Semiconductor News & Analysis Feed
471 articles
2026-05-16
www.ad-hoc-news.de
2026-05-16
AD HOC NEWS
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2026-05-15
www.newelectronics.co.uk
2026-05-15
New Electronics
The company said growth will be driven largely by demand for artificial intelligence (AI) and high-performance computing, which are expected to account for around 55 per cent of the total market. Smartphones are projected to contribute 20 per cent, while automotive applications are expected to make up around 10 per cent.To meet rising demand, TSMC said it is accelerating capacity expansion, partic
2026-05-15
www.electronicsweekly.com
2026-05-15
Electronics Weekly
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2026-05-15
eetimes.com
2026-05-15
Aalyia Shaukat
Power electronics reliability and packaging materials are explored with Henkel’s Burcak Conley in a PowerUP interview discussion.
2026-05-14
www.newelectronics.co.uk
2026-05-14
New Electronics
The 3DFabric Alliance forms part of TSMC’s broader ecosystem and is designed to support innovation and adoption of advanced integration techniques. These include a range of 2.5D and 3D packaging technologies such as SoIC, CoWoS, InFO and wafer-level integration platforms. Through participation in the alliance, IC‑Link will gain access to these technologies while contributing its design and manufac
2026-05-14
www.techtimes.com
2026-05-14
Tech Times
Samsung Electronics' Device Solutions (DS) Division, now stabilized after a year-long emergency push to rescue its core memory business, is resuming investment in next-generation NAND flash, compound semiconductors, and advanced packaging — but an 18-dayworker walkout looming as soon as May 21could freeze those plans before they start.The timing is pointed.Samsung and its largest labor union faile
2026-05-13
www.electronicsweekly.com
2026-05-13
Electronics Weekly
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2026-05-13
www.newelectronics.co.uk
2026-05-13
New Electronics
The agreement supports the European Chips Design Platform (EuroCDP), a project aimed at encouraging closer collaboration between the European Union, member states and industry partners. Through this initiative, companies accepted into the Chips JU programme will gain access to Siemens’ electronic design automation (EDA) software under predefined pricing and conditions.The arrangement is intended t
2026-05-12
www.oracle.com
2026-05-12
Oracle
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2026-05-12
www.electronicsforyou.biz
2026-05-12
Electronics For You BUSINESS
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2026-05-11
www.electronicsweekly.com
2026-05-11
Electronics Weekly
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2026-05-11
www.newelectronics.co.uk
2026-05-11
New Electronics
Several customers are said to have approached the South Korean chipmaker with proposals that include direct investment in new manufacturing capacity and financial support for equipment purchases.These offers are certainly unusual in the memory sector, where chipmakers have traditionally funded their own expansion rather than relying on customer backing.The proposals reportedly include funding for
2026-05-11
www.electronicsforyou.biz
2026-05-11
Electronics For You BUSINESS
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2026-05-11
pulse.mk.co.kr
2026-05-11
매일경제
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2026-05-11
www.chosun.com
2026-05-11
조선일보
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2026-05-08
www.electronicsforyou.biz
2026-05-08
Electronics For You BUSINESS
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2026-05-07
www.openpr.com
2026-05-07
openPR.com
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2026-05-07
koreajoongangdaily.joins.com
2026-05-07
Korea JoongAng Daily
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2026-05-06
www.msn.com
2026-05-06
MSN
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2026-05-06
www.newelectronics.co.uk
2026-05-06
New Electronics
Organised by the School of Electrical and Electronic Engineering and supported by semiconductor firm EnSilica and a number of industry sponsors, the initiative used the Tiny Tapeout framework to deliver practical ASIC design experience. The approach, which uses a multi-project wafer (MPW) model, enables multiple designs to be manufactured together at reduced cost.According to organisers, the event