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Chinese semiconductor manufacturer CXMT is pursuing customized DRAM technology as a strategic move to circumvent U.S. sanctions on HBM manufacturing tools. While the U.S. restrictions hinder CXMT's access to critical HBM equipment, the company is leveraging 3D memory and 3D Integrated Circuits (3D I

DRAM HBM Semiconductor Sanctions CXMT Custom Memory 3D Memory 3D IC AI Memory

DeepSeek Wants to Bypass US Sanctions With a Custom Chip. Why Nvidia Stock Is Sliding. - Barron's

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www.barrons.com 2026-07-07

Chinese fab SMIC's 7nm metal pitch beats Intel 18A but lags 38% on density, teardown finds — Huawei's sanctions-beating HiSilicon Kirin 9030 is the first subject of SemiAnalysis's new teardown lab

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tomshardware.com 2026-06-16

SMIC's third-generation 7nm process achieves a metal pitch of 32.5nm, surpassing Intel's 18A node at 36nm, but overall transistor density lags by 38%. This finding comes from SemiAnalysis's first teardown from its new in-house lab, analyzing the HiSilicon Kirin 9030 chip found in Huawei's Mate 80. D

SMIC Huawei Kirin 9030 Semiconductor Process 7nm Node Metal Pitch Intel 18A Chip Teardown

Taiwan's Eris expects order surge after sanctions on Chinese competitor

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digitimes.com 2026-06-14

The global power semiconductor supply chain is undergoing another reshuffling, following disruptions caused by Chinese chipmaker Nexperia in 2025 and more recently, the inclusion of China's Yangjie Technology on the European Union sanctions list. This series of events reflects the profound changes i

Power semiconductor Supply chain reshuffling US-China tech rivalry EU sanctions Semiconductor supply chain Chip manufacturing Taiwan semiconductor International sanctions

How EU Sanctions Are Jeopardizing Two Key Semiconductor Suppliers - Z2Data

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www.z2data.com 2026-06-06

The European Union's recent sanctions against Russia have placed Chinese semiconductor manufacturer Yangzhou Yangjie Electronic and its U.S. subsidiary Micro Commercial Components (MCC) under scrutiny. According to EU Regulation No. 269/2014, Yangjie is accused of supplying components to Russia in v

EU Sanctions Semiconductor Supply Chain Yangzhou Yangjie Micro Commercial Components Automotive Semiconductors Supply Chain Risk Chip Manufacturing Trade Compliance

China’s response to U.S. sanctions: Building independent chip market - trend.az

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www.trend.az 2026-05-31

Chinese semiconductor giant CXMT (Changxin Memory Technologies) has received approval from the Shanghai Stock Exchange for a major share issuance, aiming to raise at least $4.3 billion, potentially exceeding $5 billion if demand is high. This marks the largest IPO in China in the past four years, wi

Semiconductor Industry Chip Shortage China Tech Development DRAM Market AI Chips US-China Trade War Domestic Substitution High Bandwidth Memory

Analysis-Huawei bets on speed over shrinking transistors to sidestep US chip sanctions - WKZO

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wkzo.com 2026-05-29

Facing U.S. sanctions that block access to ASML's most advanced EUV lithography machines, Huawei has proposed a new chip design principle focused on improving signal transmission speed rather than shrinking transistors. This approach, termed the Tau Scaling Law, relies on a core technique called Log

Huawei Chip Design US Sanctions Semiconductor Industry 3D Stacking LogicFolding TSMC NVIDIA

Analysis-Huawei bets on speed over shrinking transistors to sidestep US chip sanctions - WTVB

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wtvbam.com 2026-05-29

Facing U.S. sanctions that block access to ASML's most advanced EUV lithography machines, Huawei has proposed a new chip design principle focused on increasing signal transmission speed rather than shrinking transistors. This approach, known as the Tau Scaling Law and implemented through a technique

Huawei Chip Design US Sanctions Semiconductor Industry 3D Stacking Logic Folding TSMC NVIDIA

Huawei bets on speed over shrinking transistors to sidestep US chip sanctions - Reuters

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www.reuters.com 2026-05-29

Huawei unveils new chip design strategy to work around US sanctions - Tech Edition

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www.techedt.com 2026-05-29

Huawei has unveiled a new chip design strategy aimed at overcoming the impact of long-standing US sanctions and enhancing processor performance. The approach, based on the 'Tau Scaling Law' and supported by the 'LogicFolding' architecture, focuses on optimizing data flow within chips rather than sol

Huawei Chip Design US Sanctions Semiconductor Industry Technological Independence AI Chips Manufacturing Process TSMC

Huawei announces new chip design strategy to bypass US sanctions - HardwareZone

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www.hardwarezone.com.sg 2026-05-28

Six years after being cut off from leading overseas chip manufacturers, Huawei has unveiled a new chip design strategy aimed at bypassing U.S. sanctions and achieving transistor density levels comparable to 1.4nm-class chips. Central to this approach is the 'Tau Scaling Law,' which shifts focus from

Huawei Chip Design US Sanctions Semiconductor Tau Scaling Law LogicFolding Kirin Chip Ascend Chip

Cut Off From EUV By US Sanctions, Huawei Is Redefining Moore’s Law Itself — And A Top Chip Analyst Isn’t Buying It - Wccftech

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wccftech.com 2026-05-27

Following Huawei's recent announcement of its Tau scaling technology, which claims to achieve transistor density comparable to 14 Angstrom (14A) manufacturing processes from leading chipmakers like TSMC and Intel, semiconductor analyst Dr. Ian Cutress has expressed skepticism. He argues that the ann

Huawei EUV Lithography Semiconductor Sanctions Moore's Law Chip Manufacturing Tau Scaling Technology TSMC Chip Analyst

Cut Off From EUV By US Sanctions, Huawei Is Redefining Moore's Law Itself — And A Top Chip Analyst Isn't Buying It - Wccftech

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wccftech.com 2026-05-27

Following Huawei's recent announcement of its Tau scaling technology, which claims to achieve transistor density comparable to 14 Angstrom (14A) manufacturing processes from leading chipmakers like TSMC and Intel, semiconductor analyst Dr. Ian Cutress质疑了该声明的客观性. He argues that Huawei's announcement

Huawei EUV lithography Moore's Law Semiconductor manufacturing Chip industry Technology breakthrough AI technology Supply chain restrictions

Huawei touts chip design breakthrough as answer to US sanctions - Light Reading

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www.lightreading.com 2026-05-26

Facing US sanctions, Huawei has unveiled a new chip design breakthrough aimed at circumventing restrictions on advanced manufacturing technologies. The approach, termed 'time scaling' and 'LogicFolding,' involves constructing three-dimensional circuitry rather than traditional two-dimensional layout

Huawei US Sanctions Semiconductor Chip Design 3nm EUV Lithography TSMC SMIC

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