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1944 articles
Trending Companies
NVIDIA222 Micron Technology98 TSMC79 SK Hynix72 Samsung54 Micron51 Infineon45 Microsoft42 Apple39 Intel29 AMD26 Meta24 Google23 Applied Materials23 Samsung Electronics21
Trending Technologies
EUV178 3nm153 AI84 AI chips76 DRAM68 HBM66 GPU62 memory chips47 AI infrastructure23 semiconductor22 NAND flash21 data center17 2nm16 AI data centers15 chip manufacturing14
2026-07-07
Overseas Research Selection | JPMorgan: AI and Memory Price Increases Converge, Global Semiconductor Revenue Could Exceed $1.5 Trillion by 2026 - Moomoo
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www.moomoo.com 2026-07-07 Moomoo
2026-07-07
Pre-market Movement | Texas Instruments Raises Prices on Power Management Chips and More - 富途牛牛
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news.futunn.com 2026-07-07 富途牛牛
2026-07-07
Navitas Semiconductor (NVTS) Could Be 87% Above Fair Value As Index Exits Rattle Investors - simplywall.st
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simplywall.st 2026-07-07 simplywall.st
2026-07-07
UK gives data centers option to apply for 'national importance' status that overrides local regulations, cuts timeline by a year
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tomshardware.com 2026-07-07 Jowi Morales
Local opposition has caused massive delays for data centers in the U.S.
Data CentersUK PolicyNationally Significant Infrastructure ProjectsLocal Planning RegulationsInfrastructure DevelopmentAI Data CentersRegulatory ReformPlanning Efficiency
2026-07-07
Lattice Semiconductor (LSCC) Could Be 7% Undervalued Following Russell Value Index Removal - simplywall.st
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simplywall.st 2026-07-07 simplywall.st
2026-07-07
Stocks making the biggest moves premarket: Fiserv, Crinetics Pharmaceuticals, Micron & more - CNBC
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www.cnbc.com 2026-07-07 CNBC
2026-07-07
Kioxia and Sandisk sample world's densest 3D NAND
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tomshardware.com 2026-07-07 Anton Shilov
Kioxia, Sandisk begin to sample BiCS10 3D NAND: 332 active layers and over 29 Gb/mm2 areal capacity.
3D NANDflash memorystorage densitydata centersemiconductorNAND flashKioxiaSanDisk
2026-07-07
Modder builds 8,192-core GPU at home out of RISC-V microcontrollers — full "graphics card" draws over 2,000 watts of power, requires a 3D printer to program - Tom's Hardware
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www.tomshardware.com 2026-07-07 Tom's Hardware
2026-07-07
MU, SNDK, DRAM Dip Overnight As Memory Stocks Feel Weight Of Samsung’s Post-Earnings Selloff - Yahoo Finance
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finance.yahoo.com 2026-07-07 Yahoo Finance
2026-07-07
Ultra-pure gases for HBM chips: Air Liquide invests over 170 million USD in Indiana - chemeurope.com
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www.chemeurope.com 2026-07-07 chemeurope.com
2026-07-07
TSMC's AI bottleneck spills demand across the semiconductor supply chain
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digitimes.com 2026-07-07
Nvidia and other artificial intelligence chipmakers are still facing shortages as TSMC's advanced-node and CoWoS packaging capacity remains tight, pushing demand into foundries, back-end assembly, testing, and overseas fabs. The strain is creating spillover opportunities across the broader semiconductor supply chain, while also exposing how dependent the market has become on limited high-end capac
2026-07-07
Broadcom and Apple extend custom chip deal through 2031
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digitimes.com 2026-07-07
Broadcom has extended its custom chip supply agreement with Apple through 2031, strengthening a key supplier tie that could shape wireless connectivity, AI infrastructure, and device design for years. The move offers investors greater visibility, while global consumers may ultimately see faster, more integrated Apple hardware and network performance.
2026-07-07
Ingenic says DRAM foundry capacity strain won't ease until 2H27
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digitimes.com 2026-07-07
China memory makers are diverging in their outlook as AI demand keeps the global memory market tight. After GigaDevice recently issued an unusual risk warning, Beijing-based special memory and embedded processor maker Ingenic said global DRAM foundry capacity remains broadly constrained and is unlikely to improve before the second half of 2027.
2026-07-07
Unimicron prices US$1.355 billion overseas depositary receipt offering
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digitimes.com 2026-07-07
Unimicron Technology has priced a large overseas depositary receipt sale that could affect global investors monitoring Taiwan's electronics supply chain and semiconductor-related financing trends. The deal, which will fund foreign-currency purchases, is expected to reduce interest costs and strengthen the company's balance sheet, with potential benefits for shareholders worldwide.
2026-07-07
Lenovo confirms YMTC SSDs in notebooks sold outside China
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digitimes.com 2026-07-07
Lenovo confirmed that some notebooks sold outside China now use solid-state drives from Yangtze Memory Technologies Co. (YMTC), marking the first known appearance of the Chinese memory maker's SSDs in an overseas Lenovo model. The move comes as global PC makers face tighter NAND flash supply and higher prices.
2026-07-07
Texas emerges as frontrunner for Taiwan firms racing to pick an overseas science park
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digitimes.com 2026-07-07
Amid ever-shifting geopolitical concerns and a US$50 billion injection from the CHIPS and Science Act to revitalize domestic semiconductor production, a new round of competition has arisen across the US to attract investment. For Taiwan's electronics sector, the question is no longer whether to invest in the US, but which state to choose.
2026-07-07
Exclusive: Geckos bets on AI materials beyond nano copper powders and CPO waveguides
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digitimes.com 2026-07-07
As generative AI drives rapid growth in high-performance computing (HPC) demand, the semiconductor industry is shifting from process-node competition to materials competition. Geckos chairman Raymond Shen said that once chip manufacturing advances to 2nm and beyond, improvements in AI computing power are no longer just a chip-design issue, but are increasingly constrained by materials' heat dissip
2026-07-07
Zhen Ding 2H26 outlook brightens on server and optical demand
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digitimes.com 2026-07-07
PCB maker Zhen Ding said June revenue climbed to a fresh 2026 high, extending strong year-over-year growth as demand for AI-related high-end applications continued to build.
2026-07-07
Japanese startup completes AI chip validation with Oppstar and UMC support, moves toward mass production
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digitimes.com 2026-07-07
Tokyo Artisan Intelligence said it has finished validating its Sting Ray test chip, a step that could broaden access to lower-power edge AI hardware for industries worldwide. The milestone highlights how startups and foundries are pushing specialized chips that may ease energy pressure from AI, even as they support real-time applications in factories, transport, and infrastructure.
2026-07-07
Multi-die Testing In The Field Must Build On Established Test Methodologies
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semiengineering.com 2026-07-07 Laura Peters
Having a device that works at time zero is no longer a guarantee of reliability over it...
Multi-chip system testingIn-field testingSilicon agingAI acceleratorsData center hardwareAutomotive electronics2.5D integration3D-IC