Semiconductor News & Analysis Feed
22 articles
2026-07-09
digitimes.com
2026-07-09
Apple's decision to extend its wireless transmission and RF chip supply agreement with Broadcom through 2031 signals that its shift to fully in-house connectivity is a project measured in years, not quarters. For global consumers, the move suggests Apple will likely continue mixing its own chips with those from outside suppliers to maintain performance and reliability.
2026-07-07
semiengineering.com
2026-07-07
Laura Peters
Having a device that works at time zero is no longer a guarantee of reliability over it...
2026-07-03
digitimes.com
2026-07-03
Samsung Electronics is moving closer to commercialising HBM4E, its seventh-generation high-bandwidth memory (HBM), after internal testing showed reliability yields above 70%, strengthening its bid to gain ground in the AI memory market.
2026-07-02
www.trendforce.com
2026-07-02
TrendForce
[News] Samsung Files New HBM Dummy Die Patent to Enhance High-Stack Reliability; Seen as Aimed at 16-Layer HBM5
2026-07-02 Semiconductors editor
News
Please note that this article cites information from ETNews.
As the industry advances toward higher-layer HBM, Samsung is reportedly developing a new structural design to improve package reliability. According to ETNews, Samsung Electronic
2026-06-29
news.google.com
2026-06-29
EE Times Asia
2026-06-23
chargedevs.com
2026-06-23
Charged EVs
chargedevs.com
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Privacy
2026-06-20
digitimes.com
2026-06-20
As AI computing continues to scale, power systems are facing sharper load swings, along with rising requirements for power density and reliability.
2026-06-16
militaryembedded.com
2026-06-16
Military Embedded Systems
The next frontier: GaN HEMTs for high-reliability space and defense power architectures
Story
June 16, 2026
BLAKE SOILEAU
Infineon Technologies
Stock image
The space and defense industries face the critical challenge of delivering enhanced compute power in compact, efficient packages without compromising reliability or performance. In defense-related applications, in-orbit computing is the ba
2026-06-04
news.google.com
2026-06-04
Electronics Weekly
2026-06-04
www.eenewseurope.com
2026-06-04
eeNews Europe
JEDEC has released two new guideline documents aimed at supporting the growing use of silicon carbide (SiC) power semiconductors in applications ranging from electric vehicles to industrial power systems. The publications, JEP203 and JEP204, were developed by the JC-70.2 Silicon Carbide Subcommittee and are available as free downloads from the JEDEC website.
2026-06-04
semiengineering.com
2026-06-04
Liz Allan
Time-sensitive networking and MACsec allow Auto Ethernet to handle safety-critical func...
2026-06-04
www.01net.it
2026-06-04
01net
www.01net.it
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2026-06-03
www.standard-journal.com
2026-06-03
standard-journal.com
AP
JEDEC® Releases New SiC Guidelines to Improve Reliability and Evaluation in Power Electronics
Business Wire 9 hrs ago 0
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ARLINGTON, Va.--(BUSINESS WIRE)--Jun 3, 2026--
JEDEC Solid State Technology Association, the global leader in standards development for the microelectronics industry, announced the publication of JEP
2026-06-03
finance.yahoo.com
2026-06-03
Yahoo Finance
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2026-06-03
uk.finance.yahoo.com
2026-06-03
Yahoo Finance UK
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2026-06-03
news.google.com
2026-06-03
Business Wire
2026-05-28
digitimes.com
2026-05-28
South Korean semiconductor testing company QRT is expanding its equipment business with a portable chip radiation reliability testing system, aiming to build a larger presence in aerospace and defense markets.
2026-05-28
digitimes.com
2026-05-28
China has brought AI chips into its national security and reliability evaluation framework for the first time, turning what looks like a product certification process into something more consequential: an emerging gatekeeping system for AI computing infrastructure.
2026-05-27
digitimes.com
2026-05-27
China has formally brought AI chips into its national security and reliability evaluation framework for the first time, marking a further expansion of the country's Information Technology Application Innovation procurement policy into AI computing infrastructure.
2026-05-26
digitimes.com
2026-05-26
Heat management has become a critical challenge as HBM technology advances, with higher stacking and faster speeds to meet surging global demand for AI data processing. Efficient control of power density in the die-to-die physical layer between HBM and GPUs is now central to next-generation HBM competitiveness and data center reliability.