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Trending Companies
NVIDIA84 Micron Technology35 Micron28 TSMC28 Intel26 Samsung25 AMD22 SK Hynix21 Microsoft18 Anthropic15 General Motors13 Meta13 Google13 Apple12 OpenAI11
Trending Technologies
EUV76 3nm59 DRAM30 AI26 HBM24 GPU20 memory chips15 AI infrastructure14 AI chips14 AI accelerators8 semiconductor7 LPDRAM6 CUDA6 data center6 NAND flash6
2026-07-03
How TSMC quietly turned its supply chain into a 'second fleet'
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digitimes.com 2026-07-03
TSMC has accelerated efforts to localize its supply chain in recent years, using joint development, joint validation, and long-term partnerships to help Taiwanese equipment, materials, and chemical suppliers enter the advanced semiconductor supply chain. The move is steadily building a more resilient and complete local supply system, with both CoWoS and panel-level advanced packaging (CoPoS) now s
2026-07-03
EMIB-T Roadmap, Custom HBM, HBM4 Packaging Challenges, Microfluidic Cooling, Photonic Interconnects, and More - SemiAnalysis
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newsletter.semianalysis.com 2026-07-03 SemiAnalysis
2026-07-03
SK hynix to invest $712.5 billion in South Korean operations
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tomshardware.com 2026-07-03 Anton Shilov
SK hynix announces major plan to spend $712.5 billion in its operations in South Korea, but the only detailed investments are spendings on a new NAND fab and a packaging facility.
SK hynixSemiconductor Investment3D NANDHBMDRAMSouth Korean SemiconductorChip ManufacturingMemory Chips
2026-07-02
Can AMKR's 2.5D Packaging Pipeline Drive Long-Term Growth? - TradingView
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www.tradingview.com 2026-07-02 TradingView
2026-07-02
Underfill Adhesives Market Forecast to 2035: Growth Driven by Advanced Packaging and AI Chips - News and Statistics - IndexBox
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www.indexbox.io 2026-07-02 IndexBox
2026-07-02
Nova wins advanced packaging tool order from major foundry - Investing.com
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www.investing.com 2026-07-02 Investing.com
2026-07-02
Nova : WMC™ Expanding Adoption Across the Most Advanced Packaging Processes - marketscreener.com
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www.marketscreener.com 2026-07-02 marketscreener.com
2026-07-02
Nova wins advanced packaging tool order from major foundry By Investing.com - Investing.com Canada
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ca.investing.com 2026-07-02 Investing.com Canada
2026-07-02
Nova WMC™ Expanding Adoption Across the Most Advanced Packaging Processes - PR Newswire
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www.prnewswire.com 2026-07-02 PR Newswire
2026-07-02
Nova WMC™ Expanding Adoption Across the Most Advanced Packaging Processes - PR Newswire
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www.prnewswire.com 2026-07-02 PR Newswire
2026-07-02
Everyone's talking about AI chips. But what makes those chips powerful in the first place? ‘Without advanced packaging, there is no AI,’ says Audrey Charles, SVP, Advanced Packaging & President, Lam Capital. In this episode of Voices From The Valley, Audr - LinkedIn
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www.linkedin.com 2026-07-02 LinkedIn
2026-07-02
SK Hynix to invest $64B in memory chip, packaging plants in Korea - Seeking Alpha
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seekingalpha.com 2026-07-02 Seeking Alpha
2026-07-02
Samsung and SK: "Make the Chungcheong Region a Global Hub for HBM Packaging and NAND" - 매일경제
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www.mk.co.kr 2026-07-02 매일경제
2026-07-02
(LEAD) Samsung, SK hynix to build HBM packaging fabs in Chungcheong region as part of 392 tln won in total investment - Yonhap News Agency
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en.yna.co.kr 2026-07-02 Yonhap News Agency
2026-07-02
Samsung and SK hynix Build HBM Packaging Fabs - Let's Data Science
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letsdatascience.com 2026-07-02 Let's Data Science
2026-07-02
Samsung, SK hynix to build HBM packaging fabs in Chungcheong region as part of W392tr in total investment - The Korea Herald
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www.koreaherald.com 2026-07-02 The Korea Herald
2026-07-02
Samsung, SK hynix to build HBM packaging fabs in Chungcheong region as part of $252.5 bil. in total investment - The Korea Times
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www.koreatimes.co.kr 2026-07-02 The Korea Times
2026-07-02
Samsung, SK hynix to build HBM packaging fabs in Chungcheong region as part of 392 tln won in total investment - Yonhap News Agency
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en.yna.co.kr 2026-07-02 Yonhap News Agency
2026-07-01
[News] ASE Reportedly Raises Advanced Packaging Quotes by More Than 20% in Latest AI-Driven Price Hike - TrendForce
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www.trendforce.com 2026-07-01 TrendForce
[News] ASE Reportedly Raises Advanced Packaging Quotes by More Than 20% in Latest AI-Driven Price Hike 2026-07-01 Semiconductors editor News Please note that this article cites information from MoneyDJ, Liberty Times, and Economic Daily News. AI-driven semiconductor demand is reportedly fueling another round of price increases across the OSAT industry. According to MoneyDJ, citing indust
Advanced PackagingAI ChipsOSAT IndustrySemiconductor Supply ChainTSMCASECoWoSChip Testing
2026-07-01
TSMC Bets on Glass Interposer CoPoS Technology, 2029 Mass Production to Reshape Advanced Packaging Landscape - finance.biggo.com
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finance.biggo.com 2026-07-01 finance.biggo.com