168 articles
2026-05-15
embeddedcomputing.com
2026-05-15
Embedded Computing Design
__fail__
2026-05-15
www.ad-hoc-news.de
2026-05-15
AD HOC NEWS
__fail__
2026-05-15
www.openpr.com
2026-05-15
openPR.com
__fail__
2026-05-15
digitimes.com
2026-05-15
Malaysia is accelerating efforts to expand beyond semiconductor assembly and testing into chip design, following a government-backed initiative tied to access to Arm technology.
2026-05-15
news.google.com
2026-05-15
AMD
__fail__
2026-05-14
finance.yahoo.com
2026-05-14
Yahoo Finance
__fail__
2026-05-14
www.marketbeat.com
2026-05-14
MarketBeat
__fail__
2026-05-14
www.communicationstoday.co.in
2026-05-14
Communications Today
__fail__
2026-05-14
www.theglobeandmail.com
2026-05-14
The Globe and Mail
__fail__
2026-05-14
digitimes.com
2026-05-14
Samsung Electronics is reportedly reviving delayed semiconductor initiatives across next-generation NAND flash, compound semiconductors, advanced packaging, and substrates — areas it set aside after more than a year of prioritizing DRAM design and high-bandwidth memory (HBM) competitiveness. The move signals a shift from catch-up mode back toward longer-term technology investment.
2026-05-14
digitimes.com
2026-05-14
IC design firm QBit Semiconductor will list on the Emerging Stock Board on May 15, 2026, and chairman Simon Shen, a former Kinpo executive, said the debut marks a new milestone for the company and underscores a promising growth outlook.
2026-05-14
www.techradar.com
2026-05-14
TechRadar
Copy linkFacebookXWhatsappRedditPinterestFlipboardThreadsEmailShare this article0Join the conversationFollow usAdd us as a preferred source on GoogleNewsletterSubscribe to our newsletterZAM stacks nine functional memory layers vertically inside every compact moduleEach ZAM memory layer reportedly contains exactly 1.125GB of DRAM capacityEstimated ZAM bandwidth figures now approach Nvidia HBM4 perf
2026-05-14
finance.yahoo.com
2026-05-14
Yahoo Finance
__fail__
2026-05-14
embeddedcomputing.com
2026-05-14
Embedded Computing Design
__fail__
2026-05-13
asia.nikkei.com
2026-05-13
Nikkei Asia
__fail__
2026-05-13
digitimes.com
2026-05-13
Taiwan's ASIC and design services sector is showing sharply diverging fortunes in 2026, with new monthly revenue data highlighting strong momentum for GUC while rivals Faraday and Alchip face a slower start to the year.
2026-05-13
digitimes.com
2026-05-13
L&T Semiconductor Technologies' multiyear agreement with Synopsys to use AI-enabled multiphysics simulation software could accelerate the development of power modules and intelligent power modules, potentially affecting global electric mobility, renewable energy, and industrial automation by improving design efficiency, reliability, and time-to-market for next-generation power electronics, and by
2026-05-13
digitimes.com
2026-05-13
Imec's IC-Link has joined TSMC's OIP 3DFabric Alliance, opening up broader access to TSMC's 3D stacking and packaging technologies for global ASIC customers. The move could accelerate the development of multi-die systems, smoothing paths to high-volume manufacturing and benefiting designers across AI, high-performance computing, automotive, and telecommunications markets worldwide—as well as techn
2026-05-13
digitimes.com
2026-05-13
As AI server orders surge, system assembly makers are finding that more business does not always mean better profits. High-priced GPUs and soaring memory costs are pushing up revenue without lifting manufacturing fees at the same pace, leaving original design manufacturers (ODMs) facing lower gross margins as assembly orders grow.
2026-05-13
www.newelectronics.co.uk
2026-05-13
New Electronics
The agreement supports the European Chips Design Platform (EuroCDP), a project aimed at encouraging closer collaboration between the European Union, member states and industry partners. Through this initiative, companies accepted into the Chips JU programme will gain access to Siemens’ electronic design automation (EDA) software under predefined pricing and conditions.The arrangement is intended t