Semiconductor News & Analysis Feed

Taiwan Semiconductor Manufacturing Company (TSMC) is expanding its glass substrate supply chain as the first step in establishing a supply chain for chip-on-panel-on-substrate (CoPoS) packaging technology. This move indicates TSMC's commitment to advancing its chip-on-wafer-on-substrate (CoWoS) pack

As AI chip power consumption surges, traditional silicon-based power architectures are approaching physical limits, prompting an industry-wide shift toward 800V high-voltage direct current (HVDC) systems. In this context, silicon carbide (SiC) has emerged as a critical material for solid-state trans