Semiconductor News & Analysis Feed
11028 articles
2026-06-16
www.notebookcheck.net
2026-06-16
Notebookcheck
Lenovo has launched a new fast charging brick in China, the 150W Multi-port GaN Power Adapter. It sports a total of three USB-C ports and can offer up to 150W fast charging.
Among the three ports, the C1 and C2 max out at 140W, while the third Type-C port can offer up to 65W of power. When all three of them are connected, the first two can go up to 65W each, while the third one can offer up to 20
2026-06-16
stockstory.org
2026-06-16
StockStory
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2026-06-16
www.gurufocus.com
2026-06-16
GuruFocus
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2026-06-16
www.digitimes.com
2026-06-16
digitimes
The AI data center buildout is driving demand for high-performance computing (HPC) and networking chips, sending the global IC substrate industry into a new growth cycle. Order visibility now extends two to three years, prompting Taiwan's three leading IC...
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2026-06-16
www.insidermonkey.com
2026-06-16
Insider Monkey
NEWS
Taiwan Semiconductor Manufacturing Company Limited (TSM)’s CEO Expresses Concern About Water, Talent Shortages
Published on June 16, 2026 at 2:27 am by ASHAR JAWAD in News
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Taiwan Semiconductor Manufacturing Company Limited (NYSE:TSM) is among the 10 Stocks ChatGPT Predicts Could Make You Wealthy in 3 Years. While speaking at a ceremony for a new science park in Pingtung, the company’s
2026-06-16
finance.yahoo.com
2026-06-16
Yahoo Finance
Taiwan Semiconductor Manufacturing Company Limited (TSM)’s CEO Expresses Concern About Water, Talent Shortages
Ashar Jawad
Mon, June 15, 2026 at 11:27 PM PDT 2 min read
2330.TW
-1.46%
TSM
-3.53%
Trade TSM on Coinbase
Trading disclosure
Taiwan Semiconductor Manufacturing Company Limited (NYSE:TSM) is among the 10 Stocks ChatGPT Predicts Could Make You Wealthy in 3 Years. While speaking at a ceremo
2026-06-16
briefglance.com
2026-06-16
BriefGlance
STMicroelectronics’ Deft $1.5B Maneuver in a Surging Chip Market
📊 KEY DATA
$1.5 billion convertible bond offering by STMicroelectronics
5.5% dip in share price following the announcement
200% stock surge this year, reflecting strong market position
🎯 EXPERT CONSENSUS
Experts would likely conclude that STMicroelectronics' $1.5 billion bond offering is a strategic move to fortify its financial fou
2026-06-16
news.google.com
2026-06-16
EE Times Asia
2026-06-16
seekingalpha.com
2026-06-16
Seeking Alpha
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2026-06-16
www.benzinga.com
2026-06-16
Benzinga
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2026-06-16
timestech.in
2026-06-16
TimesTech
BuzzIndustry News
Infineon Found to Infringe Innoscience Patents, Barred from Selling in China
By TimesTech -
June 16, 2026
0
52
Innoscience, announced that China’s Supreme People’s Court has upheld a sales injunction against certain gallium nitride (GaN) products manufactured by Infineon Technologies AG, bringing a patent infringement dispute between the two companies to a final conclusion in Ch
2026-06-16
drrobertcastellano.substack.com
2026-06-16
Dr. Robert Castellano's Semiconductor Deep Dive Newsletter
AI Is No Longer Limited by Transistors. It Is Becoming Limited by Package Area
DR. ROBERT CASTELLANO
JUN 16, 2026
∙ PAID
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What’s In This Article
The Next AI Bottleneck Has Arrived
Chart 1. CoWoS and CoPoS Cost Crossover
Why CoWoS Is Reaching Its Limits
Table 1. Evolution of TSMC Advanced Packaging Technologies
CoPoS Expands Package Area by More Than 5x
Table 2. CoWoS Versus CoPoS
Panel-Leve
2026-06-16
www.gurufocus.com
2026-06-16
GuruFocus
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2026-06-16
www.uidaho.edu
2026-06-16
University of Idaho
BY CHRIS COOK, U OF I EXECUTIVE DIRECTOR OF ADMISSIONS AND RECRUITMENT & FENG LI, MICRON ENDOWED PROFESSOR IN MICROELECTRONICS AND NGEM DIRECTOR
Semiconductors are no longer a niche corner of the tech economy. They are essential infrastructure. Microchips made from semiconductor materials power artificial intelligence, national defense systems, advanced manufacturing, transportation networks, ene
2026-06-16
www.tradingkey.com
2026-06-16
TradingKey
TSMC is collaborating with Ibiden and Innolux to validate glass substrates for its new CoPoS advanced packaging technology. This shift from wafer-level to panel-level processing aims to overcome limitations of traditional organic and silicon interposers. Simulation results indicate glass substrates offer significant improvements in warpage, thermal expansion, elastic modulus, power integrity, and
2026-06-16
seekingalpha.com
2026-06-16
Seeking Alpha
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2026-06-16
www.ad-hoc-news.de
2026-06-16
AD HOC NEWS
Suess Microtec, DE000A1K0235
New release push: Suess Microtec’s XBC300 Gen2 targets advanced packaging demand
16.06.2026 - 05:05:28 | ad-hoc-news.de
Suess Microtec has introduced the XBC300 Gen2 wafer bonder to address surging demand in advanced packaging and 3D integration, aiming squarely at high-volume semiconductor production rather than lab-scale tools.
Suess Microtec, DE000A1K0235
Edited
2026-06-16
www.morningstar.com
2026-06-16
Morningstar
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Business Wire
Murata Collaborates with Synopsys to Provide Simulation Models Through Ansys Electromagnetic and Thermal Analysis Tools
Murata Collaborates with Synopsys to Provide Simulation Models Through Ansys Electromagnetic and Thermal Analysis Tools
Provided by Business Wire Jun 16, 2026, 10:00:00 AM
Murata Collaborates with Synopsys to Provide Simulation Models Through Ansys Elect
2026-06-16
news.google.com
2026-06-16
EE Times Asia
2026-06-16
www.digitimes.com
2026-06-16
digitimes
Nvidia's dominance in AI is extending beyond model training and deeper into inference—the fast-growing segment of the AI market responsible for running deployed models and generating revenue.
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