Semiconductor News & Analysis Feed

1089 articles
2026-06-18
www.tweaktown.com 2026-06-18 TweakTown
SK Hynix and Samsung race to build the memory powering NVIDIA and AMD's next AI monsters SK Hynix confirms it has delivered its first HBM4E samples to its partners, marking the first delivery of next-gen data center components. VIEW GALLERY - 3 Jak Connor Tech and Science Editor Published Jun 18, 2026 3:31 AM CDT 1 minute & 30 seconds read time TL;DR: SK Hynix has delivered its first HBM4E memor
2026-06-18
www.moomoo.com 2026-06-18 Moomoo
To create a seamless experience and for website quality and improvement purposes, we use cookie technologies for verification and quality purposes, to personalize the content presented, and to provide advertising that may be of specific interest to you. Learn our Privacy Policy here. $Netlist (NLST.US)$周三宣布,已在美国国际贸易委员会(ITC)和得克萨斯州东区联邦地方法院对$三星电子 (005930.KR)$提起新的专利侵权诉讼。 美国内存技术公司Netlist周三宣布,已在美国国际贸易
2026-06-18
news.futunn.com 2026-06-18 富途牛牛
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2026-06-18
seekingalpha.com 2026-06-18 Seeking Alpha
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2026-06-18
www.thelec.net 2026-06-18 thelec.net
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2026-06-18
www.digitimes.com 2026-06-18 digitimes
As AI chip technology advances, larger chip sizes and heterogeneous integration packaging are driving bigger package dimensions, pushing semiconductor makers to adopt FOPLP over FOWLP and improve manufacturing efficiency by "replacing round with square."... Some subscribers prefer to save their log-in information so they do not have to enter their User ID and Password each time the
2026-06-18
www.tweaktown.com 2026-06-18 TweakTown
AMD, Google, Tesla, and Groq turn to Samsung Foundry as TSMC runs out of capacity TSMC's leading-edge capacity is locked up with NVIDIA, Apple, and Broadcom, making Samsung's available slots attractive despite trailing on yields. VIEW GALLERY - 3 Hassam Nasir Tech Reporter Published Jun 17, 2026 9:45 PM CDT 2 minutes & 15 seconds read time TL;DR: With TSMC's advanced chip production fully booked
2026-06-18
www.frontier-enterprise.com 2026-06-18 Frontier Enterprise
Frontier TechAI & MLNews TSMC teams up with NVIDIA to advance semiconductor fabrication By Staff Writer - June 18, 2026 Share TSMC is using NVIDIA accelerated computing and AI to advance semiconductor design and manufacturing. As chips move to more advanced nodes, bringing them from design to high-volume production has become one of the world’s most complex computing challenges.  Computational
2026-06-18
markets.ft.com 2026-06-18 Financial Times
IRVINE, Calif. , June 17, 2026 /PRNewswire/ -- Netlist, Inc. (OTCBQ: NLST) today announced it has initiated new legal proceedings against Samsung in the U.S. International Trade Commission (ITC) and the U.S. District Court for the Eastern District of Texas.  These actions are based on the infringement of Netlist'sU.S. Patent Nos. 12,646,537 and 12,650,937, which respectively read on Samsung's high
2026-06-18
www.digitimes.com 2026-06-18 digitimes
Samsung Foundry’s MPW service allows multiple chip designs to share a single wafer for prototype production. Credit: Samsung Samsung Electronics' foundry division plans to open its Multi-Project Wafer, or MPW, service to its 2nm process next year, giving South Korean fabless chip designers access to one of the most advanced foundry nodes being commercialized without having to pay...
2026-06-18
www.koreaherald.com 2026-06-18 The Korea Herald
SK hynix's 12-layer HBM4E, the next-generation high-bandwidth memory chip the company said Thursday it has begun shipping as samples to major customers.(SK hynix)→ SK hynix said Thursday it has shipped samples of its 12-layer HBM4E, the next generation of high-bandwidth memory for artificial intelligence, to major customers, moving the company into the customer-qualification stage roughly thr
2026-06-18
digitimes.com 2026-06-18
Samsung Electronics and SK Hynix are each reviewing locations in South Korea's Honam region for new semiconductor packaging plants, according to The Elecand Hankyung, citing industry sources, as the two companies look for ways to add back-end capacity beyond their existing manufacturing hubs.
2026-06-18
digitimes.com 2026-06-18
Samsung Electronics is reportedly working with multiple partners to develop production equipment for its seventh-generation 10nm-class (1d) DRAM process. The company aims to begin tool installation as early as the second quarter of 2027, with initial volume production expected by the end of that year.
2026-06-18
digitimes.com 2026-06-18
Samsung Electronics is developing and operating a data-sharing platform with semiconductor materials, components and equipment suppliers, according to a report by South Korea's ETNews, which cited industry sources.
2026-06-18
digitimes.com 2026-06-18
As AI chip technology advances, larger chip sizes and heterogeneous integration packaging are driving bigger package dimensions, pushing semiconductor makers to adopt FOPLP over FOWLP and improve manufacturing efficiency by "replacing round with square." DIGITIMESbelieves that panel makers have an edge because their existing glass substrates are larger than those used by OSATs, making FOPLP develo
2026-06-18
digitimes.com 2026-06-18
Samsung Electronics' foundry division plans to open its Multi-Project Wafer, or MPW, service to its 2nm process next year, giving South Korean fabless chip designers access to one of the most advanced foundry nodes being commercialized without having to pay for a full wafer run, according to ZDNet Koreaand iNews24.
2026-06-18
digitimes.com 2026-06-18
Samsung Electronics has demonstrated a 3D stacked transistor structure with a 42-nanometer gate pitch, a research milestone that extends vertical integration, long used in memory chips, into logic semiconductors.
2026-06-18
www.thelec.net 2026-06-18 thelec.net
ISTE's FOUP cleaner for HBM back-end processes. (Photo: ISTE) ISTE announced on June 17 that it has received an initial order from Samsung Electronics for front-opening unified pod (FOUP) cleaning equipment designed for high-bandwidth memory (HBM) manufacturing. The deal adds Samsung to ISTE's customer base alongside SK hynix. FOUP cleaners are used to remove contaminants from the sealed carrier
2026-06-17
www.tomshardware.com 2026-06-17 Tom's Hardware
PC Components RAM Chinese memory brands ditch Samsung and Micron for homegrown CXMT and YMTC silicon — Corsair, HP, and Dell are already adopting the China-produced DDR5 chips News By Zhiye Liu published 5 hours ago Some Chinese module makers are turning their backs on the big three RAM suppliers. (Image credit: Getty Images) Share this article 1 Join the conversation Follow us Add us as a pref
2026-06-17
tomshardware.com 2026-06-17 Zhiye Liu
Chinese memory brands Gloway and KingBank have begun using homemade chips to produce DDR5 memory kits in lieu of Samsung, Micron, or SK hynix DRAM.