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2026-06-18
news.az
2026-06-18
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2026-06-18
www.straitstimes.com
2026-06-18
The Straits Times
Trump says Apple to partner with Intel on US chip design, production
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US President Donald Trump arrives for a gala dinner at the Versailles Palace in Versailles, France, on June 17.
PHOTO: BLOOMBERG
Published Jun 18, 2026, 02:28 PM
Updated Jun 18, 2026, 04:24 PM
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WASHINGTON - US President Donald Trump said in a Truth Social pos
2026-06-18
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2026-06-18
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2026-06-18
theedgemalaysia.com
2026-06-18
The Edge Malaysia
BENGALURU (June 18): US President Donald Trump said in a Truth Social post on Thursday that Apple has agreed to work with Intel to design and manufacture its chips in the United States.
A partnership with Intel helps Apple diversify its manufacturing base as it seeks additional chip capacity. The iPhone maker relies heavily on TSMC, whose advanced production lines are in high demand from AI ch
2026-06-18
www.reuters.com
2026-06-18
Reuters
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2026-06-18
finance.yahoo.com
2026-06-18
Yahoo Finance
Trump says Apple to partner with Intel on US chip design, production
Reuters
Wed, June 17, 2026 at 9:44 PM PDT 1 min read
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June 18 (Reuters) - U.S. President Donald Trump said in a Truth Social post on Thursday that Apple has agreed to work with Intel to design and manufacture its chips in
2026-06-18
smallcaps.com.au
2026-06-18
smallcaps.com.au
dorsaVi (ASX: DVL) has finalised the design package for its first integrated resistive random access memory-complementary metal-oxide semiconductor (RRAM-CMOS) validation chip.
The company has developed the chip with NTU Singapore and ITRI Taiwan, and is now ready to move into tape-out and staged silicon implementation.
The design incorporates self-checking write-and-verify circuitry, compute-in
2026-06-18
www.tradingview.com
2026-06-18
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dorsaVi Finalises RRAM-CMOS Validation Chip Design for Ultra-Edge AI
dorsaVi Finalises RRAM-CMOS Validation Chip Design for Ultra-Edge AI
2 min read
DVL
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dorsaVi
DVL
has finalised the design package for its first integrated resistive random access memory-complementary metal-oxide semiconductor (RRAM-CMOS) validation chip.
The company has developed the chip with NTU Singapo
2026-06-18
themachinemaker.com
2026-06-18
Machine Maker
themachinemaker.com
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2026-06-18
kalkine.com.au
2026-06-18
Kalkine
Highlights
dorsaVi shares rose 2.50% to AUD 0.041 on 18 June 2026, following the release of latest operational update.
The company finalised the design package for its first integrated RRAM-CMOS validation chip.
The chip was developed with NTU Singapore and ITRI Taiwan.
The program now moves toward tape-out and staged silicon implementation.
Key features include write-and-verify circuitry, Comput
2026-06-18
www.digitimes.com
2026-06-18
digitimes
Samsung Foundry’s MPW service allows multiple chip designs to share a single wafer for prototype production. Credit: Samsung
Samsung Electronics' foundry division plans to open its Multi-Project Wafer, or MPW, service to its 2nm process next year, giving South Korean fabless chip designers access to one of the most advanced foundry nodes being commercialized without having to pay...
2026-06-18
www.newelectronics.co.uk
2026-06-18
New Electronics
www.newelectronics.co.uk
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2026-06-18
finimize.com
2026-06-18
Finimize
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2026-06-18
digitimes.com
2026-06-18
Samsung Electronics' foundry division plans to open its Multi-Project Wafer, or MPW, service to its 2nm process next year, giving South Korean fabless chip designers access to one of the most advanced foundry nodes being commercialized without having to pay for a full wafer run, according to ZDNet Koreaand iNews24.
2026-06-18
digitimes.com
2026-06-18
Following the announcement in April 2026 that the AI5 chip design had been finalized, Tesla CEO Elon Musk introduced a new benchmark, stating that under yield considerations, the AI6 chip is expected to set a new record for maximum usable computing power per wafer.
2026-06-18
stocksdownunder.com
2026-06-18
Stocks Down Under
Tape-out clears the path to validation data, with compute-in-memory and TSMC-sourced wafers framing the commercial pitch
dorsaVi (ASX:DVL) has reached the moment its RRAM equity story has been pointing toward for the better part of two years. The company has finalised the full design package for its first integrated RRAM-CMOS validation chip, developed alongside NTU Singapore and ITRI Taiwan, and
2026-06-18
www.hpcwire.com
2026-06-18
HPCwire
www.hpcwire.com
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2026-06-18
gamesbeat.com
2026-06-18
GamesBeat
The benefits of multiphysics solutions. Source: Synopsys
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Synopsys announces 1st wave of Multiphysics Fusion solutions for chip design | interview
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by Dean Takahashi
June 17, 2026
5 min
Become a member of GB MAX to gain exclusive access to the industry and to the most influential global B2B leadership community in the business of gaming, entertainment,
2026-06-18
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2026-06-18
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SENSORS
The quest for better chip design accelerates
By Matt Hamblen Jun 17, 2026 12:01pm
Sensors Applications Sensors Markets Automotive / Transportation Defense / Aerospace
Synopsy
2026-06-18
news.google.com
2026-06-18
Stock Titan