Semiconductor News & Analysis Feed
5979 articles
2026-06-15
www.techtimes.com
2026-06-15
Tech Times
By Allen Lee
Published: Jun 14 2026, 20:45 PM EDT
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The TSMC logo is displayed at the Taiwan Semiconductor Manufacturing Company branch and Innovation Museum, highlighting the company branding and signage inside and outside the site in Hsinchu, Taiwan, January 27, 2026. JIMMY BEUNARDEAU/GETTY IMA
2026-06-15
www.techtimes.com
2026-06-15
Tech Times
By Allen Lee
Published: Jun 14 2026, 20:45 PM EDT
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A photo taken on May 19, 2026 shows the US multinational technology and Internet-related services company Google displayed on a smartphone (bottom) in front of the Google's logo on a laptop screen in Frankfurt am Main, western Germany. KIRILL KU
2026-06-15
www.techtimes.com
2026-06-15
Tech Times
By Allen Lee
Published: Jun 14 2026, 20:42 PM EDT
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Tower cranes are seen at the construction site of the Samsung Electronics factory in Pyeongtaek on May 28, 2026. SHIN YONG-JU/AFP VIA GETTY IMAGES
Samsung Electronics expects its foundry business to return to annual profitability in 2028 — late
2026-06-15
www.techtimes.com
2026-06-15
Tech Times
By Allen Lee
Published: Jun 14 2026, 20:42 PM EDT
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Tower cranes are seen at the construction site of the Samsung Electronics factory in Pyeongtaek on May 28, 2026. SHIN YONG-JU/AFP VIA GETTY IMAGES
Samsung Electronics expects its foundry business to return to annual profitability in 2028 — late
2026-06-15
news.google.com
2026-06-15
Tech Times
2026-06-15
www.indexbox.io
2026-06-15
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2026-06-15
digitimes.com
2026-06-15
Google's push to diversify its Tensor Processing Units (TPUs) supply chain is increasingly reaching into the foundry side, adding pressure on ASIC makers such as MediaTek. Recent reports indicate that Google is not only set to adopt Intel's embedded multi-die interconnect bridge (EMIB) packaging for its next-generation product, but is also planning to bring in Samsung Electronics for front-end waf
2026-06-15
digitimes.com
2026-06-15
Taiwan's listed semiconductor and electronics companies posted robust revenue growth in May 2026, with the latest monthly data revealing a widening split between AI infrastructure beneficiaries and legacy consumer electronics players. The five-month cumulative picture through May underscores a structural reordering of the sector's top earners, led by server and AI hardware demand.
2026-06-15
digitimes.com
2026-06-15
Tsang Yow is preparing to broaden its manufacturing footprint in Malaysia, a move that could help global semiconductor supply chains become more regional, resilient, and tariff-proof. The drivetrain systems maker expects trial production at the new plant before the end of 2026, as demand tied to artificial intelligence and advanced chips reshapes sourcing patterns worldwide.
2026-06-15
digitimes.com
2026-06-15
China has allowed the release of a fresh supply of indium phosphide (InP) substrates, which are under export controls. A first 2026 batch shipped at the end of May following an earlier release in 2025, easing a capacity bottleneck in the optical communications market. Taiwanese compound semiconductor suppliers including Visual Photonics Epitaxy (VPEC) and Global Communication Semiconductors (GCS)
2026-06-15
digitimes.com
2026-06-15
Taiwan-based UBright Optronics is accelerating its transformation from an LCD optical film specialist into a diversified technology supplier, expanding into semiconductor materials, passive components and smart acoustics. The new businesses are expected to begin generating revenue in 2026 as product certifications advance, but the company has not yet offered guidance on their revenue impact.
2026-06-15
digitimes.com
2026-06-15
Wus Printed Circuit is pressing ahead with an AI-driven transformation, with its chairman and president outlining plans to move toward profitability as demand builds across high-performance computing and emerging technology markets.
2026-06-15
digitimes.com
2026-06-15
South Korea's semiconductor equipment supply chain saw a material pickup in orders in the first half of 2026 as Samsung Electronics and SK Hynix accelerated investment in advanced DRAM and high-bandwidth memory (HBM4), generating demand across front-end tools, advanced packaging, and inspection equipment. The shift toward high-end process and packaging capabilities for AI memory has driven new con
2026-06-15
digitimes.com
2026-06-15
SK Hynix is bringing additional back-end equipment into its Cheongju P&T6 facility as it steps up mass-production preparations for HBM4, a move that underscores mounting pressure on advanced memory suppliers to keep pace with demand from AI infrastructure.
2026-06-15
digitimes.com
2026-06-15
LG Innotek plans to invest more than KRW1 trillion in a new semiconductor substrate plant in Haiphong, Vietnam, reflecting rising demand for substrates used in AI servers, 5G smartphones, and on-device AI chips. The expansion targets RF-SiP, FC-CSP, and FC-BGA substrates, as substrate suppliers adjust capacity plans to stronger demand from advanced mobile devices and AI infrastructure.
2026-06-15
digitimes.com
2026-06-15
Equipment maker Manz recently announced the successful delivery of the world's first 310mm x 310mm panel-level packaging (PLP) electrochemical deposition (ECD) mass-production tool, further expanding its footprint in advanced packaging process equipment and demonstrating integrated capabilities spanning in-house R&D, process and system integration, and mass-production deployment.
2026-06-15
digitimes.com
2026-06-15
India sees rising global tech investment as Meta, Reliance and Anthropic deepen AI ties, while EV firms expand, Starlink faces delays, and semiconductor and tablet markets show steady structural growth.
2026-06-15
digitimes.com
2026-06-15
Samsung Electronics' foundry division chief told employees on June 12 that a return to profitability in the contract chipmaking business looks difficult next year, with 2028 emerging as a more likely timeline, Yonhap, ZDNet Korea,and Chosunreported.
2026-06-15
digitimes.com
2026-06-15
Below are the most-read DIGITIMES Asiastories from the week of June 8-14, 2026:
2026-06-15
digitimes.com
2026-06-15
As global semiconductor supply chains are rebuilt, Southeast Asia is evolving from a back-end test-and-pack region into a resilient, multi-center advanced packaging and equipment ecosystem, according to industry participants. Migration drivers include pushes for local production and service, faster ramps for AI chip capacity, and customer demands for supply chain resilience amid de-Americanization