Semiconductor News & Analysis Feed
87 articles
2026-06-16
simplywall.st
2026-06-16
simplywall.st
2026-06-16
www.indexbox.io
2026-06-16
IndexBox
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2026-06-16
wccftech.com
2026-06-16
Wccftech
The compact space inside smartphones makes it difficult to adopt High Bandwidth Memory (HBM), not to mention the thermal problem, but a rumor claims that Chinese smartphone brands have a custom-made Low Latency Wide DRAM (LLW) that adopts a similar integrated design as the aforementioned technology. While the design isn’t “true HBM,” it aims to resolve the performance bottleneck issue that LPDDR R
2026-06-16
www.techpowerup.com
2026-06-16
TechPowerUp
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2026-06-15
eetimes.com
2026-06-15
Imec says advanced lithography and semiconductor integration techniques may help scale silicon spin qubits toward manufacturable quantum systems.
2026-06-15
digitimes.com
2026-06-15
Equipment maker Manz recently announced the successful delivery of the world's first 310mm x 310mm panel-level packaging (PLP) electrochemical deposition (ECD) mass-production tool, further expanding its footprint in advanced packaging process equipment and demonstrating integrated capabilities spanning in-house R&D, process and system integration, and mass-production deployment.
2026-06-15
simplywall.st
2026-06-15
simplywall.st
Japan/Semiconductors/TSE:8035
Is Tokyo Electron (TSE:8035) Quietly Redefining Its Chiplet Strategy With Teradyne Test Integration?
June 14, 2026
Simply Wall St
Reviewed by Sasha Jovanovic
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In June 2026, Teradyne announced an integrated test cell solution for AI and data center chips that combines its UltraFLEXplus platform with Tokyo Electron’s Prexa SDP prober to enable high-qualit
2026-06-14
zamin.uz
2026-06-14
Zamin.uz
Belkin introduces new 45W GaN charger with integrated cable
11:53 / 14.06.2026
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118
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Technology
Belkin, a leading brand in the accessories market, has unveiled its new generation charger. Based on Gallium Nitride (GaN) technology, this gadget delivers 45 W of power and stands out not only for its compactness but also for its convenient integrated cable. This is reported by Ixbt.com reports .
C
2026-06-12
www.eenewseurope.com
2026-06-12
eeNews Europe
Belgian research hub Imec has taken another step toward high-frequency chiplet-based systems, extending its 300mm RF silicon interposer platform to support system-level integration of III-V chiplets with Si-CMOS technology. The development targets emerging mmWave and sub-THz wireless applications, as well as high-speed signal handling for next-generation data centers.
2026-06-12
www.newelectronics.co.uk
2026-06-12
New Electronics
www.newelectronics.co.uk
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2026-06-12
www.azom.com
2026-06-12
AZoM
From Forge Nano
Jun 12 2026
Forge Nano, Inc., a leading U.S. based semiconductor equipment and advanced materials company pioneering Atomic Layer Deposition ("ALD") technology for artificial intelligence ("AI")-era chip manufacturing and defense battery applications, which has signed an agreement to merge with Archimedes Tech SPAC Partners II Co. ("Archimedes II"), today announced that a leading
2026-06-11
digitimes.com
2026-06-11
Wistron ITS has officially changed its name to WITS. Chairman Ching Hsiao pointed out that the rebranding signifies the company's transition from software into the new frontier of "software-hardware integration."
2026-06-10
www.tomshardware.com
2026-06-10
Tom's Hardware
Tech Industry
Google reportedly books Intel for packaging more than 3 million TPUs in 2028 — SK hynix is testing Intel's EMIB packaging for HBM integration
News-analysis
By Luke James published 3 days ago
TSMC's CoWoS lines are sold out through 2027, and Intel's EMIB is the only credible second source.
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2026-06-10
www.investing.com
2026-06-10
Investing.com
www.investing.com
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2026-06-10
digitimes.com
2026-06-10
AI adoption in PCB manufacturing is now widespread, yet fewer than 10% of companies have fully scaled deployments, underscoring a global gap between experimentation and factory-wide integration. For readers worldwide, the findings point to a sector where quality gains are real, but talent, data, and governance constraints are slowing broader industrial change.
2026-06-10
digitimes.com
2026-06-10
Global hardware growth is facing an increasingly fragile and fragmented supply chain. At PCIM Europe 2026, software intelligence firm Luminovo's OEM Growth Lead, Inga Schwarz, made a compelling case for why AI is no longer enough to save hardware companies from costly operational challenges. The industry, she argued, must embrace a transition toward deep, native domain enterprise integration to bu
2026-06-10
www.tradingview.com
2026-06-10
TradingView
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Quartr
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SNPS: AI, Ansys integration, and robust partnerships drive growth, innovation, and margin expansion
SNPS: AI, Ansys integration, and robust partnerships drive growth, innovation, and margin expansion
Less than 1 min read
SNPS
−2.91%
Strong Q2 results led to raised full-year guidance, with double-digit EDA growth and a rebound in IP expected. AI and Ansys integration are driving ne
2026-06-10
eetimes.com
2026-06-10
Efinix’ exchangeable logic-and-routing technology aims to cut power and die area while enabling memory integration and greater flexibility for AI edge designs.
2026-06-10
www.tradingview.com
2026-06-10
TradingView
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2026-06-09
news.google.com
2026-06-09
Yahoo Finance