowin
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2026-05-29
kfgo.com
2026-05-29
KFGO
By Heekyong Yang
SEOUL, May 29 (Reuters) – Samsung Electronics on Friday said it started shipping samples of its latest high-bandwidth memory (HBM) chip to customers, pulling ahead of rivals in distributing a new version of the product critical to AI data centers and sending its shares higher.
The South Korean tech company said the new chip, the 12-layer HBM4E, is more than 20% faster than its
2026-05-29
wtvbam.com
2026-05-29
WTVB
By Heekyong Yang
SEOUL, May 29 (Reuters) – Samsung Electronics on Friday said it started shipping samples of its latest high-bandwidth memory (HBM) chip to customers, pulling ahead of rivals in distributing a new version of the product critical to AI data centers and sending its shares higher.
The South Korean tech company said the new chip, the 12-layer HBM4E, is more than 20% faster than its
2026-05-29
whtc.com
2026-05-29
WHTC
By Heekyong Yang
SEOUL, May 29 (Reuters) – Samsung Electronics on Friday said it started shipping samples of its latest high-bandwidth memory (HBM) chip to customers, pulling ahead of rivals in distributing a new version of the product critical to AI data centers and sending its shares higher.
The South Korean tech company said the new chip, the 12-layer HBM4E, is more than 20% faster than its
2026-05-29
digitimes.com
2026-05-29
Samsung Electronics has started shipping samples of its latest high-bandwidth memory (HBM) chip, the 12-layer HBM4E, marking the industry's first delivery of the next-generation AI memory product, according to the company. The move underscores intensifying competition among memory suppliers as demand accelerates for higher-performance components used in AI computing systems.
2026-05-29
www.reuters.com
2026-05-29
Reuters
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2026-05-29
news.samsung.com
2026-05-29
samsung.com
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2026-05-28
dbr.donga.com
2026-05-28
동아비즈니스리뷰 | DBR
㈜동아미디어엔 (온라인비즈니스)
서울시 서대문구 충정로29 동아일보사빌딩 15층
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2026-05-28
m.techflowpost.com
2026-05-28
深潮TechFlow
Samsung relies on the technology cycle, SK Hynix on HBM—what enables Micron to win a trillion-dollar market cap?
2026.05.28
- 12 minutes ago
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Samsung relies on the technol
ogy cycle, SK Hynix on HB…
At the three most critical junctures, Micron’s first response was not to accelerate technological investment, but rather to pick up the phone and seek assistan
2026-05-27
wccftech.com
2026-05-27
Wccftech
FuriosaAI and Broadcom have partnered to build a high-performance AI accelerator chip featuring next-gen HBM4/E memory.
FuriosaAI has announced its third-generation AI accelerator, which builds upon its 2nd Generation RNGD platform, which is currently in mass production on TSMC's 5nm process technology. The 2nd Gen RNGD AI platform comes in the form of a 180W PCIe-based design, which aims at LLM
2026-05-27
www.techtimes.com
2026-05-27
Tech Times
By Allen Lee
Published: May 27 2026, 11:27 AM EDT
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A visitor takes a picture of a model of SK hynix's high-bandwidth memory (HBM) technology during the 2025 World IT Show in Seoul on April 24, 2025. South Korean chip giant SK hynix reported record quarterly profits on April 24, thanks to soaring
2026-05-27
www.techtimes.com
2026-05-27
Tech Times
By Allen Lee
Published: May 27 2026, 11:27 AM EDT
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A visitor takes a picture of a model of SK hynix's high-bandwidth memory (HBM) technology during the 2025 World IT Show in Seoul on April 24, 2025. South Korean chip giant SK hynix reported record quarterly profits on April 24, thanks to soaring
2026-05-27
www.tradingkey.com
2026-05-27
TradingKey
Micron Technology (MU) shows strong bullish momentum, approaching the 1.618 Fibonacci extension at $919.75. Q2 FY2026 results revealed 62% YoY revenue growth to $8.71B, with Data Center revenue up 150%. HBM3E is sold out through most of 2026, and full-year guidance was raised to $31.5-$33.5B. HBM's custom nature and high switching costs differentiate it from commodity DRAM, supporting sustainable
2026-05-27
www.communicationstoday.co.in
2026-05-27
Communications Today
COMPANY NEWS
SK hynix unveils ‘iHBM’ technology to reduce HBM heat
May 27, 2026
SK hynix on May 26 unveiled a new thermal management technology called “iHBM,” designed to address heat generation issues in high-bandwidth memory (HBM) products operating at increasingly higher speeds.
The key feature of iHBM is an integrated thermal control component called ICE, embedded directly inside the HBM pac
2026-05-27
en.cryptonomist.ch
2026-05-27
The Cryptonomist
HomeZ - Banner home engSK Hynix trillion valuation jumps after 12% record rally on HBM
Z - Banner home eng
SK Hynix trillion valuation jumps after 12% record rally on HBM
27 May 2026
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SK Hynix trillion valuation lifts $1T memory-chip race on HBM
SK Hynix trillion valuation became one of Wednesday’s biggest market stories after the South Korean memory-chip giant surged past the $1 trillion m
2026-05-27
en.sedaily.com
2026-05-27
Seoul Economic Daily
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2026-05-27
semiengineering.com
2026-05-27
Semiconductor Engineering
Combining manufacturing-resolution geometry with deterministic, solver-accurate computation changes the economics of thermal analysis for advanced 2.5D packages.
Thermal management has become the defining bottleneck in high-performance computing (HPC) and AI accelerator packaging.
Modern packages integrate high-power ASICs with multiple High Bandwidth Memory (HBM) stacks on a silicon interposer,
2026-05-27
www.investing.com
2026-05-27
Investing.com
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2026-05-27
www.igorslab.de
2026-05-27
igor´sLAB
LATEST NEWS
SK hynix iHBM: Cooling moves directly into the HBM package
27. May 2026 06:00Samir Bashir
📖 Reading time: approx. 4 minutes · 797 words · 5,114 characters
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SK hynix has introduced iHBM, a new thermal solution for future High Bandwidth Memory generations. At first glance, the approach sounds like classic packaging refinement, but it targets a point that is increasingly becoming