Semiconductor News & Analysis Feed
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2026-06-16
news.google.com
2026-06-16
CNBC
2026-06-16
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2026-06-16
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2026-06-16
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2026-06-16
digitimes
Murata Manufacturing has partnered with Synopsys to make its latest electromagnetic and thermal simulation models directly accessible through Synopsys' Ansys HFSS and Ansys Icepak environments, simplifying engineers' workflows as they develop increasingly...
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2026-06-16
www.insidermonkey.com
2026-06-16
Insider Monkey
NEWS
Taiwan Semiconductor Manufacturing Company Limited (TSM)’s CEO Expresses Concern About Water, Talent Shortages
Published on June 16, 2026 at 2:27 am by ASHAR JAWAD in News
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Taiwan Semiconductor Manufacturing Company Limited (NYSE:TSM) is among the 10 Stocks ChatGPT Predicts Could Make You Wealthy in 3 Years. While speaking at a ceremony for a new science park in Pingtung, the company’s
2026-06-16
finance.yahoo.com
2026-06-16
Yahoo Finance
Taiwan Semiconductor Manufacturing Company Limited (TSM)’s CEO Expresses Concern About Water, Talent Shortages
Ashar Jawad
Mon, June 15, 2026 at 11:27 PM PDT 2 min read
2330.TW
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TSM
-3.53%
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Taiwan Semiconductor Manufacturing Company Limited (NYSE:TSM) is among the 10 Stocks ChatGPT Predicts Could Make You Wealthy in 3 Years. While speaking at a ceremo
2026-06-16
finance.yahoo.com
2026-06-16
Yahoo Finance
NXP Semiconductors and Texas Instruments Stocks Trade Up, What You Need To Know
Radek Strnad
Mon, June 15, 2026 at 10:16 PM PDT 3 min read
NXPI
-4.11%
TXN
-2.44%
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What Happened?
A number of stocks jumped in the afternoon session after the Trump administration announced a new peace deal that would lead to the reopening of the Strait of Hormuz, signaling
2026-06-16
www.tweaktown.com
2026-06-16
TweakTown
US AI startup Tensordyne claims 3nm Napier chip outperforms NVIDIA Blackwell by 13x in tokens per second
The TDN72 rack houses 288 Napier chips, delivers 608 petaflops of FP8 compute, and claims to match the throughput of nine NVIDIA Rubin plus Groq LPX racks.
VIEW GALLERY - 3
Hassam Nasir
Tech Reporter
Published Jun 16, 2026 12:15 AM CDT
1 minute & 45 seconds read time
TL;DR: Tensordyne's 3nm N
2026-06-16
www.digitimes.com
2026-06-16
digitimes
TSMC is accelerating its advanced packaging roadmap for AI chips, expanding CoWoS capacity while publicly disclosing new progress in glass substrate technology. The company is also signaling that next-generation packaging competition is shifting from CoWoS...
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2026-06-16
evertiq.com
2026-06-16
Evertiq
© Air Liquide
Electronics Production | June 16, 2026
Air Liquide invests €200M in Korea to back SK hynix’s AI chip project
Evertiq
In order to supply SK hynix’s new packaging and testing fab “P&T7”, located in Cheongju, in the Chungcheongbuk province, Air Liquide will build and operate a state-of-the-art nitrogen production unit.
France’s Air Liquide has signed a long-term contract with SK hynix.
2026-06-16
www.tradingkey.com
2026-06-16
TradingKey
TSMC is collaborating with Ibiden and Innolux to validate glass substrates for its new CoPoS advanced packaging technology. This shift from wafer-level to panel-level processing aims to overcome limitations of traditional organic and silicon interposers. Simulation results indicate glass substrates offer significant improvements in warpage, thermal expansion, elastic modulus, power integrity, and
2026-06-16
www.ad-hoc-news.de
2026-06-16
AD HOC NEWS
Suess Microtec, DE000A1K0235
New release push: Suess Microtec’s XBC300 Gen2 targets advanced packaging demand
16.06.2026 - 05:05:28 | ad-hoc-news.de
Suess Microtec has introduced the XBC300 Gen2 wafer bonder to address surging demand in advanced packaging and 3D integration, aiming squarely at high-volume semiconductor production rather than lab-scale tools.
Suess Microtec, DE000A1K0235
Edited
2026-06-16
news.google.com
2026-06-16
EE Times Asia
2026-06-16
www.mykxlg.com
2026-06-16
mykxlg.com
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2026-06-16
www.ad-hoc-news.de
2026-06-16
AD HOC NEWS
Infineon, DE0006231004
New AI power push: Infineon’s XDP700 digital multiphase controllers target Nvidia MGX servers
16.06.2026 - 03:15:46 | ad-hoc-news.de
Infineon is sharpening its AI hardware focus with the XDP700 family of digital multiphase controllers, designed to deliver efficient, tightly regulated power to GPUs and accelerators in next-generation Nvidia MGX AI server platforms.
Infineon
2026-06-16
digitimes.com
2026-06-16
AMD said it will acquire MEXT, a move aimed at strengthening its AI and data center portfolio amid rising global memory demand. The deal is intended to help customers improve performance, reduce infrastructure costs, and accelerate the deployment of AI, analytics, and high-performance workloads across cloud and enterprise systems.
2026-06-16
digitimes.com
2026-06-16
Nvidia launched a sale of US$25 billion worth of high-grade bonds on June 15, ultimately garnering up to US$85 billion in orders, or more than triple the bond's original size. This is one of several debt offerings this year from tech giants, which are responding to investor excitement and a need for cash to capitalize on the AI boom.
2026-06-16
digitimes.com
2026-06-16
The AI data center buildout is driving demand for high-performance computing (HPC) and networking chips, sending the global IC substrate industry into a new growth cycle. Order visibility now extends two to three years, prompting Taiwan's three leading IC substrate suppliers,Unimicron,Kinsus, andNanya PCB, to restart capacity expansion targeting GPU, CPU, and ASIC customers.
2026-06-16
digitimes.com
2026-06-16
SK Hynix moved closer to shipping seventh-generation high-bandwidth memory, HBM4E, to key customers as timing emerged as a critical competitive factor in the global memory market. According to Newsis, industry sources reported that SK Hynix had recently made positive progress in HBM4E development and was preparing to send samples soon, with shipments possibly beginning in June 2026 and no later th
2026-06-16
digitimes.com
2026-06-16
Nvidia's dominance in AI is extending beyond model training and deeper into inference—the fast-growing segment of the AI market responsible for running deployed models and generating revenue.
2026-06-16
digitimes.com
2026-06-16
Global expansion in AI chips, advanced logic processes, and multilayer 3D NAND flash memory is driving demand for tungsten hexafluoride (WF6), a critical electronic specialty gas used in semiconductor manufacturing. Limited short-term supply additions and low industry inventories are widening the supply-demand gap, triggering a rapid price increase.