Semiconductor News & Analysis Feed
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2026-05-30
www.hpcwire.com
2026-05-30
HPCwire
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2026-05-30
overclock3d.net
2026-05-30
OC3D
Published: May 29, 2026 | Source: Nvidia | Author: Mark Campbell
Nvidia teases “a new era of PC” ahead of Computex
Nvidia GeForce promises “A New Era of PC”
Nvidia GeForce has posted a cryptic message on Twitter/X, promising “A new era of PC” and a strange set of numbers (25.0528, 121.5990). I know what you are all thinking: “The number Mason, what do they mean?” (Old reference…) We have the ans
2026-05-29
tomshardware.com
2026-05-29
Jake Roach
Acer has two new gaming laptops for Computex, including its first laptop with the Ryzen 9 9955HX3D CPU, and a device that sports triple PCIe 5.0 storage.
2026-05-29
www.prnewswire.com
2026-05-29
PR Newswire
SEMIFIVE Showcases Advanced 3D-IC and Big Die Solutions for AI Semiconductor Innovation at SAFE™ Forum 2026
NEWS PROVIDED BY
SEMIFIVE
May 28, 2026, 18:03 ET
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SAN JOSE, Calif., May 28, 2026 /PRNewswire/ -- SEMIFIVE, a leading global provider of custom AI semiconductor (ASIC) solutions, today announced its participation in the Samsung Advanced Foundry Ecosystem (SAFE™) Fo
2026-05-29
www.marketscreener.com
2026-05-29
marketscreener.com
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2026-05-29
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2026-05-29
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2026-05-29
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2026-05-29
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2026-05-28
www.tomshardware.com
2026-05-28
Tom's Hardware
Tech Industry Manufacturing Semiconductors
Chinese university builds 3D chip design tool tailored to Huawei's ‘LogicFolding’ architecture — 3D design delivers increased performance and better thermal management
News
By Luke James published 20 minutes ago
China now has a prototype tool designed for vertical circuit stacking.
(Image credit: Getty Images)
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2026-05-28
tomshardware.com
2026-05-28
Luke James
The announcement came two days after Huawei presented LogicFolding and its accompanying Tau Scaling Law at ISCAS 2026.
2026-05-28
www.digitimes.com
2026-05-28
digitimes
Peking University researchers have unveiled a prototype electronic design automation (EDA) tool built for "true-3D" chip design, offering a potential missing link for Huawei's LogicFolding architecture and its broader Tau (τ) Scaling Law roadmap.
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2026-05-28
www.digitimes.com
2026-05-28
digitimes
Peking University researchers have unveiled a prototype electronic design automation (EDA) tool built for "true-3D" chip design, offering a potential missing link for Huawei's LogicFolding architecture and its broader Tau (τ) Scaling Law roadmap.
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2026-05-28
digitimes.com
2026-05-28
Peking University researchers have unveiled a prototype electronic design automation (EDA) tool built for "true-3D" chip design, offering a potential missing link for Huawei's LogicFolding architecture and its broader Tau (τ) Scaling Law roadmap.
2026-05-28
www.eurekalert.org
2026-05-28
EurekAlert!
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2026-05-27
digitimes.com
2026-05-27
Huawei's Tau Law proposal is rapidly redirecting attention across China's semiconductor industry away from pure lithography competition and toward advanced packaging, 3D stacking, optical interconnects, and system-level architecture design.
2026-05-26
www.actuia.com
2026-05-26
Actu IA
Artificial intelligence/Huawei Announces LogicFolding: 3D Density Without EUV Machines, Targeting 1.4 nm by 2031
Table of contents
A Temporal Scaling Law to Succeed Moore
LogicFolding: 3D Against EUV, and Its Shades
A 3D Architecture That Isn't Uniquely Huawei's
He Tingbo, the Tutelary Figure of HiSilicon
On May 25, 2026, He Tingbo, president of Huawei's semiconductor department and board member
2026-05-26
overclock3d.net
2026-05-26
OC3D
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2026-05-26
www.digitimes.com
2026-05-26
digitimes
AI computing's massive demand for infrastructure is making interconnect and laser technologies key to overcoming power and bandwidth limits, prompting silicon photonics unicorn Lightmatter to unveil its latest laser product, Guide DR. To advance its...
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2026-05-26
digitimes.com
2026-05-26
Powerchip announced it will present a "3D AI Foundry" showcase at COMPUTEX 2026 to demonstrate 3D wafer-on-wafer (WoW) DRAM stacking, interposers, and Si-cap integrated passive devices as part of an end-to-end offering for AI chips, addressing rising demand for GenAI and high-performance computing for memory capacity, bandwidth, and energy efficiency. The firm said it is leveraging its combined lo
2026-05-26
digitimes.com
2026-05-26
AI computing's massive demand for infrastructure is making interconnect and laser technologies key to overcoming power and bandwidth limits, prompting silicon photonics unicorn Lightmatter to unveil its latest laser product, Guide DR. To advance its 3D-stacked silicon photonics engine, Lightmatter is also working closely with TSMC using its Compact Universal Photonic Engine (COUPE) platform.
2026-05-25
overclock3d.net
2026-05-25
OC3D
Published: May 25, 2026 | Source: Taiwan Commercial Times | Author: Mark Campbell
AMD Zen 7 Details Leak – “Grimlock” to use TSMC A14 node
AMD has big plans for Zen 7 – More cores, more cache, and TSMC A14 silicon
AMD is reportedly planning to use TSMC’s A14 lithography node for its Zen 7 “Grimlock” desktop CPUs. The Taiwan Commercial Times has reported that AMD is already preparing its supply c