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Imec extends auto chiplet program to edge computing - Electronics Weekly

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www.electronicsweekly.com 2026-07-02 Electronics Weekly

ASML, TSMC and imec present 300mm integration route for industry-ready 2D-material-based transistors - Semiconductor Today

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www.semiconductor-today.com 2026-06-23 Semiconductor Today

ASML, TSMC and imec present 300mm integration route for industry-ready 2D-material-based transistors In partnership with equipment provider Advanced Semiconductor Materials Lithography (ASML) of Veldhoven, The Netherlands and foundry Taiwan Semiconductor Manufacturing Corp (TSMC), nanoelectronics research center imec of Leuven, Belgium has presented a novel, robust and scalable 300mm integration

2D materials transistor silicon technology semiconductor manufacturing EUV lithography TSMC ASML imec

Post-silicon era gets closer as industry giants crack the 2D transistor scaling bottleneck with breakthrough tech — imec, ASML, and TSMC fab complementary 2D-material transistors at 50nm pitch on a 300mm wafer - Tom's Hardware

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www.tomshardware.com 2026-06-19 Tom's Hardware

Tech Industry Manufacturing Semiconductors Post-silicon era gets closer as industry giants crack the 2D transistor scaling bottleneck with breakthrough tech — imec, ASML, and TSMC fab complementary 2D-material transistors at 50nm pitch on a 300mm wafer News-analysis By Luke James published June 19, 2026 EUV-printed 28nm gates and 94% working devices, all on standard production tooling. (Imag

2D materials transistor technology EUV lithography post-silicon era semiconductor manufacturing TSMC imec ASML

Imec unlocks system-level III-V chiplet integration on Si-CMOS - Evertiq

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evertiq.com 2026-06-18 Evertiq

© Imec General | June 18, 2026 Imec unlocks system-level III-V chiplet integration on Si-CMOS Evertiq By combining high-density embedded capacitors, a scalable modeling framework for passive components, and laser-assisted bonding for III-V chiplet assembly, the platform lays the foundation for next-generation wireless (mmWave and sub-THz) systems. Imec, a Belgium-based research and innovation cen

III-V chiplets chiplet integration Si-CMOS RF integration wireless communication mmWave sub-THz capacitor integration

Imec, Sony unveil backside interconnect method for 3D chip stacking

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digitimes.com 2026-06-18

Imec and Sony Semiconductor Solutions Corporation (Sony) have jointly presented a new integration method for connecting the front and back sides of semiconductor wafers, a step the two organizations say could support future 3D chip-stacking designs for logic and memory devices.

TSMC, ASML and Imec push 2D transistors toward manufacturing

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digitimes.com 2026-06-18

Imec, ASML and TSMC have demonstrated a 300mm integration route for 2D-material n-type and p-type field-effect transistors, marking a step toward moving atomically thin channel materials from laboratory devices closer to semiconductor manufacturing.

Beyond Chiplets, CMOS 2.0 Moves Scaling into the Circuit

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eetimes.com 2026-06-17

Imec’s Zsolt Tokei and Arm’s Mohamed Awad explain why CMOS 2.0 could redefine semiconductor scaling beyond chiplets.

transistor scaling 3D integration chip stacking CMOS 2.0 advanced packaging AI hardware high-bandwidth memory heterogeneous integration

ASML, TSMC, and imec move 2D transistors closer to manufacturing reality - digitimes

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www.digitimes.com 2026-06-16 digitimes

ASML, TSMC, and imec have demonstrated a major advance in the effort to bring two-dimensional (2D) semiconductor materials from research laboratories into high-volume semiconductor manufacturing. At the 2026 IEEE/JSAP Symposium on VLSI Technology and... Some subscribers prefer to save their log-in information so they do not have to enter their User ID and Password each time they vi

2D semiconductors Semiconductor manufacturing EUV lithography Advanced process Chip technology Semiconductor materials Wafer fabrication Technology breakthrough

