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AMD confirms plans to incorporate low-power CPU cores into next-generation heterogeneous CPUs to lower power consumption and improve energy efficiency.

Tech Industry Manufacturing Semiconductors IBM goes sub-1nm, develops 0.7nm-class technology — offering up to 50% higher performance and 70% higher energy efficiency compared to IBM's 2nm-class node News By Anton Shilov published June 26, 2026 It uses two wafers instead of one, along with ultra-thin dielectric bonding (Image credit: IBM) Share this article 5 Join the conversation Follow us Add

The device mimics the brain's ability to selectively forget

As hyperscale cloud providers and enterprise customers race to build increasingly powerful artificial intelligence infrastructure, power delivery and energy efficiency are emerging as critical constraints. Industry analysts expect AI rack power requirements to exceed 1 MW per rack in the coming years.

© STMicroelectronics General | June 02, 2026 STM’s new GaN semiconductors improve energy efficiency Evertiq STMicroelectronics’ new PowerGaN devices deliver high efficiency and power density to high-voltage power supplies. Engineered for a 700V operating rating, they support reliable high-power operation and higher-frequency topologies. New gallium nitride (GaN)-based power semiconductors from ST

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TSMC says energy efficiency has overtaken raw performance as the top priority for AI chip customers TSMC's A14 process targets 20% better performance and 30% lower power than N2, as the industry shifts focus from transistor density to energy efficiency. VIEW GALLERY - 2 Hassam Nasir Tech Reporter Published May 30, 2026 7:30 PM CDT 2 minutes & 15 seconds read time TL;DR: TSMC highlights energy effi

As AI moves from cloud environments into factories and physical systems, semiconductor design is being reshaped by new demands in speed, energy efficiency, and on-site learning. At a recent system-semiconductor seminar in South Korea, Seong-jun Jang, a research center director at the Korea Electronics Technology Institute (KETI), outlined four key architectural directions for future AI chips aimed

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700V PowerGaN devices improve energy efficiency and enable more compact power designs for AI servers, robotics, industrial systems and advanced consumer applications including home appliances Alexander Jurman Technical Media Relations Tel. +420602748611 alexander.jurman@st.com To receive frequent updates via email, subscribe to our press releases. New gallium nitride (GaN)-based power semicondu

Powerchip announced it will present a "3D AI Foundry" showcase at COMPUTEX 2026 to demonstrate 3D wafer-on-wafer (WoW) DRAM stacking, interposers, and Si-cap integrated passive devices as part of an end-to-end offering for AI chips, addressing rising demand for GenAI and high-performance computing for memory capacity, bandwidth, and energy efficiency. The firm said it is leveraging its combined lo

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