Semiconductor News & Analysis Feed
1206 articles
2026-06-26
finance.yahoo.com
2026-06-26
Yahoo Finance
Strong Earnings Demonstrate Taiwan Semiconductor Manufacturing Company Limited’s (TSM) Key Role in The AI-Capex Cycle
Soumya Eswaran
Thu, June 25, 2026 at 9:55 AM PDT 3 min read
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Janus Henderson Investors, an investment management company, released its first-quarter 2026 investor letter for the "Global Sustainable Equity Fund". A co
2026-06-26
www.androidauthority.com
2026-06-26
Android Authority
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Only a few years back, we were still looking forward to smartphone chips manufactured on a 2nm process as the next big thing. Fabrication advancements have now made 2nm chips a reality — so what’s next? Engineers have already been pushing the limits of physics for a while now, and although they’re probably going to come up
2026-06-25
www.investors.com
2026-06-25
Investor's Business Daily
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2026-06-25
finance.yahoo.com
2026-06-25
Yahoo Finance
What Makes Taiwan Semiconductor Manufacturing Company (TSM) One of the Best AI Chip Stock to Buy for the Long Term
Catherine Talavera
Wed, June 24, 2026 at 11:23 PM PDT 2 min read
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TSM
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Taiwan Semiconductor Manufacturing Company Ltd. (NYSE:TSM) is one of the 10 Best AI Chip Stocks to Buy for the Long Term. The stock jump
2026-06-25
www.digitimes.com
2026-06-25
digitimes
As demand for AI chips surges, the battle for foundry orders is heating up. South Korean industry sources say the next 2-3 years will be a critical period for Samsung Electronics' foundry business, with its 2028 turnaround target hinging on stable operations...
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2026-06-25
m.techflowpost.com
2026-06-25
深潮TechFlow
研报解读：台积电 2027 年 AI 收入将翻倍，CoWoS 产能仍是瓶颈
2026.06.25
- 昨天
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研报解读：台积电 2027 年 AI
收入将翻倍，CoWoS 产能…
即便台积电将 CoWoS 产能扩至每月 20 万片，仍可能满足不了全球 269 万片的需求缺口。
2026.06.25 - 11:48:07
台积电
AI
专注Web3行业深度报道，洞察潮水流动的方向
即便台积电将 CoWoS 产能扩至每月 20 万片，仍可能满足不了全球 269 万片的需求缺口。
作者：Rita
潮向导读
摩根士丹利于 6 月 23 日发布台积电供应链深度报告。核心判断：基于最新供应链调查，上调了对 2027 年全球 CoWoS 先进封装需求的预测，认为台积电 AI 相关收入 2027 年将达 863 亿美元，较
2026-06-25
digitimes.com
2026-06-25
As demand for AI chips surges, the battle for foundry orders is heating up. South Korean industry sources say the next 2-3 years will be a critical period for Samsung Electronics' foundry business, with its 2028 turnaround target hinging on stable operations at the Taylor plant and landing major orders.
2026-06-25
digitimes.com
2026-06-25
Co-packaged optics (CPO) is rapidly emerging as a foundational architecture for next-generation AI infrastructure. With Nvidia's latest Scale-Up CPO switch roadmap now taking shape, bandwidth per AI rack is set to increase from approximately 130 TB/s in the Blackwell generation to more than 1 PB/s in the Feynman era, spanning Blackwell, Rubin, Rubin Ultra, and Feynman platforms. As a result, the g
2026-06-25
digitimes.com
2026-06-25
The global semiconductor packaging and testing race is heating up as TSMC recently signed a 10-year agreement with Amkor to expand advanced packaging collaboration in Arizona, drawing close market attention to how the rivalry with ASE and Amkor will reshape market share. ASE Chief Operating Officer Tien Wu said he is "optimistic," stating that strong demand from US customers and the need to divers
2026-06-25
digitimes.com
2026-06-25
OpenAI on June 24 unveiled "Jalapeño," its first in-house AI accelerator, co-developed with Broadcom and manufactured by TSMC — the clearest sign yet that leading model developers want to design their own chips and broaden a supply chain long dominated by Nvidia.
2026-06-25
digitimes.com
2026-06-25
Qualcomm used its June 24 investor day to unveil a data center chip portfolio and a multi-generation CPU agreement with Meta, a strategic bid to diversify beyond a shrinking smartphone business and challenge Nvidia's dominance — while courting Chinese demand and leaning on manufacturing partner TSMC.
2026-06-24
www.tomshardware.com
2026-06-24
Tom's Hardware
Tech Industry Manufacturing Semiconductors
TSMC is reportedly hiking prices for 'all advanced nodes,' accounting for 74% of the company’s wafer business — Nvidia, AMD, Apple, Qualcomm, and others will face higher wafer costs
News
By Etiido Uko published 9 hours ago
Reported 5–10% price hikes remain lower than recent industry price spikes
(Image credit: Getty / Bloomberg)
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2026-06-24
tomshardware.com
2026-06-24
Etiido Uko
TSMC has reportedly told customers to prepare for 5% to 10% price hikes across advanced chip nodes, extending beyond 3nm to include 7nm and some legacy processes.
2026-06-24
simplywall.st
2026-06-24
simplywall.st
United States/Semiconductors/NYSE:TSM
TSMC (NYSE:TSM) Pushes 2D Transistors And CoPoS Closer To The AI Future
June 24, 2026
Simply Wall St
Reviewed by Bailey Pemberton
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TSMC (NYSE:TSM) reports progress on next generation 2D transistor technology, fabricating 2D material devices at a 50nm pitch with partners Imec and ASML.
The company is also accelerating work on Chip On Panel on Sub
2026-06-24
seekingalpha.com
2026-06-24
Seeking Alpha
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2026-06-24
focustaiwan.tw
2026-06-24
Focus Taiwan
Taipei, June 24 (CNA) Shares in Taiwan plunged over 1,000 points Wednesday after chip stocks in the United States suffered heavy losses overnight amid caution before Micron Technology Inc. released its quarterly results, dealers said.
The Taiex, the Taiwan Stock Exchange's benchmark index, ended down 1,057.05 points, or 2.24 percent, at 46,043.6 after moving between 45,819.71 and 46,909.98. Turno
2026-06-24
www.astutegroup.com
2026-06-24
Astute Group
www.astutegroup.com
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2026-06-24
finance.yahoo.com
2026-06-24
Yahoo Finance
Taiwan Semiconductor Manufacturing (NYSE:TSM) Unveils AI Chip Advances In CoWoS And 2D Transistors
Bailey Pemberton
Tue, June 23, 2026 at 9:30 PM PDT 3 min read
2330.TW
-4.02%
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Taiwan Semiconductor Manufacturing, NYSE:TSM, has reported a breakthrough in advanced packaging through its
2026-06-24
evertiq.com
2026-06-24
Evertiq
© tsmc
Business | June 24, 2026
TSMC partners with Amkor to accelerate advanced packaging in US
Evertiq
The agreement establishes a collaboration framework for TSMC to procure from Amkor advanced packaging and testing services. By working together as partners to expand capacity, the companies aim to enable a more efficient, mutually beneficial operating model.
TSMC and Amkor Technology have annou
2026-06-24
digitimes.com
2026-06-24
Cloud service providers are accelerating in-house AI chip development, lifting demand for application-specific integrated circuits, or ASICs, and reshaping collaboration across the semiconductor supply chain.