Semiconductor News & Analysis Feed
627 articles
2026-05-26
digitimes.com
2026-05-26
Huawei has released itsData Storage 2030 white paper, setting out a technology roadmap for the global storage industry over the next five to 10 years, as AI large language models drive data creation into what the company calls the yottabyte era.
2026-05-26
digitimes.com
2026-05-26
Ennostar Holdings' transformation has begun to show clear results, with chairman Paul Peng saying the company's "3+1" strategy is taking shape, as higher-value applications now account for more than half of revenue. Despite continued uncertainty in the global environment, Peng remains cautiously optimistic about the second half of 2026 and expects the company to maintain relatively strong performa
2026-05-26
www.tweaktown.com
2026-05-26
TweakTown
AMD's Zen 7 'Grimlock' CPUs will reportedly utilize TSMC's 1.4nm 'A14' node and advanced packaging
The company is also looking to integrate Powertech's FOPLP advanced packaging technology into the Zen 7 architecture, along with next-gen 3D V-Cache.
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Hassam Nasir
Tech Reporter
Published May 25, 2026 2:50 PM CDT
2 minutes & 30 seconds read time
TL;DR: AMD is preparing its Zen 7 "Grim
2026-05-26
www.benzinga.com
2026-05-26
Benzinga
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2026-05-25
www.techpowerup.com
2026-05-25
TechPowerUp
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2026-05-25
www.techpowerup.com
2026-05-25
TechPowerUp
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2026-05-25
wccftech.com
2026-05-25
Wccftech
AMD's next-gen Zen 7 "Grimlock" CPUs are rumored to utilize TSMC's 1.4nm (A14) process tech & new packaging innovations.
The Zen 6 architecture is yet to make a formal entry into mainstream server and consumer segments, and while mass production has already begun on TSMC's 2nm process tech, the company is now prepping its supply chain partners for the next-generation lineup.
In a report by Taiwa
2026-05-25
cybernews.com
2026-05-25
Cybernews
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2026-05-25
worldbusinessoutlook.com
2026-05-25
World Business Outlook
Home » Scaling Sustainable Manufacturing: The Economic Impact of Advanced Packaging Technologies
Global enterprises face unprecedented regulatory scrutiny and mounting consumer demand for environmentally responsible operations. This paradigm shift fundamentally alters the economic calculus of global supply chains and manufacturing protocols.
Achieving structural Environmental, Social, and Govern
2026-05-25
www.trendforce.com
2026-05-25
TrendForce
[News] AMD Zen 7 Reportedly Built on TSMC A14 Node as Powertech’s FOPLP Packaging Said to Be Under Evaluation
2026-05-25 Semiconductors editor
News
Please note that this article cites information from Commercial Times and TweakTown.
With the CEOs of AMD and NVIDIA arriving in Taiwan back-to-back ahead of COMPUTEX in early June, their visits to key supply chain partners for next-generatio
2026-05-25
www.techinasia.com
2026-05-25
Tech in Asia
A member of The Business Times. Copyright © 2026 Tech in Asia. All Rights Reserved.
Tata Electronics plans to start chip packaging for global automotive and industrial clients at its new OSAT plant in Jagiroad, Assam, ahead of a wider ramp-up later this year, people familiar with the matter said.
OSAT, or outsourced semiconductor assembly and test, refers to packaging, testing, and inspection af
2026-05-25
digitimes.com
2026-05-25
Nan Pao Resins Chemical is accelerating its push into the high-end semiconductor materials market through a joint venture with Advanced Echem Materials Company and Trusval Technology, forming Advanced Pao Trusval Technology to target advanced packaging adhesive materials.
2026-05-25
digitimes.com
2026-05-25
Huawei is using self-developed packaging technology to build ultra-high-capacity enterprise SSDs, underscoring how Chinese technology companies are increasingly turning to advanced packaging and system-level engineering to navigate US semiconductor restrictions.
2026-05-25
digitimes.com
2026-05-25
Below are the most-read DIGITIMES Asiastories from the week of May 18-24, 2026:
2026-05-23
www.tweaktown.com
2026-05-23
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Huawei produces 122TB SSDs using proprietary packaging to work around US semiconductor
2026-05-23
simplywall.st
2026-05-23
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Will Broadcom Joining EPIC Platform Reshape Applied Materials' (AMAT) Advanced Packaging and AI Narrative?
May 23, 2026
Simply Wall St
Reviewed by Sasha Jovanovic
Earlier in May 2026, Applied Materials reported second-quarter sales of US$7.91 billion and net income of US$
2026-05-23
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2026-05-23
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Vadzo Imaging Introduces Innova-234CGS Color Camera: 2MP Global Shutter Gigabit Ethernet Camera Based on Onsemi AR0234 Sensor
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May 22, 2026 at 10:00 AM EDT
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2026-05-22
www.theglobeandmail.com
2026-05-22
The Globe and Mail
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2026-05-22
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2026-05-22
TradingView
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