ASML, TSMC, and imec move 2D transistors closer to manufacturing reality

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digitimes.com 2026-06-16

ASML, TSMC, and imec have demonstrated a major advance in the effort to bring two-dimensional (2D) semiconductor materials from research laboratories into high-volume semiconductor manufacturing. At the 2026 IEEE/JSAP Symposium on VLSI Technology and Circuits, the partners unveiled a 300mm wafer integration flow that produced both n-type and p-type 2D-material transistors at a 50nm contacted poly

ASML, TSMC, and imec Achieve 300 mm Integration of 2D-Material Transistors with 50 nm Pitch - TechPowerUp

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www.techpowerup.com 2026-06-16 TechPowerUp

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2D materials Transistor technology Semiconductor manufacturing ASML TSMC imec 300mm wafer 50nm pitch

Imec Pushes Quantum Toward Manufacturable Silicon Systems

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eetimes.com 2026-06-15

Imec says advanced lithography and semiconductor integration techniques may help scale silicon spin qubits toward manufacturable quantum systems.

Quantum Computing Semiconductor Manufacturing EUV Lithography Silicon Quantum Dots Qubit CMOS Process Quantum System Engineering High-NA EUV

ASML, TSMC and Imec scale 2D transistors to 50nm pitch on 300mm wafers - Bits&Chips

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bits-chips.com 2026-06-15 Bits&Chips

Headline ASML, TSMC and Imec scale 2D transistors to 50nm pitch on 300mm wafers 15 June 2026 Paul van Gerven Editor at Bits&Chips Reading time: 1 minute ASML, TSMC and Imec have demonstrated a scalable 300mm manufacturing flow for 2D-material transistors, marking a step toward industrial adoption of post-silicon logic devices. Presented at the 2026 IEEE/JSAP Symposium on VLSI Technology and Circu

2D materials transistor manufacturing EUV lithography CMOS technology semiconductor fabrication wafer manufacturing transition metal dichalcogenides IC design

Imec advances III-V chiplet integration with RF silicon interposer - eeNews Europe

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www.eenewseurope.com 2026-06-12 eeNews Europe

Belgian research hub Imec has taken another step toward high-frequency chiplet-based systems, extending its 300mm RF silicon interposer platform to support system-level integration of III-V chiplets with Si-CMOS technology. The development targets emerging mmWave and sub-THz wireless applications, as well as high-speed signal handling for next-generation data centers.

Semiconductor Technology Chip Integration III-V Materials Silicon Interposer RF Chip Chip Packaging Wireless Communication Data Center

Imec advances platform for integrating III‑V chiplets with Si‑CMOS - New Electronics

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www.newelectronics.co.uk 2026-06-12 New Electronics

www.newelectronics.co.uk Performing security verification This website uses a security service to protect against malicious bots. This page is displayed while the website verifies you are not a bot. Ray ID: a0a75b1198c9b506 Performance and Security by Cloudflare Privacy

Semiconductor Technology Chip Integration III-V Materials Si-CMOS Process Chiplets Integrated Circuits Semiconductor R&D Chip Manufacturing

imec Unveils Quantum Dot Qubit Device Using High NA EUV Lithography - EE Times India

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news.google.com 2026-05-25 EE Times India

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Imec Says AI Scaling Needs More Orchestration Across Research, Design, Manufacturing

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eetimes.com 2026-05-22 Nitin Dahad

I love it when tech leaders use simple analogies to illustrate the complexity and scale of what the semiconductor industry is facing right now. A strong example came during the opening keynote by imec CEO Patrick Vandenameele at this week’s ITF World 2026 in Antwerp, Belgium.Vandenameele used the analogy of an orchestra to illustrate why scaling AI requires technology innovation, system design, en

AI Scaling Semiconductor Industry Technology Orchestration System Design Manufacturing AI Infrastructure Chip Design Industry Collaboration

imec Unveils Quantum Dot Qubit Device Using High NA EUV Lithography - EE Times Asia

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news.google.com 2026-05-21 EE Times Asia

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Imec Unveils World’s First Quantum Dot Qubit Device - ForkLog

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forklog.com 2026-05-20 ForkLog

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Imec CEO calls for stronger AI design push in EU's Chips Act - MSN

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www.msn.com 2026-05-20 MSN

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Imec CEO calls for stronger AI design push in EU's Chips Act - MSN

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www.msn.com 2026-05-20 MSN

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