Semiconductor News & Analysis Feed
31 articles
2026-07-03
www.electronicsweekly.com
2026-07-03
Electronics Weekly
2026-07-02
www.gsmarena.com
2026-07-02
GSMArena.com
At the SAFE Forum (Samsung Advanced Foundry Ecosystem), Samsung revealed its plans for future semiconductor nodes. Last year, the company unveiled the Exynos 2600, the first 2nm smartphone chip – this one was made on the SF2 node as Samsung calls it.
Next up is SF2P, which will reduce power consumption by 26% and raise clock speeds by 15%. The new node is only partially responsible for these impr
2026-07-01
wccftech.com
2026-07-01
Wccftech
At the SAFE Forum 2026, Samsung announced that the development of its 1.4nm process is going smoothly, but the company also unveiled a new surprise: the company is working on an improved iteration called 1.4nm+, or SF1.4+. Additionally, a new 2nm roadmap was shared by the Korean giant during the conference as Samsung gets serious about sharing the competition pool with TSMC and Intel.
2026-07-01
www.sammobile.com
2026-07-01
SamMobile
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Mass production of the company's 1.4nm chips has been delayed by two years compared to its original plan.
Samsung Foundry's Shin Jong-shin delivering a keynote speech during SAFE Forum 2026 event in Korea - Source: Samsung Electronics
Earlier today, Samsung Foundry held its SAFE Forum 2026 event in South Korea. During
2026-07-01
wccftech.com
2026-07-01
Wccftech
Samsung Electronics is all set to tackle Intel 14A and TSMC A14 with its own 1.4nm process technology, which should be ready in 2029.
Intel and TSMC are one of the leading firms working on 1.4nm class process technologies. Although each technology is fundamentally different than one another, both are officially designated as 1.4nm products. TSMC's A14 fabs are expected to come online next year &
2026-06-30
digitimes.com
2026-06-30
Samsung Electronics is moving forward again on its 1.4nm foundry process, but on a slower schedule than originally planned, The Bellreported, citing industry sources.
2026-06-29
digitimes.com
2026-06-29
BYD plans to install its first in-house smart-driving chip in a Denza production model in 2027, marking a key step in the Chinese automaker's push to extend vertical integration from electrification into intelligent driving.
2026-06-27
digitimes.com
2026-06-27
Apple is reportedly considering adopting 1.4nm process technology for its flagship smartphone SoCs as early as 2028, implying that flagship chips built on the 2nm generation could have a lifecycle of only about two years.
2026-06-15
www.tweaktown.com
2026-06-15
TweakTown
Google is in talks with Samsung to build next-gen 'Icefish' TPU on 1.4nm and 2nm process split
Google's Icefish TPU may be split between Samsung and TSMC, with 1.4nm compute dies and 2nm memory I/O targeting a 2028 production timeline.
VIEW GALLERY - 3
Hassam Nasir
Tech Reporter
Published Jun 14, 2026 8:30 PM CDT
2-minute read time
TL;DR: Google is reportedly planning a multi-foundry strategy fo
2026-06-07
digitimes.com
2026-06-07
Japan's Ministry of Economy, Trade and Industry announced on June 5, 2026, that the government completed an additional JPY150 billion (US$937.9 million) capital injection into Rapidus, the national semiconductor champion formed to commercialize advanced node chips, to fund plant construction, equipment and research for 2nm and 1.4nm chips. The funding was executed through the Information-Technolog
2026-06-03
www.trendforce.com
2026-06-03
TrendForce
[News] Samsung Foundry Reportedly in Talks With Chinese Carmakers Like BYD for 2nm, 4nm Autonomous Driving SoCs
2026-06-03 Semiconductors editor
News
Please note that this article cites information from Seoul Economic Daily and EE Times China.
Samsung Foundry appears poised to win new business from China’s leading automakers. According to Seoul Economic Daily, industry sources say Samsun
2026-05-27
en.sedaily.com
2026-05-27
Seoul Economic Daily
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2026-05-26
qz.com
2026-05-26
qz.com
EMERGING TECHNOLOGIES
Huawei is unveiling a new 3D chip design it says can close the gap with global leaders
The Chinese tech giant says its new stacked-chip architecture can deliver transistor density equivalent to 1.4nm processes by 2031, without access to advanced lithography tools
By
Cris Tolomia
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Published 16 minutes ago
2026-05-26
www.tweaktown.com
2026-05-26
TweakTown
AMD's Zen 7 'Grimlock' CPUs will reportedly utilize TSMC's 1.4nm 'A14' node and advanced packaging
The company is also looking to integrate Powertech's FOPLP advanced packaging technology into the Zen 7 architecture, along with next-gen 3D V-Cache.
VIEW GALLERY - 3
Hassam Nasir
Tech Reporter
Published May 25, 2026 2:50 PM CDT
2 minutes & 30 seconds read time
TL;DR: AMD is preparing its Zen 7 "Grim
2026-05-25
tomshardware.com
2026-05-25
Etiido Uko
Flagship Huawei Mate 90 series will be the first commercial processors to feature the LogicFolding architecture
2026-05-25
www.tomshardware.com
2026-05-25
Tom's Hardware
Tech Industry Manufacturing Semiconductors
Huawei claims sanctions-busting breakthrough with 1.4nm-class chips by 2031, claims 55% higher transistor density — firm claims new LogicFolding chip architecture can bypass EUV restrictions, introduces 'Tau Scaling Law' to replace Moore's Law
News
By Etiido Uko published 11 hours ago
Flagship Huawei Mate 90 series will be the first commercial processo
2026-05-25
wccftech.com
2026-05-25
Wccftech
The U.S. sanctions may have closed Huawei’s trading capabilities with other countries to obtain access to the latest lithography and paraphernalia associated with mass producing next-generation chips, but what it also did was fuel the company’s desire to carve its mark without relying on overseas firms. Today, Huawei announced that by 2031, it will have chips with a manufacturing process equivalen
2026-05-25
wccftech.com
2026-05-25
Wccftech
AMD's next-gen Zen 7 "Grimlock" CPUs are rumored to utilize TSMC's 1.4nm (A14) process tech & new packaging innovations.
The Zen 6 architecture is yet to make a formal entry into mainstream server and consumer segments, and while mass production has already begun on TSMC's 2nm process tech, the company is now prepping its supply chain partners for the next-generation lineup.
In a report by Taiwa
2026-05-25
www.digitimes.com
2026-05-25
digitimes
HiSilicon president and Huawei Technologies director He Tingbo. Credit: Xinhua
As the global semiconductor industry confronts the limits of Moore's Law, Huawei has unveiled a new roadmap aimed at extending chip performance growth through architecture, interconnect, and system-level optimisation rather than pure transistor...
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2026-05-25
digitimes.com
2026-05-25
As the global semiconductor industry confronts the limits of Moore's Law, Huawei has unveiled a new roadmap aimed at extending chip performance growth through architecture, interconnect, and system-level optimisation rather than pure transistor miniaturisation.