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2026-06-10
www.tomshardware.com
2026-06-10
Tom's Hardware
Tech Industry
Google reportedly books Intel for packaging more than 3 million TPUs in 2028 — SK hynix is testing Intel's EMIB packaging for HBM integration
News-analysis
By Luke James published 3 days ago
TSMC's CoWoS lines are sold out through 2027, and Intel's EMIB is the only credible second source.
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2026-06-10
en.clickpetroleoegas.com.br
2026-06-10
CPG Click Petróleo e Gás
3 min of reading
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Samsung eyes strategic chip factory in South Korea and could shake up the global AI landscape with advancements in HBM memories and advanced packaging.
Written by
Caio Aviz
Published on
10/06/2026 at 08:11
Artificial Intelligence (AI)
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Possible investment in Gwangju could place Samsu
2026-06-10
www.moomoo.com
2026-06-10
Moomoo
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智通财经APP获悉，光大证券发布研报称，玻璃基板凭借其优异特性，逐步成为新一代先进封装介质。当前TGV玻璃基板正处于从实验室基础研究向量产工程化跨越的历史性节点，且呈国外进度领先、国内加速追赶态势。建议紧盯下游客户验证与量产线建
2026-06-10
theedgemalaysia.com
2026-06-10
The Edge Malaysia
Economy Minister Akmal Nasrullah Mohd Nasir (Photo by Shahrill Basri/The Edge)
GEORGE TOWN (June 10): The Advanced Packaging Institute and Research Centre (APIRC) aims to develop 12 local small and medium enterprises (SMEs) in the advanced packaging ecosystem and attract new investments worth RM8.5 billion by 2030.
Economy Minister Akmal Nasrullah Mohd Nasir said the target would be implemented
2026-06-10
www.astutegroup.com
2026-06-10
Astute Group
www.astutegroup.com
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2026-06-10
www.trendforce.com
2026-06-10
TrendForce
[News] Samsung May Announce New Gwangju Advanced Packaging Base by End-June Amid Capacity Expansion
2026-06-10 Semiconductors editor
News
Please note that this article cites information from Hankyung, New Daily, Reuters, and The Dong-A Ilbo.
Samsung Electronics is reportedly looking to expand its advanced packaging capacity. According to Hankyung, sources say the company is pursuing plan
2026-06-10
digitimes.com
2026-06-10
Chang Wah Technology has declared that the global semiconductor inventory correction has ended, with demand recovering in industrial control, networking, and AI data center power management. The shift signals firmer supply-chain conditions, rising leadframe demand, and broader pressure on packaging capacity across Asia — factors with direct implications for global electronics buyers and investors.
2026-06-10
digitimes.com
2026-06-10
Samsung Electronics is considering building an advanced semiconductor packaging facility in the southwestern city of Gwangju, a move that would expand its backend chipmaking footprint as demand for high-bandwidth memory and AI-related chips grows.
2026-06-10
www.indexbox.io
2026-06-10
IndexBox
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2026-06-09
www.bnnbloomberg.ca
2026-06-09
BNN Bloomberg
SEOUL, June 9 (Reuters) - Samsung Electronics is considering the construction of an advanced semiconductor packaging facility in the southwestern South Korean city of Gwangju, the Korea Economic Daily said on Tuesday.
Here are some details:
Samsung is expected to unveil the investment plan at a meeting between South Korean President Lee Jae Myung and the heads of the country’s largest conglomera
2026-06-09
english.cw.com.tw
2026-06-09
天下雜誌
english.cw.com.tw
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2026-06-09
technode.global
2026-06-09
TNGlobal
Silicon Box, a Singapore-based advanced semiconductor panel-level packaging and chiplet integration firm, has on Monday announced that it has secured S$100 million ($77.65 million) in debt financing from leading institutional investors – funds managed by Ares Management Corporation (Ares), InnoVen Capital, January Capital Growth Credit (January Capital), and Abound Capital.
The facility includes
2026-06-09
digitimes.com
2026-06-09
Global semiconductor equipment sales hit a record first-quarter 2026 high, as the AI buildout lifted investment in leading-edge logic, DRAM and advanced packaging.
2026-06-09
digitimes.com
2026-06-09
TSMC's AI capacity crunch is giving Intel its clearest opening in years to re-enter the most advanced chipmaking race, with Google and Nvidia exploring Intel as a potential backup manufacturing and packaging partner for next-generation AI processors.
2026-06-09
digitimes.com
2026-06-09
Optical communications maker PCL Technologies is expanding into high-power laser packaging, with its new Malaysia plant on track to pass customer certification by the end of 2026. Its earlier investment in US silicon photonics firm Skorpios and the acquisition of Pingood Enterprise also form part of the group's co-packaged optics (CPO) strategy.
2026-06-09
www.streetinsider.com
2026-06-09
StreetInsider
www.streetinsider.com
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2026-06-09
www.01net.it
2026-06-09
01net
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2026-06-09
za.investing.com
2026-06-09
Investing.com South Africa
za.investing.com
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2026-06-09
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2026-06-09
Investing.com
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2026-06-09
www.marketscreener.com
2026-06-09
marketscreener.com
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