Semiconductor News & Analysis Feed

1089 articles
2026-06-17
www.investing.com 2026-06-17 Investing.com
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2026-06-17
asia.nikkei.com 2026-06-17 Nikkei Asia
Demand for AI infrastructure strains advanced capacity of market leader TSMC Samsung's advanced chipmaking services are gaining more attention as the AI boom strains rivals' production capacity. (Nikkei montage/Source photos by Ken Kobayashi and Reuters) TAIPEI/HONG KONG/SEOUL -- BYD, Google, AMD, Tesla and others are looking increasingly to Samsung Electronics for contract chipmaking services a
2026-06-17
digitimes.com 2026-06-17
Samsung Electro-Mechanics (Semco) is rapidly gaining ground in the silicon capacitor market as AI infrastructure investment and technology upgrades accelerate demand. After landing its first major silicon capacitor order, the company is in talks with additional potential customers, while its multilayer ceramic capacitor (MLCC) business is also expanding and operating profit is expected to hit a re
2026-06-17
digitimes.com 2026-06-17
Nvidia is expected to surpass Apple and Samsung Electronics' mobile division to become the world's top buyer of LPDDR, as AI servers and AI PCs pull low-power memory beyond smartphones, MoneyTodayreported, citing electronics industry sources.
2026-06-17
digitimes.com 2026-06-17
Semiconductor materials suppliers are moving to rebuild depleted inventories and recover sharply higher costs from Samsung Electronics, SK Hynix and other memory chip customers after the 106-day US-Iran war strained supply chains for precursors, specialty gases and other key chipmaking inputs.
2026-06-17
digitimes.com 2026-06-17
Global chip buyers, including BYD, Google, AMD, and Tesla, are turning to Samsung Electronics as TSMC's advanced production lines remain fully booked, Nikkei Asiareported. The shift underscores how AI demand and supply-chain risk are reshaping where cutting-edge chips are made.
2026-06-17
digitimes.com 2026-06-17
Driven by Nvidia and other tech giants, global AI data center buildouts are undergoing an unprecedented structural shift. The pressure is not only coming from explosive compute demand, but also from upgrades in power, cooling, and supply-chain resilience.
2026-06-17
semiconductor.samsung.com 2026-06-17 Samsung Semiconductor
Click here to learn more about Samsung Foundry Forum & SAFE™. Click here to learn more about Samsung Foundry Forum & SAFE™. Click here to learn more about Samsung Foundry Forum. Samsung Foundry Forum 더 알아보려면 여기를 클릭하세요 Samsung Foundry Forum についての詳細はここをクリックして下さい 点击这里了解更多关于 Samsung Foundry Forum & SAFE™ Samsung Electronics' Semiconductor Research Center pre
2026-06-17
tomshardware.com 2026-06-17 Kunal Khullar
The new G3-series peripherals focus on lightweight gaming and customization.
2026-06-16
memeburn.com 2026-06-16 Memeburn
TL;DR Google is reportedly in talks with Samsung to help manufacture its future AI chip, codenamed Icefish. TSMC will likely remain the primary producer, but capacity constraints are pushing Google to diversify suppliers. The move highlights how the AI boom is reshaping the global semiconductor industry and supply chains. Google could soon give Samsung a major role in building one of its most ad
2026-06-16
wccftech.com 2026-06-16 Wccftech
Memory makers are now adopting domestically produced larger size DDR5 memory chips for their DDR5 modules. Instead of depending on the three memory giants, such as Samsung, Micron, and SK Hynix, some memory vendors in China are now adopting domestically produced DDR5 chips. As per IT Home, two vendors known as Gloway and KingBank have introduced their latest DDR5 memory modules, using the 24 Gb m
2026-06-16
news.google.com 2026-06-16 Business Wire
2026-06-16
news.google.com 2026-06-16 Business Wire
2026-06-16
wccftech.com 2026-06-16 Wccftech
The memory requirements of experiencing the entire Siri AI features suite will eventually force Apple to introduce a minimum of 12GB LPDDR5X RAM for its iPhone 18 lineup, but more importantly, is how increased demand for these devices will contribute to the existing memory crisis while making a handful of suppliers wealthy in the process.
2026-06-16
semiconductor.samsung.com 2026-06-16 Samsung Semiconductor
Click here to learn more about Samsung Foundry Forum & SAFE™. Click here to learn more about Samsung Foundry Forum & SAFE™. Click here to learn more about Samsung Foundry Forum. Samsung Foundry Forum 더 알아보려면 여기를 클릭하세요 Samsung Foundry Forum についての詳細はここをクリックして下さい 点击这里了解更多关于 Samsung Foundry Forum & SAFE™ AI technology is accelerating innovation across all in
2026-06-16
www.digitimes.com 2026-06-16 digitimes
TSMC is accelerating its advanced packaging roadmap for AI chips, expanding CoWoS capacity while publicly disclosing new progress in glass substrate technology. The company is also signaling that next-generation packaging competition is shifting from CoWoS... Some subscribers prefer to save their log-in information so they do not have to enter their User ID and Password each time t
2026-06-16
digitimes.com 2026-06-16
SK Hynix moved closer to shipping seventh-generation high-bandwidth memory, HBM4E, to key customers as timing emerged as a critical competitive factor in the global memory market. According to Newsis, industry sources reported that SK Hynix had recently made positive progress in HBM4E development and was preparing to send samples soon, with shipments possibly beginning in June 2026 and no later th
2026-06-16
digitimes.com 2026-06-16
Samsung Electronics' foundry business is reportedly expanding its strategic relationship with companies led by Elon Musk, with cooperation now spanning electric vehicles and emerging neurotechnology, according to Hankyungreporting.
2026-06-16
digitimes.com 2026-06-16
Apple is stepping up the AI capabilities of its Siri voice assistant, and analysts say memory chip demand will rise along with it, potentially benefiting Apple's suppliers such as Samsung Electronics and SK Hynix. The shift could drive both shipment growth and higher prices for mobile DRAM.
2026-06-16
digitimes.com 2026-06-16
TSMC is accelerating its advanced packaging roadmap for AI chips, expanding CoWoS capacity while publicly disclosing new progress in glass substrate technology. The company is also signaling that next-generation packaging competition is shifting from CoWoS toward CoPoS as it builds out a fuller ecosystem ahead of rivals.