SemiPulse — Semiconductor Intelligence

Govt bets on five local semiconductor companies capturing 7% of global advanced packaging market by 2035 - KLSE Screener

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www.klsescreener.com 2026-05-08 KLSE Screener

KUALA LUMPUR (May 8): The Malaysian government has provided RM92 million in research and development (R&D) grants to five local companies that form the Malaysia Advanced Packaging Consortium (MAPC) to help upgrade the country’s semiconductor industry into a higher-value sector, according to the Ministry of Science, Technology and Innovation (Mosti).The funding, channelled through the Malaysia Sci

Semiconductor Industry Advanced Packaging Malaysian Government R&D Investment Technology Policy Artificial Intelligence Supply Chain Resilience High-Value Manufacturing

MOSTI pushes Malaysia towards high-value semiconductor future with advanced packaging drive - The Vibes

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www.thevibes.com 2026-05-08 The Vibes

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KLIC Q1 Deep Dive: Accelerating Demand and Advanced Packaging Expansion Drive Outlook - StockStory

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stockstory.org 2026-05-08 StockStory

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Malaysia's local semiconductor players are making their advanced packaging move, and the stakes could not be higher - CRN Asia

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www.crnasia.com 2026-05-08 CRN Asia

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Following CoWoS, will the next generation of advanced packaging be CoPoS? - 富途牛牛

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news.futunn.com 2026-05-07 富途牛牛

访问频繁，请稍后重试您所要访问的页面不在这儿，它可能正忙着刷牛牛圈，稍后就能恢复正常返回主页

Advanced Packaging Semiconductor Packaging CoWoS Technology Chip Packaging Semiconductor Manufacturing Technology Development Packaging Technology Chip Design

Malaysia wants 7% of the global advanced packaging market by 2035. Right now, it has zero. - Tech Wire Asia

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techwireasia.com 2026-05-07 Tech Wire Asia

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The opportunity clock is ticking for Malaysia’s advanced packaging - Tech Wire Asia

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techwireasia.com 2026-05-07 Tech Wire Asia

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ASYS Q1 Deep Dive: AI Demand and Advanced Packaging Drive Revenue Growth and Guidance Upside - StockStory

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stockstory.org 2026-05-07 StockStory

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Intel shifts data center chip packaging to Vietnam and expands EMIB advanced packaging integration - digitimes

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www.digitimes.com 2026-05-07 digitimes

Intel is relocating a data center chip production line from Costa Rica to its Vietnam facility. The move, flagged in a Saigon Hi-Tech Park management board report to the Ho Chi Minh City People's Committee and cited byThe Investorand VN Economy,...The article requires paid subscription.Subscribe Now

Intel data center chips Vietnam manufacturing chip packaging EMIB semiconductor manufacturing supply chain relocation semiconductor industry

Intel targets entry-level advanced packaging, draws interest from Google and Amazon - digitimes

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www.digitimes.com 2026-05-07 digitimes

Over the past decade, market assessments of Intel have largely been confined to a single lens: execution in advanced process technology. By that metric, Intel has struggled, with delays in 10nm and setbacks at the 7nm node, leading to the loss of Apple's chip...The article requires paid subscription.Subscribe Now

Intel Advanced Packaging Semiconductor Manufacturing Chip Technology Google Amazon Wafer Fab Semiconductor Industry

Kulicke & Soffa earnings up next as advanced packaging gains By Investing.com - Investing.com South Africa

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za.investing.com 2026-05-07 Investing.com South Africa

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Kulicke & Soffa earnings up next as advanced packaging gains By Investing.com - Investing.com Nigeria

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ng.investing.com 2026-05-07 Investing.com Nigeria

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Kulicke & Soffa earnings up next as advanced packaging gains By Investing.com - Investing.com UK

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uk.investing.com 2026-05-07 Investing.com UK

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Kulicke & Soffa earnings up next as advanced packaging gains - Investing.com

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www.investing.com 2026-05-07 Investing.com

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Hana Micron bets on advanced packaging for global expansion - 매일경제

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pulse.mk.co.kr 2026-05-06 매일경제

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Tata Electronics targets US$30B semiconductor buildout to anchor India’s manufacturing push

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digitimes.com 2026-05-06

Tata Electronics is rapidly emerging as one of India's most ambitious bets in the global semiconductor and electronics industry, with a long-term goal of building a US$30 billion business anchored in chip manufacturing, advanced packaging, and electronics services.

GlobalWafers prepares inventory buffer as geopolitical factors push up gallium prices

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digitimes.com 2026-05-06

Semiconductor silicon wafer supplier GlobalWafers said during its May 5 earnings call that it is advancing its next-generation compound semiconductor strategy. In response to advanced packaging and thermal dissipation demand, the company is actively pursuing customer certification for 12-inch silicon carbide (SiC) wafers, while strong demand for gallium nitride (GaN) is driving plans to launch a s

Intel Places Huge Order For Equipment Related To Advanced Packaging Production, Signaling Huge Interest in EMIB - Wccftech

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wccftech.com 2026-05-05 Wccftech

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Semiconductor Advanced Packaging Materials Market Trends, - openPR.com

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www.openpr.com 2026-05-05 openPR.com

Univacco eyes 2027 Vietnam plant ramp-up for CPO and advanced packaging materials - digitimes

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www.digitimes.com 2026-05-05 digitimes