SemiPulse — Semiconductor Intelligence

China's OSAT providers are trying to move deeper into advanced packaging as artificial intelligence (AI) demand strains global chip packaging supply, creating an opening for companies that have long played a lower-profile role in the semiconductor value chain.

China's OSATs chase bigger role as AI chips strain packaging supply - digitimes

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www.digitimes.com 2026-05-20 digitimes

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Semiconductor Advanced Packaging Cleaning Agents Market Set to Skyrocket by 2032 | Trends & Competitive Analysis - openPR.com

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www.openpr.com 2026-05-19 openPR.com

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Commentary: Sanctions reshaped China's foundry sector — just not in the way markets expected

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digitimes.com 2026-05-19

China's foundry sector is charting a different course as the global semiconductor market remains focused on AI GPUs, the 2nm process node, and advanced packaging. Led by Semiconductor Manufacturing International (SMIC) and Hua Hong Semiconductor, domestic Chinese foundries have not stalled under US sanctions; instead, they are accelerating efforts to build a China-specific foundry ecosystem amid t

Foundry, test costs push PMIC price hikes toward 12-inch wafers

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digitimes.com 2026-05-19

Rising manufacturing costs at upstream foundries and back-end packaging and testing are pushing power management IC (PMIC) makers toward price increases, with global implications for device makers and automotive and data-center operators as firms weigh whether to accept higher PMIC prices or shift strategies amid ongoing worldwide capacity constraints and node migration pressures.

SHMD: Strong recovery and growth outlook driven by AI and advanced packaging, with improved margins - TradingView

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www.tradingview.com 2026-05-18 TradingView

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According to Qunzhi Consulting, the global advanced packaging market size is expected to reach USD 58.7 billion by 2026, increasing by approximately 97% year-on-year. - 富途牛牛

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news.futunn.com 2026-05-18 富途牛牛

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Swancor and RobiChip partner to bring advanced packaging into robots and drones - digitimes

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www.digitimes.com 2026-05-18 digitimes

Swancor Holding and RobiChip Technology announced a strategic partnership to accelerate the adoption of advanced packaging materials and heterogeneous chip system integration in robots, robot dogs, and AI-powered platforms, the firms said at the forum on...The article requires paid subscription.Subscribe Now

Semiconductor Packaging Robotics Technology AI Chips Advanced Packaging Materials Smart Manufacturing Chip Integration Drone Applications Automation Equipment

Hanmi Semiconductor Plans US Expansion to Capture Growing AI Chip Packaging Demand - CXO Digitalpulse

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www.cxodigitalpulse.com 2026-05-18 CXO Digitalpulse

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Nan Ya PCB to ramp up capacity as AI chips drive demand for advanced substrates

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digitimes.com 2026-05-18

Nan Ya PCB, one of Taiwan's leading IC substrate manufacturers, said it expects capital spending to rebound sharply in 2026, potentially reaching a record high, as demand from advanced chip packaging customers accelerates alongside the rapid growth of artificial intelligence (AI) computing.

Assessing Kulicke And Soffa (KLIC) Valuation After Earnings Rebound And Advanced Packaging Investment Plans - simplywall.st

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simplywall.st 2026-05-18 simplywall.st

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Samsung Plans To Transform Your Smartphone & Tablet Into On-Device AI Powerhouses With High-Bandwidth Memory Chips Using Complex Packaging - Wccftech

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wccftech.com 2026-05-17 Wccftech

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Amtech Q1 2026 Earnings: Revenue Surges 31.4% on AI and Advanced Packaging Demand - News and Statistics - IndexBox

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www.indexbox.io 2026-05-17 IndexBox

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