Semiconductor News & Analysis Feed
557 articles
2026-05-27
www.manilatimes.net
2026-05-27
The Manila Times
~ Enabling Next-Generation Power Solutions ~
SHANGHAI, May 27, 2026 /PRNewswire/ -- USI, a global leader in electronic design and manufacturing services, today announced a breakthrough in advanced power semiconductor packaging technology designed for next-generation power solutions. Leveraging its innovative substrate and module integration capabilities, USI has successfully embedded silicon carb
2026-05-27
www.prnewswire.com
2026-05-27
PR Newswire
USI Showcases Advanced SiC Chip-Embedded Packaging Technology at PCIM Europe 2026 APAC - English
NEWS PROVIDED BY
USI
27 May, 2026, 07:00 CST
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~ Enabling Next-Generation Power Solutions ~
SHANGHAI, May 27, 2026 /PRNewswire/ -- USI, a global leader in electronic design and manufacturing services, today announced a breakthrough in advanced power semiconductor packaging
2026-05-27
marklapedus.substack.com
2026-05-27
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Europe Launches New Chip/Packaging R&D Projects
These projects include GaN/SiC packaging, quasi-monolithic integration, 3D qub
2026-05-27
us.acrofan.com
2026-05-27
acrofan.com
~ Enabling Next-Generation Power Solutions ~
SHANGHAI, May 27, 2026 /PRNewswire/ -- USI, a global leader in electronic design and manufacturing services, today announced a breakthrough in advanced power semiconductor packaging technology designed for next-generation power solutions. Leveraging its innovative substrate and module integration capabilities, USI has successfully embedded silicon carb
2026-05-27
www.01net.it
2026-05-27
01net
www.01net.it
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2026-05-26
www.joplinglobe.com
2026-05-26
The Joplin Globe
TOKYO & NORTH KINGSTOWN, R.I.--(BUSINESS WIRE)--May 26, 2026--
FUJIFILM Corporation announced today that it will present new semiconductor packaging research findings and exhibit its ZEMATES 1 product line of photosensitive insulating materials, including PFAS-free 2 PBO, at the Electronic Components and Technology Conference 2026 (ECTC 2026), May 26–29, 2026, in Orlando, Florida.
As part of the
2026-05-26
sg.finance.yahoo.com
2026-05-26
Yahoo Finance Singapore
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2026-05-26
finance.yahoo.com
2026-05-26
Yahoo Finance
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2026-05-26
www.tradingkey.com
2026-05-26
TradingKey
Optical communication stocks surged on May 26 due to advancements in GPU-HBM integration using fiber optic interconnects. This innovative solution overcomes physical limitations of traditional 2.5D packaging by decoupling compute and memory units, allowing greater HBM capacity and improved thermal management. If successful, it will expand optical interconnects beyond data centers and benefit silic
2026-05-26
www.mk.co.kr
2026-05-26
매일경제
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2026-05-26
letsdatascience.com
2026-05-26
Let's Data Science
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2026-05-26
digitimes.com
2026-05-26
Intel is looking to broaden its foundry strategy beyond the race for advanced process nodes, placing greater emphasis on advanced packaging and glass substrate technologies as it positions Rio Rancho — its New Mexico site — as a global hub for next-generation packaging production.
2026-05-26
digitimes.com
2026-05-26
Huawei has released itsData Storage 2030 white paper, setting out a technology roadmap for the global storage industry over the next five to 10 years, as AI large language models drive data creation into what the company calls the yottabyte era.
2026-05-26
www.tweaktown.com
2026-05-26
TweakTown
AMD's Zen 7 'Grimlock' CPUs will reportedly utilize TSMC's 1.4nm 'A14' node and advanced packaging
The company is also looking to integrate Powertech's FOPLP advanced packaging technology into the Zen 7 architecture, along with next-gen 3D V-Cache.
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Hassam Nasir
Tech Reporter
Published May 25, 2026 2:50 PM CDT
2 minutes & 30 seconds read time
TL;DR: AMD is preparing its Zen 7 "Grim
2026-05-25
www.techpowerup.com
2026-05-25
TechPowerUp
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2026-05-25
www.techpowerup.com
2026-05-25
TechPowerUp
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2026-05-25
wccftech.com
2026-05-25
Wccftech
AMD's next-gen Zen 7 "Grimlock" CPUs are rumored to utilize TSMC's 1.4nm (A14) process tech & new packaging innovations.
The Zen 6 architecture is yet to make a formal entry into mainstream server and consumer segments, and while mass production has already begun on TSMC's 2nm process tech, the company is now prepping its supply chain partners for the next-generation lineup.
In a report by Taiwa
2026-05-25
cybernews.com
2026-05-25
Cybernews
cybernews.com
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2026-05-25
worldbusinessoutlook.com
2026-05-25
World Business Outlook
Home » Scaling Sustainable Manufacturing: The Economic Impact of Advanced Packaging Technologies
Global enterprises face unprecedented regulatory scrutiny and mounting consumer demand for environmentally responsible operations. This paradigm shift fundamentally alters the economic calculus of global supply chains and manufacturing protocols.
Achieving structural Environmental, Social, and Govern
2026-05-25
www.trendforce.com
2026-05-25
TrendForce
[News] AMD Zen 7 Reportedly Built on TSMC A14 Node as Powertech’s FOPLP Packaging Said to Be Under Evaluation
2026-05-25 Semiconductors editor
News
Please note that this article cites information from Commercial Times and TweakTown.
With the CEOs of AMD and NVIDIA arriving in Taiwan back-to-back ahead of COMPUTEX in early June, their visits to key supply chain partners for next-generatio