Semiconductor News & Analysis Feed
349 articles
2026-06-04
www.gurufocus.com
2026-06-04
GuruFocus
On June 04, 2026, Mitsubishi Electric Corp MIELY announced plans to start shipping samples of its new 5th-generation silicon carbide metal-oxide-semiconductor field-effect transistors (SiC-MOSFETs) in bare die form by late June. These components are engineered for inverters in electric vehicles, plug-in hybrids, and other electrified vehicles. The new transistors boast a low on-resistance that is
2026-06-04
www.01net.it
2026-06-04
01net
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2026-06-04
biz.chosun.com
2026-06-04
Chosunbiz
By
Lee Ho-jun
Published 2026.06.04. 14:33
/Courtesy of GLOBALFOUNDRIES Inc.
GLOBALFOUNDRIES Inc. said on the 4th that it completed the acquisition of Synopsys's ARC processor IP business unit on the 2nd (local time). The acquired business unit will be integrated into GLOBALFOUNDRIES Inc.'s subsidiary MIPS.
GLOBALFOUNDRIES Inc. said the acquisition allows it to complete a physical artificial int
2026-06-04
www.automotiveworld.com
2026-06-04
Automotive World
Silicon carbide is emerging as a primary performance arena for xEV inverter suppliers, with on-resistance now tied to vehicle range
June 4, 2026
Mitsubishi Electric will begin shipping samples of fifth-generation silicon carbide metal-oxide-semiconductor field-effect transistors (SiC-MOSFETs) in bare die form from late June. The devices target inverters for drive motors and eAxles in electrified
2026-06-04
www.moomoo.com
2026-06-04
Moomoo
消息面上，随着英伟达等AI芯片功耗飙升，传统硅基电源架构已触及物理极限。行业正加速向800V高压直流(HVDC)架构过渡，碳化硅成为AI服务器固态变压器及电源管理的必选材料。英飞凌、意法半导体等巨头明确表示，AI数据中心的部署导致多款功率器件出现严重供应短缺。
公开资料显示，天岳先进在8英寸碳化硅衬底领域占据全球领先份额，12英寸完成样品研发、送样、小批量试样供货。据悉，天岳先进的12英寸SiC衬底进入台积电供应链验证阶段，作为下一代CoWoS中介层备选方案开展送样测试。用作替代硅中介层以解决高性能GPU的散热瓶颈。
Tianyue Advanced Materials (02631.HK) rose nearly 7% in early trading. As of the time of writing, it was up 3.27% at HK$104.1, with a tr
2026-06-04
news.futunn.com
2026-06-04
富途牛牛
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2026-06-04
markets.financialcontent.com
2026-06-04
FinancialContent
Mitsubishi Electric to Ship 5th-generation SiC-MOSFET Bare Die Samples
By:
Mitsubishi Electric Corporation
via
Business Wire
June 03, 2026 at 23:00 PM EDT
ⓘ This article is third-party content and does not represent the views of this site. We make no guarantees regarding its accuracy or completeness.
Industry-leading low on-resistance, approx. 25% less than existing products, enhances xEV power e
2026-06-04
www.daily-tribune.com
2026-06-04
The Daily Tribune News
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Mitsubishi Electric to Ship 5th-generation SiC-MOSFET Bare Die Samples
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Mitsubishi Electric Corporation (TOKYO: 6503) ann
2026-06-04
news.google.com
2026-06-04
Business Wire
2026-06-04
www.digitimes.com
2026-06-04
digitimes
China's silicon carbide (SiC) substrate manufacturers continue to slash prices despite already operating on razor-thin margins, underscoring the intensity of a price war reshaping the global compound semiconductor industry.
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2026-06-04
www.tradingview.com
2026-06-04
TradingView
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2026-06-04
www.tradingview.com
2026-06-04
TradingView
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2026-06-04
news.google.com
2026-06-04
EE Times Asia
2026-06-04
news.google.com
2026-06-04
GlobeNewswire
2026-06-04
www.01net.it
2026-06-04
01net
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2026-06-04
www.bgr.com
2026-06-04
bgr.com
Technology
Artificial Intelligence
Nvidia Partnered With A Chinese Company To Build A 'Physical AI' Humanoid Robot
By Sead Fadilpasic June 3, 2026 12:17 pm EST
Nvidia
Nvidia has entered the humanoid robotics race. Through a partnership with Chinese startup Unitree, the U.S. chipmaker is developing a robotics system with an integrated reference design focused on academic research. The idea is to
2026-06-03
tomshardware.com
2026-06-03
Luke James
Samsung displayed its first physical mockup of HBM5 memory at Computex 2026 in Taipei, pairing the eighth-generation AI memory with a new in-package cooling structure.
2026-06-03
blogs.nvidia.com
2026-06-03
NVIDIA Blog
NVIDIA Enables the Next Era Of Physical AI Research With Agent Skills For Autonomous Vehicles, Robotics And Vision AI
New physical AI agent skills, powered by NVIDIA Cosmos 3, help researchers accelerate data generation, simulation, policy training and evaluation for autonomous system development.
June 3, 2026 by Pranjali Joshi
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At CVPR, NVIDIA is unveiling new physical AI agent skills t
2026-06-03
www.standard-journal.com
2026-06-03
standard-journal.com
AP
JEDEC® Releases New SiC Guidelines to Improve Reliability and Evaluation in Power Electronics
Business Wire 9 hrs ago 0
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ARLINGTON, Va.--(BUSINESS WIRE)--Jun 3, 2026--
JEDEC Solid State Technology Association, the global leader in standards development for the microelectronics industry, announced the publication of JEP
2026-06-03
uk.finance.yahoo.com
2026-06-03
Yahoo Finance UK
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