Semiconductor News & Analysis Feed
49 articles
2026-06-11
digitimes.com
2026-06-11
AI servers and high-voltage electric vehicles (EVs) are tightening the global supply of high-end multilayer ceramic capacitors (MLCCs), prompting some Taiwan supply chain players to qualify Chinese alternatives such as Chaozhou Three-Circle as lead times lengthen.
2026-06-10
digitimes.com
2026-06-10
Aker Technology plans to expand capacity by 20% in 2026 as automotive demand grows and the quartz component supplier pushes further into AI servers, optical modules, and industrial control applications.
2026-06-09
digitimes.com
2026-06-09
LG Innotek is expanding semiconductor substrate production in Vietnam as rising demand for server components reshapes capacity across the substrate industry, fueling expectations that supply of RF-SiP substrates used in premium smartphones could tighten.
2026-06-08
www.tradingview.com
2026-06-08
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ROHM's SiC MOSFET Adopted in BBU for AI Servers as HVDC Architectures Advance
ROHM's SiC MOSFET Adopted in BBU for AI Servers as HVDC Architectures Advance
2 min read
ROHM Co., Ltd./ Key word(s): Miscellaneous
ROHM's SiC MOSFET Adopted in BBU for AI Servers as HVDC Architectures Advance
08.06.2026 / 09:05 CET/CEST
The issuer is solely responsible for the content of this announceme
2026-06-08
www.digitimes.com
2026-06-08
digitimes
Nvidia and SK Hynix formally announced a multiyear technology partnership on June 7 at SK's Seorin Building in Seoul, during Jensen Huang's third public meeting with SK Group chairman Chey Tae-won on this Korea trip. The agreement covers next-generation...
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2026-06-08
www.digitimes.com
2026-06-08
digitimes
Nvidia and SK Hynix formally announced a multiyear technology partnership on June 7 at SK's Seorin Building in Seoul, during Jensen Huang's third public meeting with SK Group chairman Chey Tae-won on this Korea trip. The agreement covers next-generation...
Some subscribers prefer to save their log-in information so they do not have to enter their User ID and Password each time they
2026-06-08
digitimes.com
2026-06-08
Lead frame manufacturer Chang Wah Technology Co. (CWTC) says that as applications such as data centers, AI servers, and industrial control systems continue to grow rapidly, market demand for power management components is steadily increasing, driving growth in lead frame shipments. Demand for microcontrollers (MCUs) used in PCs, networking equipment, industrial control systems, and electric vehicl
2026-06-07
digitimes.com
2026-06-07
Strong demand for memory procurement from AI servers continues, and ADATA chairman Simon Chen believes the AI expansion cycle is expected to sustain strong growth for at least another four to five years. As a result, ADATA is adding AI data center construction as a new business focus, working with strategic partners to deploy projects in four countries, including Brazil and Malaysia. The company e
2026-06-05
tomshardware.com
2026-06-05
Jowi Morales
These "makeshift" structures are housing hardware that costs millions of dollars in total.
2026-06-04
www.semiconductor-today.com
2026-06-04
Semiconductor Today
ROHM’s 750V SiC MOSFET adopted in battery backup unit for AI servers
ROHM says that its 750V silicon carbide (SiC) MOSFET has been adopted in a BBU (battery backup unit) for AI server power supplies. With the rise of generative AI, AI server power systems are shifting to higher voltages and rapidly transitioning to HVDC (high-voltage direct current) architectures. In this environment, ROHM’s devi
2026-06-04
news.google.com
2026-06-04
GlobeNewswire
2026-06-03
www.stocktitan.net
2026-06-03
Stock Titan
__fail__
2026-06-03
www.presseagentur.com
2026-06-03
presseagentur.com
ROHM’s SiC MOSFET Adopted in BBU for AI Servers as HVDC Architectures Advance
Willich-Münchheide, Germany, June 03, 2026 – ROHM has announced that its 750 V SiC MOSFET has been adopted in a BBU (Battery Backup Unit) for AI server power supplies. With the rise of generative AI, AI server power systems are shifting to higher voltages and rapidly transitioning to HVDC (high-voltage direct current) a
2026-06-02
finance.yahoo.com
2026-06-02
Yahoo Finance
__fail__
2026-06-01
electronics360.globalspec.com
2026-06-01
Electronics360
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2026-05-29
digitimes.com
2026-05-29
Generative AI, HPC, and large data centers are raising demand for chips with higher power efficiency, stronger thermal control, and denser packaging, making advanced packaging a more strategic part of the semiconductor supply chain. In China, panel-level packaging (PLP) is gaining traction for its larger format, higher output, and lower-cost potential.
2026-05-29
digitimes.com
2026-05-29
Foxconn chairman Young Liu said the company is preparing to break ground on its advanced packaging plant in France while continuing to explore sovereign-AI opportunities in Africa, as the electronics manufacturer looks beyond AI servers for its next phase of growth.
2026-05-27
digitimes.com
2026-05-27
Kinpo Electronics outlined its 2026 core strategy at a shareholders' meeting on May 25, centering on "bearing fruit" as it builds on years of product-mix adjustments, expands into AI-related products, and accelerates its shift toward an ODM model.
2026-05-26
www.01net.it
2026-05-26
01net
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2026-05-26
newsroom.st.com
2026-05-26
STMicroelectronics
700V PowerGaN devices improve energy efficiency and enable more compact power designs for AI servers, robotics, industrial systems and advanced consumer applications including home appliances
Alexander Jurman
Technical Media Relations
Tel. +420602748611
alexander.jurman@st.com
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New gallium nitride (GaN)-based power semicondu