17 articles
2026-05-21
digitimes.com
2026-05-21
SK Hynix is reportedly moving to reshape part of its Cheongju campus around wafer testing, a shift that underscores how high-bandwidth memory, or HBM, is putting new pressure on the back end of the chipmaking process.
2026-05-18
digitimes.com
2026-05-18
Samsung Electronics has significantly improved yields for its latest DRAM technologies used in high-bandwidth memory (HBM), according to IT Chosun, underscoring the intensifying race among memory makers to secure leadership in AI-related semiconductors.
2026-05-17
wccftech.com
2026-05-17
Wccftech
__fail__
2026-05-17
digitimes.com
2026-05-17
Taiwan's semiconductor ecosystem is getting an unexpected lift from the AI server investment boom. Supply pressure that began in high-bandwidth memory and leading-edge process technology is now rippling into legacy memory, packaging, and testing.
2026-05-15
www.openpr.com
2026-05-15
openPR.com
__fail__
2026-05-15
www.tipranks.com
2026-05-15
TipRanks
__fail__
2026-05-15
digitimes.com
2026-05-15
Indium phosphide (InP) and other compound semiconductors are taking on a bigger role as demand rises for highly efficient light emission and ultra-high-frequency transmission. Their lower electron scattering and lower loss characteristics position them to help break through AI's energy and bandwidth barriers.
2026-05-15
digitimes.com
2026-05-15
In its first-quarter 2026 earnings Q&A session on May 15, Semiconductor Manufacturing International Corporation (SMIC) outlined a strategic response to shifting global market dynamics. As leading international foundries and integrated device manufacturers (IDMs) pivot capacity toward high-margin AI processors and High Bandwidth Memory (HBM), SMIC has seen a significant influx of orders for standar
2026-05-14
digitimes.com
2026-05-14
Samsung Electronics is reportedly reviving delayed semiconductor initiatives across next-generation NAND flash, compound semiconductors, advanced packaging, and substrates — areas it set aside after more than a year of prioritizing DRAM design and high-bandwidth memory (HBM) competitiveness. The move signals a shift from catch-up mode back toward longer-term technology investment.
2026-05-14
digitimes.com
2026-05-14
TSMC held its annual technology symposium in Hsinchu on May 14, 2026, after its North America stop, with executives noting that AI applications are rapidly expanding from cloud data centers to edge devices — driving surging demand for semiconductor compute density, high-bandwidth connectivity, power efficiency, and thermal management. Ray Wan, director of Asia-Pacific business, said TSMC will leve
2026-05-12
www.openpr.com
2026-05-12
openPR.com
__fail__
2026-05-11
www.openpr.com
2026-05-11
openPR.com
__fail__
2026-05-07
tomshardware.com
2026-05-07
Anton Shilov
PCI-SIG announces availability of the first PCIe Gen8 draft, reassures 256 GT/s data transfer rate, maintains backwards compatibility, evaluates new connector technology.
2026-05-06
www.openpr.com
2026-05-06
openPR.com
__fail__
2026-05-06
digitimes.com
2026-05-06
SoftBank's memory unit SAIMEMORY is preparing to present a new 3D DRAM technology developed with Intel, as the AI hardware industry seeks ways to ease the power and heat constraints of high-bandwidth memory.
2026-05-05
en.clickpetroleoegas.com.br
2026-05-05
CPG Click Petróleo e Gás
__fail__
2026-05-03
wccftech.com
2026-05-03
Wccftech