Semiconductor News & Analysis Feed
36 articles
2026-07-06
news.google.com
2026-07-06
IndexBox
2026-07-04
www.ad-hoc-news.de
2026-07-04
Ad-hoc-news.de
2026-07-03
newsletter.semianalysis.com
2026-07-03
SemiAnalysis
2026-07-01
www.odaily.news
2026-07-01
odaily.news
In a research note released on June 26, UBS provided a more detailed picture of the spreading demand within China's AI hardware chain: demand for AI infrastructure remains robust, and the pull factors now extend beyond GPUs to include PCBs, optical interconnects, liquid cooling, SiC substrates, and optical communication materials.
2026-07-01
www.odaily.news
2026-07-01
odaily.news
In a research note released on June 26, UBS provided a more detailed picture of the spreading demand within China's AI hardware chain: demand for AI infrastructure remains robust, and the pull factors now extend beyond GPUs to include PCBs, optical interconnects, liquid cooling, SiC substrates, and optical communication materials.
2026-06-27
pandaily.com
2026-06-27
Pandaily
categories.technology
MediaTek Emerges as Major Challenger in Optical Interconnect Chip Market
Published:
June 27, 2026
Reading Time:
2 min read
Want to read in a language you're more familiar with?
MediaTek enters the optical interconnect chip market with CPO technology and Micro LED optical solutions, challenging Broadcom and Marvell's duopoly in the AI data center optical chip sector.
MediaT
2026-06-27
eetimes.com
2026-06-27
Silicon photonics has spent years waiting for its moment. According to Lightmatter CEO Nick Harris, that moment has finally arrived.
2026-06-26
digitimes.com
2026-06-26
AI-driven hyperscale data center expansion is pushing the global AI race beyond raw GPU computing power into a broader contest over high-speed interconnects and electro-optical integration. As Nvidia's next-generation AI factory moves toward petabyte (PB)-scale data transfers, co-packaged optics (CPO) is heading toward commercialization, lifting the importance of key components such as fiber array
2026-06-25
digitimes.com
2026-06-25
Co-packaged optics (CPO) is rapidly emerging as a foundational architecture for next-generation AI infrastructure. With Nvidia's latest Scale-Up CPO switch roadmap now taking shape, bandwidth per AI rack is set to increase from approximately 130 TB/s in the Blackwell generation to more than 1 PB/s in the Feynman era, spanning Blackwell, Rubin, Rubin Ultra, and Feynman platforms. As a result, the g
2026-06-24
digitimes.com
2026-06-24
China's LineShine supercomputer debuted at No. 1 on the June 2026 TOP500 list, announced at the ISC 2026 conference in Hamburg, becoming the first system to sustain more than two exaflops on the standard HPL benchmark using CPUs only. The result marks the first time since 2017 that a China-based system has led the TOP500 ranking, and reflects Beijing's effort to present a frontier computing system
2026-06-19
www.eenewseurope.com
2026-06-19
eeNews Europe
NVIDIA has backed the latest US regulatory move on grid access, after the Federal Energy Regulatory Commission issued show-cause orders aimed at speeding the connection of data centres, manufacturing plants and other large electricity users.
The FERC large-load interconnection action directs six regional grid operators under FERC jurisdiction to justify their existing tariff rules or file changes
2026-06-18
digitimes.com
2026-06-18
Imec and Sony Semiconductor Solutions Corporation (Sony) have jointly presented a new integration method for connecting the front and back sides of semiconductor wafers, a step the two organizations say could support future 3D chip-stacking designs for logic and memory devices.
2026-06-18
www.theregister.com
2026-06-18
The Register
NETWORKS
Nvidia-backed optics vendor to boost wafer output by 4x to meet AI interconnect demand
Jensen can't risk semiconductor supply chains derailing the AI hype train
Tobias Mann
Systems editor
0
Published Wed 17 Jun 2026 // 18:12 UTC
As AI systems grow larger, optics are playing a larger part in their design – so much so that at Computex earlier this month, Nvidia CEO Jensen Huang proclaim
2026-06-15
digitimes.com
2026-06-15
Google's push to diversify its Tensor Processing Units (TPUs) supply chain is increasingly reaching into the foundry side, adding pressure on ASIC makers such as MediaTek. Recent reports indicate that Google is not only set to adopt Intel's embedded multi-die interconnect bridge (EMIB) packaging for its next-generation product, but is also planning to bring in Samsung Electronics for front-end waf
2026-06-12
digitimes.com
2026-06-12
United Nova Technology (UNT) is expanding from automotive and industrial chips into AI server power management and optical interconnects through a CNY20 billion (US$3 billion) 12-inch mixed-signal fab project.
2026-06-03
finance.yahoo.com
2026-06-03
Yahoo Finance
__fail__
2026-06-03
news.google.com
2026-06-03
Business Wire
2026-05-29
digitimes.com
2026-05-29
Chinese CMOS image sensor supplier SmartSens Technology announced on May 26 that it has entered into a strategic partnership with Chinese IC design company Unisoc to jointly develop Micro LED-based high-speed optical interconnect technology, targeting applications in AI computing clusters, smart vehicles, and industrial vision.
2026-05-29
digitimes.com
2026-05-29
Intel is reportedly making a major push into advanced semiconductor packaging as it seeks to strengthen its foundry business and expand capacity for its Embedded Multi-die Interconnect Bridge (EMIB) technology, according to ETNews.
2026-05-28
digitimes.com
2026-05-28
Marvell Technology used its first-quarter fiscal 2027 earnings call to detail accelerating progress across optical, copper, and silicon photonics-based connectivity, signaling that AI infrastructure is shifting from compute-centric bottlenecks toward networking-driven architectures. The company's expanded interconnect portfolio, new silicon photonics acquisition, and emerging scale-up switch progr