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Production-ready 3DI technology supports more compact FEMs for advanced 5G devices MALTA, N.Y., June 23, 2026 (GLOBE NEWSWIRE) -- GlobalFoundries (Nasdaq: GFS) (GF) today announced the production readiness of its SLATE™ wafer-to-wafer bonding technology on its industry-leading 9SW radio-frequency silicon-on-insulator (RF-SOI) platform, delivering advanced 3D integration (3DI) for compact, high-pe

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The race to commercialize glass core substrates in advanced semiconductor packaging is heating up — but the technology is moving faster in headlines than in production lines. DIGITIMEShas been tracking the latest developments in TSMC's CoPoS advanced packaging technology, with glass core substrates emerging as the most closely watched variable in that story.

TSMC is collaborating with Ibiden and Innolux to validate glass substrates for its new CoPoS advanced packaging technology. This shift from wafer-level to panel-level processing aims to overcome limitations of traditional organic and silicon interposers. Simulation results indicate glass substrates offer significant improvements in warpage, thermal expansion, elastic modulus, power integrity, and

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USI Showcases Advanced SiC Chip-Embedded Packaging Technology at PCIM Europe 2026 Deutschland - English VOM NACHRICHTENDIENST USI 27 Mai, 2026, 05:00 GMT ARTIKEL TEILEN ~ Enabling Next-Generation Power Solutions ~ SHANGHAI, May 27, 2026 /PRNewswire/ -- USI, a global leader in electronic design and manufacturing services, today announced a breakthrough in advanced power semiconductor pa

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~ Enabling Next-Generation Power Solutions ~ SHANGHAI, May 27, 2026 /PRNewswire/ -- USI, a global leader in electronic design and manufacturing services, today announced a breakthrough in advanced power semiconductor packaging technology designed for next-generation power solutions. Leveraging its innovative substrate and module integration capabilities, USI has successfully embedded silicon carb

USI Showcases Advanced SiC Chip-Embedded Packaging Technology at PCIM Europe 2026 APAC - English NEWS PROVIDED BY USI 27 May, 2026, 07:00 CST SHARE THIS ARTICLE ~ Enabling Next-Generation Power Solutions ~ SHANGHAI, May 27, 2026 /PRNewswire/ -- USI, a global leader in electronic design and manufacturing services, today announced a breakthrough in advanced power semiconductor packaging

~ Enabling Next-Generation Power Solutions ~ SHANGHAI, May 27, 2026 /PRNewswire/ -- USI, a global leader in electronic design and manufacturing services, today announced a breakthrough in advanced power semiconductor packaging technology designed for next-generation power solutions. Leveraging its innovative substrate and module integration capabilities, USI has successfully embedded silicon carb

Huawei is using self-developed packaging technology to build ultra-high-capacity enterprise SSDs, underscoring how Chinese technology companies are increasingly turning to advanced packaging and system-level engineering to navigate US semiconductor restrictions.