Semiconductor News & Analysis Feed
163 articles
2026-06-04
news.arizona.edu
2026-06-04
University of Arizona News
U of A joins national semiconductor workforce training hub
College of Engineering and the Arizona Commerce Authority
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Mark Van Dyke (far right), associate dean of research in the College of Engineering and professor of biomedical engineering, represents the University of Arizona at the NNME Southwest Node press conference on May 27.
The University o
2026-06-03
www.foreignpolicyjournal.com
2026-06-03
foreignpolicyjournal.com
Nvidia’s (NASDAQ: NVDA) launch of its RTX Spark AI PC superchip targeting Windows on Arm has raised fresh concerns about competitive pressure on Qualcomm’s (NASDAQ: QCOM) Snapdragon X processors.
The launch came in late May and early June 2026, coinciding with Qualcomm’s introduction of its Dragonfly AI data-center brand and the company’s broader push to highlight its AI ambitions.
Rep. McCaul:
2026-06-03
tomshardware.com
2026-06-03
Sarah Jacobsson Purewal
Corsair launched its HS35 v3 lightweight gaming headsets — wired and wireless — at Computex 2026.
2026-06-02
www.koreaherald.com
2026-06-02
The Korea Herald
Parents and students attend an admissions information session at the Korea Semiconductor Meister High School in Gyeongju, North Gyeongsang Province, in October 2025. (Korea Semiconductor Meister High School)
Admission to a prestigious university is no longer seen as the only path to success for some students in South Korea, as semiconductor-focused high schools gain popularity on the expectation
2026-06-02
thequantuminsider.com
2026-06-02
The Quantum Insider
PRESS RELEASE — Researchers led by Illinois Grainger Engineering professor Qing Cao have demonstrated a scalable way to directly and sequentially stack high-performance silicon circuits. This advance marks a critical step toward realizing the full potential of three-dimensional chips that could carry computing beyond the limits of traditional scaling.
For more than half a century, the power of co
2026-06-01
eetimes.com
2026-06-01
The demand for more efficient power solutions continues to put pressure on designers to optimize system design without compromising performance. Read how you can simplify high-voltage power conversion and reduce system cost, size and complexity for a range of demanding applications with GaN BDS. High-voltage GaN bi-directional switches enable implementation of single-stage power converters with […
2026-06-01
eetimes.com
2026-06-01
The Japanese litho firm is lowering the price of its ArF tools while also launching a brand-new immersion platform by 2028.
2026-06-01
tomshardware.com
2026-06-01
Luke James
A University of Toronto experiment showing that photons can spend a negative amount of time inside a cloud of atoms has been published in Physical Review Letters.
2026-05-30
www.investors.com
2026-05-30
Investor's Business Daily
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2026-05-30
seekingalpha.com
2026-05-30
Seeking Alpha
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2026-05-29
tomshardware.com
2026-05-29
Mark Tyson
An IBM ThinkPad user boasts that they can install '(almost) all versions of Windows from NT 4 to 10 22H2' with driver support, without resorting to virtual machine (VM) technology.
2026-05-29
www.semafor.com
2026-05-29
Semafor
Nvidia CEO Jensen Huang is set to join the advisory board of an elite Chinese university, which counts Tim Cook, Elon Musk, and Mark Zuckerberg among its 65 members, the Financial Times reported.
The board at the Tsinghua University School of Economics and Management, which also includes the heads of JPMorgan and BlackRock, is a rare forum uniting corporate and academic leaders from the US and Ch
2026-05-28
www.purdue.edu
2026-05-28
Purdue University
Purdue, GCCS partner to scale the future of silicon carbide
Joint initiative targets critical thermal and power bottlenecks in global AI infrastructure
Dan DeLaurentis, Purdue’s executive vice president for research, left, and Kuan-Ming Hsiung, GeChi Compound Semiconductor Co. chairman of the board, signed a research memorandum of understanding at Hovde Hall. The agreement will strengthen collab
2026-05-28
www.tomshardware.com
2026-05-28
Tom's Hardware
Tech Industry Manufacturing Semiconductors
Chinese university builds 3D chip design tool tailored to Huawei's ‘LogicFolding’ architecture — 3D design delivers increased performance and better thermal management
News
By Luke James published 20 minutes ago
China now has a prototype tool designed for vertical circuit stacking.
(Image credit: Getty Images)
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2026-05-28
tomshardware.com
2026-05-28
Luke James
The announcement came two days after Huawei presented LogicFolding and its accompanying Tau Scaling Law at ISCAS 2026.
2026-05-28
news.google.com
2026-05-28
Seeking Alpha
2026-05-28
www.digitimes.com
2026-05-28
digitimes
Peking University researchers have unveiled a prototype electronic design automation (EDA) tool built for "true-3D" chip design, offering a potential missing link for Huawei's LogicFolding architecture and its broader Tau (τ) Scaling Law roadmap.
Some subscribers prefer to save their log-in information so they do not have to enter their User ID and Password each time they visit the
2026-05-28
www.digitimes.com
2026-05-28
digitimes
Peking University researchers have unveiled a prototype electronic design automation (EDA) tool built for "true-3D" chip design, offering a potential missing link for Huawei's LogicFolding architecture and its broader Tau (τ) Scaling Law roadmap.
Some subscribers prefer to save their log-in information so they do not have to enter their User ID and Password each time they visit the
2026-05-28
news.google.com
2026-05-28
Reuters
2026-05-28
finance.yahoo.com
2026-05-28
Yahoo Finance
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