Semiconductor News & Analysis Feed

Taiwan Semiconductor Manufacturing Company's expansion of advanced packaging outsourcing is driving significant order growth among Korean post-processing equipment makers. As global semiconductor demand for advanced packaging technologies continues to rise, TSMC's strategic move to expand packaging

TrendForce reports that TSMC is expanding outsourcing of key CoWoS front-end processes to OSATs amid surging demand from NVIDIA and ASIC markets. CoWoS technology is crucial for advanced packaging, particularly for high-performance computing chips used in AI and data center applications. As NVIDIA m