Semiconductor News & Analysis Feed

4307 articles
2026-06-30
www.techdigest.tv 2026-06-30 Tech Digest
IBM ANNOUNCES POWERFUL NEW SUB-1 NM CHIP DESIGN 30 June 2026Tech Digest CorrespondentComputers Share IBM has set tech tongues wagging with the announcement of a new chip design. The US-tech company has said the new design will enable manufacturers to pack 100 billion transistors into a single silicon chip the size of a fingernail. Chips are measured in nanometres, one billionth of a metre. The c
2026-06-30
www.barrons.com 2026-06-30 Barron's
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2026-06-30
www.scmp.com 2026-06-30 South China Morning Post
Semiconductors TechTech Trends Chip supply chain braces for more price hikes as upstream parts create new bottlenecks Makers of power semiconductors, including Germany’s Infineon, US-based Texas Instruments and China’s Yangjie Technology, have raised prices 2-MIN READ 0 Listen Make SCMP preferred on Google Wency Chenin Shanghai Published: 7:00pm, 30 Jun 2026 The AI-driven price surge in the sem
2026-06-30
www.scmp.com 2026-06-30 South China Morning Post
Semiconductors TechTech Trends Chip supply chain braces for more price hikes as upstream parts create new bottlenecks Makers of power semiconductors, including Germany’s Infineon, US-based Texas Instruments and China’s Yangjie Technology, have raised prices 2-MIN READ 0 Listen Make SCMP preferred on Google Wency Chenin Shanghai Published: 7:00pm, 30 Jun 2026 The AI-driven price surge in the sem
2026-06-30
www.msn.com 2026-06-30 MSN
Micron Technology stock was rising sharply Monday amid a resurgence of the artificial-intelligence momentum trade, alongside reminders of the shortage in memory chips. Micron shares were up 10.1% at $1,081 with markets cheered by the prospect of a U.S.-Iran peace deal. Shares have been volatile as investors debate Micron’s valuation. The chip maker trades at a notably low forward price-to-earnin
2026-06-30
siliconcanals.com 2026-06-30 Silicon Canals
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2026-06-30
voi.id 2026-06-30 VOI.id
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2026-06-30
letsdatascience.com 2026-06-30 Let's Data Science
POLICY & REGULATION dram memory chips antitrust supply chain Memory chipmakers face US class-action over DRAM shift 7 sources | June 30, 2026 | By LDS Team 6.7 Relevance Score Photo: img.etimg.com · rights & takedowns QUICK SUMMARY Hide Seventeen consumers and small businesses filed a proposed US class-action lawsuit in the Northern District of California alleging Samsung Electronics, SK hynix, a
2026-06-30
www.thelec.net 2026-06-30 thelec.net
​Applied Materials’ enhanced Centura Prime Epi system (Photo=Applied Materials) ​Applied Materials has introduced six new semiconductor manufacturing systems for DRAM and advanced packaging, expanding its portfolio of 3D semiconductor equipment aimed at improving the performance and power efficiency of next-generation memory used in artificial intelligence (AI) processors. ​The company unveiled
2026-06-30
www.tradingview.com 2026-06-30 TradingView
News / Reuters / Samsung, SK Hynix mega South Korea chips gamble tests optimism of AI cycle Samsung, SK Hynix mega South Korea chips gamble tests optimism of AI cycle Refinitiv Sign up to read this news Join for free Compare charts Analyze on Supercharts Latest news More news from Reuters C Dec 22, 2025 Reuters Mergers and acquisitions Dec 22, 2025 Reuters KALENDER-Termine Politik/Vermi
2026-06-30
www.marketscreener.com 2026-06-30 marketscreener.com
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2026-06-30
www.reuters.com 2026-06-30 Reuters
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2026-06-30
www.tradingview.com 2026-06-30 TradingView
News / Reuters / Samsung, SK Hynix mega South Korea chips gamble tests optimism of AI cycle Samsung, SK Hynix mega South Korea chips gamble tests optimism of AI cycle Refinitiv Sign up to read this news Join for free Compare charts Analyze on Supercharts Latest news Dow Jones Newswires Sign up to read this news Quartr TBRG: Merger and executive compensation proposals both received majori
2026-06-30
euobserver.com 2026-06-30 EUobserver
Stakeholder Proposed Chips Act 2.0 fortifies Europe’s electronics ecosystem By Alison James, Brussels, 30 June 2026 10:18 Three years ago, the European Union adopted the European Chips Act. It marked an important first step in enabling funding for first-of-a-kind semiconductor’s research, development and production. It also laid the foundations for emerging advanced packaging capabilities as s
2026-06-30
www.opensourceforu.com 2026-06-30 Open Source For You
Blogs SUSE, Openchip Partner To Build Europe’s First Digitally Sovereign RISC-V Stack By Jiya Jay Singh - June 30, 2026 0 10 SUSE Logo (PRNewsFoto/SUSE) SUSE and Openchip have signed an MoU to native-certify enterprise software on European-designed RISC-V accelerators, offering an open alternative to overseas chip monopolies. SUSE, an open-source enterprise software group, and Openchip, a Spanis
2026-06-30
www.automotiveworld.com 2026-06-30 Automotive World
BYD has excelled in vertical integration in almost every area besides chip production. By Stewart Burnett June 30, 2026 BYD plans to equip an as-yet-unrevealed series production model under the Denza brand with its in-house developed Xuanji A3 smart driving chip for the first time in 2027, a report by Chinese outlet LatePost has indicated. The chip, unveiled in May 2026 as China’s first mass-pro
2026-06-30
timesofindia.indiatimes.com 2026-06-30 The Times of India
The TOI Tech Desk is a dedicated team of journalists committed to delivering the latest and most relevant news from the world of technology to readers of The Times of India. TOI Tech Desk’s news coverage spans a wide spectrum across gadget launches, gadget reviews, trends, in-depth analysis, exclusive reports and breaking stories that impact technology and the digital universe. Be it how-tos or th
2026-06-30
kalkinemedia.com 2026-06-30 Kalkine Media
Broadcom Inc (NASDAQ:AVGO) Leads AI Chip Market Focus NASDAQ COMPOSITE AVGO 3 min read | June 29, 2026 11:06 PM PDT | By Anmol Khazanchi Google News: Image source: Shutterstock Recent News Can BorgWarner (NYSE:BWA) Reignite Its Valuation Story? Eli Lilly (NYSE:LLY) Faces A Big GLP Test Why Is HP (NYSE:HPQ) Standing Out in the S&P 500 Today? Why Is Capital One (NYSE:COF) Drawing S&P 500 Atten
2026-06-30
finance.biggo.com 2026-06-30 finance.biggo.com
A South Korean research team has developed a technology to stably stack ultra-thin semiconductor chips, each just one-fifth the thickness of a human hair, in 10 or more layers. The achievement delivers integration density roughly four times higher than that of High Bandwidth Memory (HBM), a critical component in artificial intelligence (AI) semiconductors, and is expected to bolster the competitiv
2026-06-30
www.nature.com 2026-06-30 Nature
Article Open access Published: 30 June 2026 AlGaN/GaN HEMT H₂ sensor with integrated Wheatstone bridge and on-chip microheater for 0.1-ppm detection Yu Yu, Yan Liu, Wenbin Ren, Yunpeng Liu, Yulong Zhang, Zihan Wang, Qiming Zhuo, Zewen Liu, Tao Wang & Jianwen Sun  Microsystems & Nanoengineering volume  12, Article number: 249 (2026) Cite this article Save article 984 Accesses Metrics details