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At the OCP APAC Summit, TSMC's Vice President of Advanced Packaging Technology and Services, He Jun, revealed that with CoWoS capacity doubling for three consecutive years, supply is now 'very close' to market demand. However, the advanced packaging supply chain bottleneck is shifting from memory to

Advanced Packaging CoWoS TSMC ABF Substrates Semiconductor Supply Chain AI Chips Wafer Foundry Semiconductor Manufacturing

Thermal Shock-Resistant Substrates Market to Reach 193 Index by 2035 on Sic and Gan Fab Expansion - IndexBox

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news.google.com 2026-08-09

Shanghai Aishengna: The Secretive Company Behind China’s Latest DUV Lithography Push Thoroughly Unmasked, As Beijing Hedges With Glass Substrates And An EUV Prototype - Wccftech

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wccftech.com 2026-07-29

China Advanced Packaging Enters New Wave of Investment as 400 Billion Yuan in Projects Target Chiplet 3D Integration and AI Chip Substrates - Pandaily

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pandaily.com 2026-07-29

Activating glass for next-generation semiconductor substrates - WashU

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news.google.com 2026-07-27

InP substrates emerge as strategic asset as optical engine supply chain heads for reshuffle

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digitimes.com 2026-07-16

Reconfigurable mmWave Microchips Integrate hBN Switches on GaN Substrates - Bioengineer.org

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bioengineer.org 2026-07-10

This technological breakthrough represents a significant advancement in the semiconductor industry's mmWave communication capabilities. The successful integration of hexagonal boron nitride (hBN) switches onto gallium nitride (GaN) substrates opens new pathways for reconfigurable mmWave microchip de

mmWave chips GaN substrate hBN switches RF devices semiconductor materials microwave IC chip integration wireless communication

Scrutinising 50 mm AlN substrates - Compound Semiconductor

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compoundsemiconductor.net 2026-07-07

This article examines the material characteristics and application potential of 50 mm aluminum nitride (AlN) substrates, investigated by a team from the U.S. Naval Research Laboratory (NRL), in collaboration with Crystal IS and Agnitron Technology. The study evaluates whether AlN substrates meet the

AlN substrate compound semiconductor material quality defect density wafer-scale analysis photoluminescence X-ray topography atomic force microscopy

Samsung Electro-Mechanics, Sumitomo Chemical to form glass-core venture for chip substrates

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digitimes.com 2026-07-06

TSMC Accelerates CoPoS Packaging to Replace CoWoS, as Glass Core Substrates Cut Costs 30% and Boost Wafer Utilization Past 90% - Wccftech

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wccftech.com 2026-06-21

Taiwan Semiconductor Manufacturing Company (TSMC) is aggressively advancing CoPoS (Chip-on-Panel-on-Substrate) packaging to replace the existing CoWoS (Chip-on-Wafer-on-Substrate) technology in response to rising demand for AI and compute-intensive applications. Central to this shift is the adoption

Semiconductor Packaging CoPoS CoWoS Glass Substrate Wafer Utilization AI Chips Advanced Packaging TSMC

TSMC Accelerates CoPoS Packaging to Replace CoWoS, as Glass Core Substrates Cut Costs 30% and Boost Wafer Utilization Past 90% - Wccftech

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wccftech.com 2026-06-21

Taiwan Semiconductor Manufacturing Company (TSMC) is aggressively advancing CoPoS (Chip-on-Panel-on-Substrate) packaging to replace the existing CoWoS (Chip-on-Wafer-on-Substrate) technology, driven by the growing demand for AI and high-performance computing. CoPoS utilizes glass core substrates, wh

Semiconductor Packaging TSMC CoPoS CoWoS Glass Substrate AI Chips Advanced Packaging Wafer Utilization

TSMC accelerates glass substrates as Korea risks losing AI packaging lead - CHOSUNBIZ - Chosunbiz

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biz.chosun.com 2026-06-18

Taiwan Semiconductor Manufacturing Company (TSMC) has disclosed verification results for glass substrates, signaling a strategic acceleration in next-generation semiconductor packaging. These substrates are expected to overcome limitations of traditional plastic-based materials, particularly in warp

TSMC Glass Substrate AI Chips Semiconductor Packaging CoWoS Semiconductor Supply Chain NVIDIA Intel

TSMC Bets on Glass for CoWoS as Silicon-Mimicking Thermals Beat Organic Substrates, Yet Mass Production Stays Distant - Wccftech

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wccftech.com 2026-06-17

Taiwan Semiconductor Manufacturing Company (TSMC) is expanding its glass substrate supply chain as the first step in establishing a supply chain for chip-on-panel-on-substrate (CoPoS) packaging technology. This move indicates TSMC's commitment to advancing its chip-on-wafer-on-substrate (CoWoS) pack

Semiconductor Packaging CoWoS Technology Glass Substrate Silicon Thermal Characteristics Organic Substrate Supply Chain Expansion Chip Stacking Advanced Packaging

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