Semiconductor News & Analysis Feed
4757 articles
2026-06-16
finance.yahoo.com
2026-06-16
Yahoo Finance
Impinj and onsemi Shares Skyrocket, What You Need To Know
Petr Huřťák
Mon, June 15, 2026 at 9:36 PM PDT 3 min read
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A number of stocks jumped in the afternoon session after the Trump administration announced a new peace deal that would lead to the reopening of the Strait of Hormuz, signaling a potential recovery in th
2026-06-16
www.igorslab.de
2026-06-16
igor´sLAB
LATEST NEWS
Cadence and Intel Foundry deepen 14A partnership: The real battle begins with the PDK
16. June 2026 06:00Samir Bashir
📖 Reading time: approx. 6 minutes · 1,019 words · 6,600 characters
One can say very grand things about new process nodes. “Angstrom,” “High-NA EUV,” “AI foundry,” “leadership” – the industry has enough vocabulary to turn a process node into almost a religious experienc
2026-06-16
www.igorslab.de
2026-06-16
igor´sLAB
LATEST NEWS
Cadence and Intel Foundry deepen 14A partnership: The real battle begins with the PDK
16. June 2026 06:00Samir Bashir
📖 Reading time: approx. 6 minutes · 1,019 words · 6,600 characters
One can say very grand things about new process nodes. “Angstrom,” “High-NA EUV,” “AI foundry,” “leadership” – the industry has enough vocabulary to turn a process node into almost a religious experienc
2026-06-16
www.tradingkey.com
2026-06-16
TradingKey
TSMC is collaborating with Ibiden and Innolux to validate glass substrates for its new CoPoS advanced packaging technology. This shift from wafer-level to panel-level processing aims to overcome limitations of traditional organic and silicon interposers. Simulation results indicate glass substrates offer significant improvements in warpage, thermal expansion, elastic modulus, power integrity, and
2026-06-16
finance.yahoo.com
2026-06-16
Yahoo Finance
Qualcomm’s Reported Tenstorrent Talks Test Lofty Valuation And AI Ambitions
Simply Wall St
Mon, June 15, 2026 at 8:20 PM PDT 2 min read
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Qualcomm, ticker NasdaqGS:QCOM, is reportedly in talks to acquire AI chip startup Tenstorrent
2026-06-16
www.ad-hoc-news.de
2026-06-16
AD HOC NEWS
Suess Microtec, DE000A1K0235
New release push: Suess Microtec’s XBC300 Gen2 targets advanced packaging demand
16.06.2026 - 05:05:28 | ad-hoc-news.de
Suess Microtec has introduced the XBC300 Gen2 wafer bonder to address surging demand in advanced packaging and 3D integration, aiming squarely at high-volume semiconductor production rather than lab-scale tools.
Suess Microtec, DE000A1K0235
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2026-06-16
news.google.com
2026-06-16
EE Times Asia
2026-06-16
autonews.gasgoo.com
2026-06-16
Gasgoo
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Li Auto launches new-gen cockpit platform powered by proprietary OS, Qualcomm's latest chip
Li Auto
Li Auto launches new-gen cockpit platform powered by proprietary OS, Qualcomm's latest chip
Monika From Gasgoo
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June 16 , 2026 10:34 BJT
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Gasgoo Munich- Li Auto used its Livis Day software and embodied intelligence event to introduce a new flagship cockpit
2026-06-16
news.google.com
2026-06-16
EE Times Asia
2026-06-16
www.digitimes.com
2026-06-16
digitimes
Nvidia's dominance in AI is extending beyond model training and deeper into inference—the fast-growing segment of the AI market responsible for running deployed models and generating revenue.
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2026-06-16
www.channelnewsasia.com
2026-06-16
CNA
Singapore
PUB channels S$12 million to develop water efficiency solutions for wafer fabrication, data centres: DPM Gan
The data centre and chipmaking industries are water-intensive and provide critical components and services for artificial intelligence.
A file photo of an employee walking through a data centre. (Photo: REUTERS/Priyanshu Singh)
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2026-06-16
sg.finance.yahoo.com
2026-06-16
Yahoo Finance Singapore
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Murata Collaborates with Synopsys to Provide Simulation Models Through Ansys Electromagnetic and Thermal Analysis Tools
Business Wire
Mon, 15 June 2026 at 7:00 pm GMT-7 3 min read
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[Murata Manufacturing Co., Ltd.] New collaboration with Synopsys
KYOTO, Japan, June 16, 2026--(B
2026-06-16
www.ad-hoc-news.de
2026-06-16
AD HOC NEWS
ASE Tech, TW0003711008
New high-density fan-out module, ASE Technology pushes advanced packaging for AI chips
16.06.2026 - 03:43:12 | ad-hoc-news.de
ASE Technology is highlighting its FOCoS fan-out module as a high-density packaging option for AI and data center processors, combining multiple dies and high-bandwidth memory in a single advanced substrate stack for hyperscale and HPC customers.
AS
2026-06-16
www.moomoo.com
2026-06-16
Moomoo
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2026-06-16
finance.yahoo.com
2026-06-16
Yahoo Finance
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Rapidus Signs MoU with Fondazione Chips-IT in Italy for Future Semiconductor Manufacturing
PR Newswire
Mon, June 15, 2026 at 6:00 PM PDT 3 min read
New collaboration provides framework between the Japan government and Italy
TOKYO, June 15, 2026 /PRNewswire/ -- Rapidus Corporation today announced that
2026-06-16
tomshardware.com
2026-06-16
Zhiye Liu
Our RAM benchmark hierarchy ranks DDR5 and DDR4 memory kits of all frequencies and capacities for any budget.
2026-06-16
digitimes.com
2026-06-16
Austria's AT&S plans to invest up to EUR2 billion (approx. US$2.32 billion) to expand its Kulim plant and a previously unused building at the second site in Kulim, Malaysia, as part of a broader push to capitalize on AI demand. The company said the investments will be fully supported and financed by long-term customer commitments, and it expects to represent at least five leading US tech partners.
2026-06-16
digitimes.com
2026-06-16
Nvidia launched a sale of US$25 billion worth of high-grade bonds on June 15, ultimately garnering up to US$85 billion in orders, or more than triple the bond's original size. This is one of several debt offerings this year from tech giants, which are responding to investor excitement and a need for cash to capitalize on the AI boom.
2026-06-16
digitimes.com
2026-06-16
Nvidia's dominance in AI is extending beyond model training and deeper into inference—the fast-growing segment of the AI market responsible for running deployed models and generating revenue.
2026-06-16
digitimes.com
2026-06-16
ASML, TSMC, and imec have demonstrated a major advance in the effort to bring two-dimensional (2D) semiconductor materials from research laboratories into high-volume semiconductor manufacturing. At the 2026 IEEE/JSAP Symposium on VLSI Technology and Circuits, the partners unveiled a 300mm wafer integration flow that produced both n-type and p-type 2D-material transistors at a 50nm contacted poly