Semiconductor News & Analysis Feed
25409 articles
2026-06-25
digitimes.com
2026-06-25
As demand for AI chips surges, the battle for foundry orders is heating up. South Korean industry sources say the next 2-3 years will be a critical period for Samsung Electronics' foundry business, with its 2028 turnaround target hinging on stable operations at the Taylor plant and landing major orders.
2026-06-25
digitimes.com
2026-06-25
Rising demand for AI server builds is tightening the global supply of high-end MLCCs, driving steep price increases in China's electronics distribution market and exposing how quickly infrastructure demand can affect component costs worldwide. The rally underscores a structural mismatch that could keep pressure on buyers across technology supply chains for years, according to industry sources.
2026-06-25
digitimes.com
2026-06-25
JCET Group is accelerating its AI chip packaging expansion with a CNY7.8 billion (US$1.1 billion) investment in a new advanced packaging and testing plant in Shanghai Lingang, strengthening capacity for AI computing, high-performance chips, high-density memory and automotive electronics.
2026-06-25
digitimes.com
2026-06-25
Optical lens manufacturer Calin Technology stated at its shareholders' meeting on June 24 that global market growth has been weakened by economic volatility and US tariff policies. It reported consolidated revenue of NT$1.02 billion (approx. US$32 million) in 2025 and a net loss after tax of NT$261 million. Although profitability fell short of expectations due to production volumes remaining below
2026-06-25
digitimes.com
2026-06-25
Global helium supply is under renewed strain. Nippon Sanso, Japan's largest industrial gas supplier, announced it will raise prices across its helium product line by an average of more than 30% starting July 2026, citing persistent tightness in global supply driven in part by rising geopolitical risks in the Middle East.
2026-06-25
digitimes.com
2026-06-25
OpenAI on June 24 unveiled "Jalapeño," its first in-house AI accelerator, co-developed with Broadcom and manufactured by TSMC — the clearest sign yet that leading model developers want to design their own chips and broaden a supply chain long dominated by Nvidia.
2026-06-25
semiengineering.com
2026-06-25
Liz Allan
Physical I/Os can be a chokepoint for high-performance chips and high-speed interconnec...
2026-06-25
digitimes.com
2026-06-25
AI chipmaker SambaNova could raise between US$800 million and US$1 billion in a new funding round, according to its executive chairman and Intel CEO Lip-Bu Tan. This would raise SambaNova's value to US$10 billion as increasing inferential AI workloads spur a search for alternatives to Nvidia's expensive GPUs.
2026-06-25
digitimes.com
2026-06-25
Kioxia is preparing to enter the US capital market through American depositary shares (ADS) in the first quarter of fiscal 2027, just as its latest annual report points to accelerating demand for NAND flash memory, SSDs and next-generation storage used in AI and consumer electronics.
2026-06-25
digitimes.com
2026-06-25
IC design firms are scrambling to expand their partner networks as tight packaging and testing capacity remain the most pressing bottleneck in the supply chain. Companies in Taiwan, Europe, and the US say the shortage is worse than expected, pushing packaging, testing, and related materials into broader supply constraints.
2026-06-25
digitimes.com
2026-06-25
The European Commission has given the green light to a EUR76 million (approx. US$86.3 million) German subsidy supporting QuantumDiamonds' plan to build a new semiconductor testing equipment facility in Munich, the Commission announced. The approval is the latest step in Brussels' push to reduce Europe's reliance on foreign chip technology and strengthen its industrial autonomy.
2026-06-25
digitimes.com
2026-06-25
Sigurd is expanding testing and packaging capacity as AI demand and steady customer orders keep its facilities fully utilized. For global readers, the move underscores how supply chains for silicon photonics (SiPh), AI servers, and advanced chips are tightening, while new capacity is expected to ease bottlenecks and shape revenue growth in 2026 and 2027.
2026-06-25
semiengineering.com
2026-06-25
Brian Bailey
Engineers are flooded with new capabilities. The problem now is how best to deploy them.
2026-06-25
digitimes.com
2026-06-25
ASE Holdings COO Dr Tien Wu said the global semiconductor industry is growing faster than expected on the back of AI investment, with demand so strong that the capacity the company had built over the past few years was absorbed almost immediately.
2026-06-25
digitimes.com
2026-06-25
Samsung Electronics chairman Lee Jae-yong visited the company's Cheonan plant on June 23 to review high-bandwidth memory production operations, as cumulative revenue from the company's latest HBM generation has crossed the US$1 billion mark and demand tied to AI chips continues to rise.
2026-06-25
digitimes.com
2026-06-25
Hua Hong Grace Semiconductor (HHGrace) is seeing gains from both process technology and capacity expansion, with industry research showing its 40nm ultra-low-power specialty process has entered stable mass production while its Wuxi 12-inch line continues to ramp.
2026-06-25
digitimes.com
2026-06-25
Co-packaged optics (CPO) is rapidly emerging as a foundational architecture for next-generation AI infrastructure. With Nvidia's latest Scale-Up CPO switch roadmap now taking shape, bandwidth per AI rack is set to increase from approximately 130 TB/s in the Blackwell generation to more than 1 PB/s in the Feynman era, spanning Blackwell, Rubin, Rubin Ultra, and Feynman platforms. As a result, the g
2026-06-25
digitimes.com
2026-06-25
ADATA Technology is stepping up discussions in Thailand amid rising global demand for AI computing centers. Chairman Simon Chen's visit highlights how Southeast Asia could benefit from expanding AI infrastructure, supporting industrial policy, and strengthening regional cooperation. The company sees Thailand as a possible hub for future growth and technology investment.
2026-06-25
digitimes.com
2026-06-25
The global semiconductor packaging and testing race is heating up as TSMC recently signed a 10-year agreement with Amkor to expand advanced packaging collaboration in Arizona, drawing close market attention to how the rivalry with ASE and Amkor will reshape market share. ASE Chief Operating Officer Tien Wu said he is "optimistic," stating that strong demand from US customers and the need to divers
2026-06-25
semiengineering.com
2026-06-25
Ed Sperling
Can engineers trust AI to get everything right in semiconductor design and verification?