Semiconductor News & Analysis Feed
454 articles
2026-05-29
digitimes.com
2026-05-29
Chinese CMOS image sensor supplier SmartSens Technology announced on May 26 that it has entered into a strategic partnership with Chinese IC design company Unisoc to jointly develop Micro LED-based high-speed optical interconnect technology, targeting applications in AI computing clusters, smart vehicles, and industrial vision.
2026-05-29
digitimes.com
2026-05-29
As the global buildout of artificial intelligence infrastructure accelerates, Taiwan's technology industry has emerged as one of the most closely watched hubs in the world. Ahead of COMPUTEX 2026, Morgan Stanley held its Asia AI Summit in Taipei for the first time, underscoring the island's central role in the global semiconductor supply chain and the AI investment cycle.
2026-05-29
digitimes.com
2026-05-29
South Korean fabless chip-design company DeepX is using Computex 2026 to broaden partnerships around its neural processing units, or NPUs, as it pushes low-power AI chips for industrial and edge applications.
2026-05-29
digitimes.com
2026-05-29
Samsung Electronics has started shipping samples of its latest high-bandwidth memory (HBM) chip, the 12-layer HBM4E, marking the industry's first delivery of the next-generation AI memory product, according to the company. The move underscores intensifying competition among memory suppliers as demand accelerates for higher-performance components used in AI computing systems.
2026-05-29
digitimes.com
2026-05-29
Unimicron said it will push advanced substrate and AI system-board upgrades in 2026 to capture accelerating demand for AI-related ASICs and switches, aiming for record revenue that would exceed its 2022 peak. The IC substrate and printed circuit board maker announced the strategy at its annual shareholders' meeting at the end of May, citing a shift in demand away from GPUs and CPUs toward ASICs, s
2026-05-29
digitimes.com
2026-05-29
Arm EVP and Chief Commercial Officer Will Abbey visited QBit Semiconductor's Taiwan headquarters on May 27, signaling deeper cooperation that could shape future chip design for edge AI, physical AI, and quantum-computing cybersecurity. The visit highlights how platform alliances are increasingly influencing next-generation computing architectures for global technology markets.
2026-05-29
ktxs.com
2026-05-29
KTXS
ABILENE, Texas — A major expansion in West Texas is now taking shape.
IREN, a digital infrastructure company, has partnered with NVIDIA to help build out its Sweetwater data center campus in Fisher County.
“What this brings to the partnership is the ability to apply that architecture to our Sweetwater campus," said David Shaw, chief operating officer for IREN. "The benefits of that is the abilit
2026-05-29
ktxs.com
2026-05-29
KTXS
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IREN partners with NVIDIA to develop AI-ready architecture for West Texas data center
IREN partners with NVIDIA to develop AI-ready architecture for West Texas data center campus (IREN)
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2026-05-29
www.technetbooks.com
2026-05-29
Technetbook
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Intel Fellow Ravi Mahajan on how EMIB and Advanced Packaging Drive Modern AI Computing
Intel Foundry Advanced Packaging Evolution and EMIB Development for Artificial Intelligence Workloads and Future Semiconductor Architecture Solutions
The semiconductor industry is at a turning point where shrinking transistors is no longer sufficient to support the massive computational power needed
2026-05-28
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2026-05-28
Yahoo! Finance Canada
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2026-05-28
gizmodo.com
2026-05-28
Gizmodo
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2026-05-28
www.indexbox.io
2026-05-28
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2026-05-28
evertiq.com
2026-05-28
Evertiq
© Amkor
Business | May 28, 2026
Amkor acquires additional land in Arizona to expand advanced packaging campus
Evertiq
US semiconductor packaging and test provider Amkor Technology has secured an additional 67-acre parcel of land adjacent to its existing campus in Peoria, Arizona, expanding its footprint for future advanced packaging and test capacity.
The acquisition adds to Amkor's existing 104-
2026-05-28
semiengineering.com
2026-05-28
Semiconductor Engineering
Multi-die assemblies give chip architects the option to change some dies while keeping the rest of the system intact, but which is best to keep?
Despite initial design and verification challenges, chiplet-based architectures are proving to be a cost-effective way of reusing large portions of a design while staying current with the latest I/O protocols and logic.
Early discussions about chiplets
2026-05-28
digitimes.com
2026-05-28
Shiny Chemical Industrial said demand for its electronic-grade products is being driven mainly by advanced semiconductor processes, AI, and high-performance computing, with its share of revenue continuing to rise. The company has begun expanding capacity for its electronic-grade isopropyl alcohol (IPA) and propylene glycol methyl ether (PM) lines.
2026-05-28
digitimes.com
2026-05-28
Marvell Technology used its first-quarter fiscal 2027 earnings call to detail accelerating progress across optical, copper, and silicon photonics-based connectivity, signaling that AI infrastructure is shifting from compute-centric bottlenecks toward networking-driven architectures. The company's expanded interconnect portfolio, new silicon photonics acquisition, and emerging scale-up switch progr
2026-05-28
digitimes.com
2026-05-28
China has brought AI chips into its national security and reliability evaluation framework for the first time, turning what looks like a product certification process into something more consequential: an emerging gatekeeping system for AI computing infrastructure.
2026-05-28
semiengineering.com
2026-05-28
Liz Allan
Multi-die assemblies give chip architects the option to change some dies while keeping ...
2026-05-28
digitimes.com
2026-05-28
Advanced Semiconductor Engineering (ASE) has unveiled its industry-first automated panel-level packaging (PLP) system, a development poised to reshape global artificial intelligence (AI) and high-performance computing supply chains by significantly improving chip integration speeds and manufacturing efficiency for AI data centers and cloud infrastructure providers.
2026-05-28
digitimes.com
2026-05-28
Copper clad laminate (CCL) maker Iteq held its 2026 annual general meeting on Thursday, with Chairman Dennis Chen saying that the continued deepening of generative AI applications, faster cloud computing and data center expansion, and steady growth in demand from new energy-related industries are boosting demand for high-end electronic materials and high-frequency, high-speed printed circuit board