296 articles
2026-05-21
tomshardware.com
2026-05-21
Anton Shilov
As memory content per rack increases in Vera Rubin platform, it now accounts for nearly 25% of its cost.
2026-05-21
www.tomshardware.com
2026-05-21
Tom's Hardware
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2026-05-21
www.moomoo.com
2026-05-21
Moomoo
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2026-05-21
www.tradingkey.com
2026-05-21
TradingKey
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2026-05-21
seekingalpha.com
2026-05-21
Seeking Alpha
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2026-05-21
www.tomshardware.com
2026-05-21
Tom's Hardware
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2026-05-21
www.msn.com
2026-05-21
MSN
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2026-05-21
www.moomoo.com
2026-05-21
Moomoo
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2026-05-21
www.msn.com
2026-05-21
MSN
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2026-05-21
www.barrons.com
2026-05-21
Barron's
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2026-05-21
wccftech.com
2026-05-21
Wccftech
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2026-05-21
stocktwits.com
2026-05-21
Stocktwits
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2026-05-21
www.digitimes.com
2026-05-21
digitimes
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2026-05-21
www.digitimes.com
2026-05-21
digitimes
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2026-05-21
finance.yahoo.com
2026-05-21
Yahoo Finance
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2026-05-21
digitimes.com
2026-05-21
Orient Semiconductor Electronics (OSE) said that strong memory market demand is lifting its outlook and expanding its role in the memory supply chain, while also strengthening its importance in surface-mount technology (SMT) for AI server boards with major US clients.
2026-05-21
digitimes.com
2026-05-21
AI is shifting the semiconductor supply chain's next bottleneck from wafer fabrication and HBM memory to ABF substrates — a lower-profile but critical packaging material used in high-end CPUs, GPUs, ASICs, and networking chips.
2026-05-21
tomshardware.com
2026-05-21
Jake Roach
They’ll show up in Ryzen AI Halo boxes “soon,” and pre-orders for Ryzen AI Halo with Strix Halo open in June, starting at $3,999.
2026-05-21
digitimes.com
2026-05-21
China's memory chip industry is entering a critical capital markets phase, with YMTC formally launching IPO counselling and CXMT resuming its STAR Market listing review after updating its prospectus. The parallel moves mark an accelerated push by China's two leading memory chipmakers to secure long-term funding and expand their role in the global semiconductor industry.
2026-05-21
digitimes.com
2026-05-21
SK Hynix is reportedly moving to reshape part of its Cheongju campus around wafer testing, a shift that underscores how high-bandwidth memory, or HBM, is putting new pressure on the back end of the chipmaking process.