Semiconductor News & Analysis Feed

Recent teardown analysis by SemiAnalysis of Huawei's Kirin 9030 chip revealed that SMIC's third-generation 7nm process (N+3) achieves a smaller metal pitch than Intel's 18A and surpasses TSMC's N6 in transistor density, despite not using EUV lithography. However, this does not make SMIC's N+3 proces

At the IEEE International Symposium on Circuits and Systems (ISCAS 2026) in Shanghai, Huawei unveiled a breakthrough chip design framework aimed at narrowing the technological gap with global leaders like TSMC and NVIDIA. The company targets '1.4nm-class' transistors and claims a 55% increase in tra

Huawei has unveiled a breakthrough chip design technology aimed at overcoming U.S. sanctions, targeting 1.4nm-class chips by 2031. The innovation is based on a novel 'LogicFolding' architecture and a 'Tau Scaling Law' that replaces Moore's Law. By prioritizing signal speed over transistor miniaturiz

Huawei has unveiled details of its upcoming Kirin 2026 chip, featuring a new LogicFolding architecture that marks a significant leap in chip design. The chip achieves a transistor density of 238 million transistors per square millimeter, rivaling TSMC’s 3nm and Intel’s 18A processes. Compared to tra