Semiconductor News & Analysis Feed
82 articles
2026-07-08
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2026-07-08
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2026-07-07
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2026-07-07
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2026-07-07
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2026-07-07
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2026-07-06
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2026-07-06
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2026-07-06
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2026-07-06
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2026-07-06
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2026-07-06
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2026-07-05
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2026-07-05
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2026-07-05
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2026-07-05
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2026-07-04
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2026-07-04
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2026-07-03
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2026-07-03
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2026-07-02
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2026-07-02
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INDUSTRY APPLICATIONS
kaist
ai agents
hbm
design automation
KAIST Showcases AI Agents for HBM Design Automation
1 sources
|
July 2, 2026
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By LDS Team
5.3
Relevance Score
Photo: newsimg.koreatimes.co.kr · rights & takedowns
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KAIST's TERALab, led by electrical engineering professor Kim Joung-ho, will host a public workshop on July 3, 2026 showcasing AI agents that automate high-b
2026-07-02
letsdatascience.com
2026-07-02
Let's Data Science
INFRASTRUCTURE
hbm packaging
semiconductor investment
south korea
semiconductors
Samsung and SK hynix Build HBM Packaging Fabs
15 sources
|
July 2, 2026
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By LDS Team
7.4
Relevance Score
Photo: newsimg.koreatimes.co.kr · rights & takedowns
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Samsung Electronics and SK hynix will build new high-bandwidth memory (HBM) packaging fabs in South Korea's Chungcheong region as part of a
2026-07-01
letsdatascience.com
2026-07-01
Let's Data Science
INFRASTRUCTURE
high bandwidth memory
semiconductor investment
south korea
samsung
Samsung and SK Hynix Commit Trillions to AI Chip Capacity
7 sources
|
July 1, 2026
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By LDS Team
8.1
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Photo: japantimes.co.jp · rights & takedowns
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Samsung Electronics and SK Hynix pledged 3,200 trillion won ($2.07 trillion) in combined investment tied to South Korea's national semic
2026-07-01
letsdatascience.com
2026-07-01
Let's Data Science
INFRASTRUCTURE
amd
versal
memory on package
lpddr5x
AMD Introduces Versal Gen 2 Memory-on-Package SoC
6 sources
|
June 30, 2026
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By LDS Team
7.0
Relevance Score
Photo: cdn.wccftech.com · rights & takedowns
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AMD announced the Versal Premium Gen 2 Memory on Package adaptive SoC family, integrating up to 32 GB of LPDDR5X on-package memory with up to 288 GB/s of bandwidth, accordin
2026-06-30
letsdatascience.com
2026-06-30
Let's Data Science
INFRASTRUCTURE
nvidia
rubin ultra
chiplets
packaging
Nvidia drops quad-die Rubin Ultra for dual-die
4 sources
|
June 30, 2026
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By LDS Team
7.2
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Photo: cdn.mos.cms.futurecdn.net · rights & takedowns
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Nvidia canceled a planned quad-die version of its Rubin Ultra AI accelerator and moved to a dual-die design, citing "manufacturing execution concerns," Tom's Hardware
2026-06-30
letsdatascience.com
2026-06-30
Let's Data Science
POLICY & REGULATION
dram
memory chips
antitrust
supply chain
Memory chipmakers face US class-action over DRAM shift
7 sources
|
June 30, 2026
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By LDS Team
6.7
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Photo: img.etimg.com · rights & takedowns
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Seventeen consumers and small businesses filed a proposed US class-action lawsuit in the Northern District of California alleging Samsung Electronics, SK hynix, a
2026-06-29
letsdatascience.com
2026-06-29
Let's Data Science
INFRASTRUCTURE
south korea
semiconductors
ai infrastructure
samsung
South Korea unveils $649B chip and AI plan
9 sources
|
June 28, 2026
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By LDS Team
8.2
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South Korean President Lee Jae Myung on June 29, 2026 unveiled three public-private mega-projects totaling roughly 1,000 trillion won (about $649 billion) in semiconductor, AI data center, and physical-AI (rob
2026-06-29
letsdatascience.com
2026-06-29
Let's Data Science
FUNDING & BUSINESS
nvidia
ai chips
ai markets
funding
NVIDIA Appears Among Top Semiconductor Picks
3 sources
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June 28, 2026
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By LDS Team
5.0
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Photo: s.yimg.com · rights & takedowns
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For AI infrastructure practitioners and procurement teams, NVIDIA's financial scale is now as consequential as its chip roadmap. Insider Monkey ranks NVIDIA among the top semiconduct
2026-06-27
letsdatascience.com
2026-06-27
Let's Data Science
FUNDING & BUSINESS
m&a
semiconductors
edge ai
onsemi
Onsemi acquires Synaptics in $7B all-stock deal
9 sources
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June 26, 2026
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By LDS Team
7.3
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Photo: cdn.mos.cms.futurecdn.net · rights & takedowns
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Onsemi and Synaptics agreed to an all-stock acquisition valued at approximately $7 billion, the companies announced in filings and press coverage (CNBC, Tom's Hardwa
2026-06-26
letsdatascience.com
2026-06-26
Let's Data Science
INFRASTRUCTURE
semiconductors
ibm
sub 1nm
IBM debuts 0.7nm Nanostack with nearly 100B transistors
5 sources
|
June 25, 2026
8.5
Relevance Score
Photo: storagereview.com · rights & takedowns
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IBM unveiled the world's first sub-1 nanometer chip technology on June 25, 2026, using a new 0.7nm "Nanostack" 3D transistor architecture (also called 7 angstrom). The chip packs nearly 100