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According to multiple media reports, TSMC is reportedly developing an EMIB-like advanced packaging technology in collaboration with Kinsus, a Taiwan-based IC substrate maker, to prevent customer shifts from its existing CoWoS platform to Intel’s packaging solutions. As TSMC’s CoWoS capacity faces in

Kinsus Interconnect Tech, a Taiwan-based company specializing in IC substrates and advanced packaging solutions, plays a critical role in the semiconductor supply chain by bridging chip fabrication and final system assembly. The company serves high-performance computing and consumer electronics sect