Semiconductor News & Analysis Feed
10752 articles
2026-06-25
digitimes.com
2026-06-25
National Silicon Industry Group, China's leading 12-inch silicon wafer maker, has announced a CNY11.45 billion (US$1.6 billion) capital injection into its core subsidiary Shanghai Xinsheng Semiconductor Technology, in a restructuring aimed at easing losses in its wafer business.
2026-06-25
digitimes.com
2026-06-25
On June 24, Micron Technology reported record fiscal third-quarter results and issued a fourth-quarter forecast that significantly exceeded market expectations, reinforcing investor confidence in the AI infrastructure boom. Analysts said the company's expanding portfolio of multi-year customer agreements could help reduce the memory industry's traditional volatility, while persistent supply constr
2026-06-25
digitimes.com
2026-06-25
Qualcomm Technologies is expanding its partnership with Hugging Face to bring open AI tools from devices to cloud infrastructure, a move that could affect developers and enterprises worldwide. The collaboration aims to simplify AI deployment across the compute continuum while enabling faster, more flexible, and more scalable hybrid AI applications.
2026-06-25
digitimes.com
2026-06-25
MediaTek is reportedly strengthening its partnership with Google in ASICs, a move that could increase the scale of future orders and carry implications for AI infrastructure worldwide. Market talk suggests the company may build an upgraded triggerfish product for Google, underscoring how global chipmakers are vying for influence in TPU development.
2026-06-25
digitimes.com
2026-06-25
Qualcomm used its June 24 investor day to unveil a data center chip portfolio and a multi-generation CPU agreement with Meta, a strategic bid to diversify beyond a shrinking smartphone business and challenge Nvidia's dominance — while courting Chinese demand and leaning on manufacturing partner TSMC.
2026-06-25
digitimes.com
2026-06-25
Nvidia and Amazon Web Services (AWS) are expanding tools that could make it easier for companies worldwide to build and run large-scale AI systems. The changes aim to improve speed, lower costs, and reduce operational complexity across inference, search, and training, which could influence how global enterprises deploy production AI.
2026-06-25
digitimes.com
2026-06-25
Optical lens manufacturer Calin Technology stated at its shareholders' meeting on June 24 that global market growth has been weakened by economic volatility and US tariff policies. It reported consolidated revenue of NT$1.02 billion (approx. US$32 million) in 2025 and a net loss after tax of NT$261 million. Although profitability fell short of expectations due to production volumes remaining below
2026-06-25
digitimes.com
2026-06-25
SK Group chairman Chey Tae-won is planning to meet Tesla and SpaceX leadership in the US at the end of June 2026 to advance cooperation on next-generation AI infrastructure, memory supply, and data-center projects, South Korean outlet Ddailyreported, citing industry sources. The meeting is expected to cover specific business collaboration plans with Tesla, SpaceX, and xAI, though the exact date wa
2026-06-25
digitimes.com
2026-06-25
JCET Group is accelerating its AI chip packaging expansion with a CNY7.8 billion (US$1.1 billion) investment in a new advanced packaging and testing plant in Shanghai Lingang, strengthening capacity for AI computing, high-performance chips, high-density memory and automotive electronics.
2026-06-25
digitimes.com
2026-06-25
At Nvidia's June 25 annual shareholder meeting, CEO Jensen Huang declared that national security "comes first" wherever it conflicts with commercial opportunity, pledging full compliance with US export controls while casting the chipmaker as a core pillar of America's AI and semiconductor industrial base.
2026-06-25
digitimes.com
2026-06-25
As demand for AI chips surges, the battle for foundry orders is heating up. South Korean industry sources say the next 2-3 years will be a critical period for Samsung Electronics' foundry business, with its 2028 turnaround target hinging on stable operations at the Taylor plant and landing major orders.
2026-06-25
digitimes.com
2026-06-25
The global semiconductor packaging and testing race is heating up as TSMC recently signed a 10-year agreement with Amkor to expand advanced packaging collaboration in Arizona, drawing close market attention to how the rivalry with ASE and Amkor will reshape market share. ASE Chief Operating Officer Tien Wu said he is "optimistic," stating that strong demand from US customers and the need to divers
2026-06-25
digitimes.com
2026-06-25
Micron Technology expects the global memory market to remain supply-constrained beyond 2027, driven by surging artificial intelligence demand and structural limits on new manufacturing capacity, while unveiling a new long-term supply model backed by strategic customer agreements.
2026-06-25
digitimes.com
2026-06-25
IC design firms are scrambling to expand their partner networks as tight packaging and testing capacity remain the most pressing bottleneck in the supply chain. Companies in Taiwan, Europe, and the US say the shortage is worse than expected, pushing packaging, testing, and related materials into broader supply constraints.
2026-06-25
digitimes.com
2026-06-25
Rising demand for AI server builds is tightening the global supply of high-end MLCCs, driving steep price increases in China's electronics distribution market and exposing how quickly infrastructure demand can affect component costs worldwide. The rally underscores a structural mismatch that could keep pressure on buyers across technology supply chains for years, according to industry sources.
2026-06-25
digitimes.com
2026-06-25
Micron Technology is turning the AI memory boom into a new Wall Street story: not just record DRAM, NAND and HBM demand, but stronger free cash flow, long-term customer commitments and a clearer path to shareholder returns.
2026-06-25
digitimes.com
2026-06-25
Co-packaged optics (CPO) is rapidly emerging as a foundational architecture for next-generation AI infrastructure. With Nvidia's latest Scale-Up CPO switch roadmap now taking shape, bandwidth per AI rack is set to increase from approximately 130 TB/s in the Blackwell generation to more than 1 PB/s in the Feynman era, spanning Blackwell, Rubin, Rubin Ultra, and Feynman platforms. As a result, the g
2026-06-25
digitimes.com
2026-06-25
The European Commission has given the green light to a EUR76 million (approx. US$86.3 million) German subsidy supporting QuantumDiamonds' plan to build a new semiconductor testing equipment facility in Munich, the Commission announced. The approval is the latest step in Brussels' push to reduce Europe's reliance on foreign chip technology and strengthen its industrial autonomy.
2026-06-25
digitimes.com
2026-06-25
Global helium supply is under renewed strain. Nippon Sanso, Japan's largest industrial gas supplier, announced it will raise prices across its helium product line by an average of more than 30% starting July 2026, citing persistent tightness in global supply driven in part by rising geopolitical risks in the Middle East.
2026-06-25
digitimes.com
2026-06-25
SK Hynix said on June 24 its board approved a plan to issue new shares backing American Depositary Receipts on the Nasdaq Global Select Market, targeting up to KRW45.45 trillion (approx. US$29.43 billion) in proceeds for semiconductor facility investment.