Semiconductor News & Analysis Feed

IBM has achieved a significant breakthrough in chip technology by successfully developing sub-1 nanometer manufacturing capabilities, marking a pivotal advancement in the semiconductor industry. This milestone represents a major leap forward in chip design, as the company's novel 3D chip architectur

Researchers at the University of Illinois Urbana-Champaign have made a significant advancement in monolithic three-dimensional chip design, offering a promising path beyond the physical limits of traditional scaling. Led by Professor Qing Cao from the Department of Materials Science and Engineering,

Peking University's School of Integrated Circuits has unveiled a prototype electronic design automation (EDA) tool tailored for Huawei's LogicFolding architecture, a significant step toward domestic chip design autonomy. Unlike conventional 2D design approaches, this tool treats multi-layer chips as

Peking University's School of Integrated Circuits has unveiled a prototype electronic design automation (EDA) tool tailored for Huawei's LogicFolding architecture, marking a significant step toward domestic chip design autonomy. Unlike conventional 2D design methods, this tool employs a true 3D appr