Semiconductor News & Analysis Feed
547 articles
2026-07-04
www.ad-hoc-news.de
2026-07-04
Ad-hoc-news.de
2026-07-04
finance.biggo.com
2026-07-04
finance.biggo.com
2026-07-04
theindependent.sg
2026-07-04
The Independent Singapore News
2026-07-04
digitimes.com
2026-07-04
Machvision posted another record monthly revenue in June 2026, as surging demand for AI servers, high-performance computing (HPC), and advanced packaging continued to lift orders for the semiconductor and PCB inspection equipment maker. The company said the biggest challenge has now shifted from winning orders to managing supply chains and expanding capacity.
2026-07-04
www.klsescreener.com
2026-07-04
KLSE Screener
WHILE much has been said about advanced packaging in the context of Malaysia’s semiconductor sector, little is actually known about what it entails.
The rhetoric is that, since Malaysia has a strong and world-renowned base in semiconductor testing, assembly and packaging dating back to the 1970s, it should be a shoe-in for these local companies to get into advanced packing.
The government is pus
2026-07-04
www.thestar.com.my
2026-07-04
The Star
__fail__
2026-07-04
marklapedus.substack.com
2026-07-04
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AMD, Qualcomm Debut New Packaging Technologies
The new memory packaging technologies address the bandwidth bottleneck issues i
2026-07-04
247wallst.com
2026-07-04
24/7 Wall St.
2026-07-03
www.thelec.net
2026-07-03
thelec.net
Samsung Electronics logo. (Source: Samsung Electronics)
Samsung Electronics is reportedly in discussions with North American artificial intelligence (AI) company Anthropic to manufacture its custom AI chips through Samsung's foundry business. The chips are expected to use Samsung's leading-edge 2-nanometer (2nm) process technology.
According to The Information, citing multiple sources on July 2
2026-07-03
digitimes.com
2026-07-03
As transistor density scaling slows, chipmakers are leaning on advanced packaging to keep improving accelerator performance. A SemiAnalysis roundup of this year's IEEE Electronic Components and Technology Conference described a shift in which Intel, Marvell, TSMC, and others detailed new packaging approaches as packages themselves begin hitting limits.
2026-07-03
digitimes.com
2026-07-03
SK Hynix plans to invest KRW100 trillion (approx. US$64.38 billion) to build new NAND memory chip and advanced packaging facilities in Cheongju, betting that AI demand will keep tightening supply for storage and server memory.
2026-07-03
digitimes.com
2026-07-03
TSMC has accelerated efforts to localize its supply chain in recent years, using joint development, joint validation, and long-term partnerships to help Taiwanese equipment, materials, and chemical suppliers enter the advanced semiconductor supply chain. The move is steadily building a more resilient and complete local supply system, with both CoWoS and panel-level advanced packaging (CoPoS) now s
2026-07-03
newsletter.semianalysis.com
2026-07-03
SemiAnalysis
EMIB-T Roadmap, Custom HBM, HBM4 Packaging Challenges, Microfluidic Cooling, Photonic Interconnects, and More
ECTC 2026 Roundup, Intel, TSMC, SK Hynix, Samsung, Micron, Marvell, Lightmatter, Microsoft
AFZAL AHMAD, DC, GERALD WONG, AND DYLAN PATEL
JUL 03, 2026
∙ PAID
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As transistor density scaling has slowed, advanced packaging has become the primary scaling vector. However, AI acceler
2026-07-03
tomshardware.com
2026-07-03
Anton Shilov
SK hynix announces major plan to spend $712.5 billion in its operations in South Korea, but the only detailed investments are spendings on a new NAND fab and a packaging facility.
2026-07-02
www.tradingview.com
2026-07-02
TradingView
News
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Zacks
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Can AMKR's 2.5D Packaging Pipeline Drive Long-Term Growth?
Can AMKR's 2.5D Packaging Pipeline Drive Long-Term Growth?
3 min read
AMKR
+2.94%
Amkor Technology's AMKR expanding 2.5D packaging pipeline is emerging as a key growth lever as AI and high-performance computing customers shift toward chiplet-based architectures. As semiconductor performance gains increasingly depend on pack
2026-07-02
www.indexbox.io
2026-07-02
IndexBox
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2026-07-02
www.investing.com
2026-07-02
Investing.com
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2026-07-02
www.marketscreener.com
2026-07-02
marketscreener.com
2026-07-02
ca.investing.com
2026-07-02
Investing.com Canada
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2026-07-02
www.prnewswire.com
2026-07-02
PR Newswire
Nova WMC™ Expanding Adoption Across the Most Advanced Packaging Processes
NEWS PROVIDED BY
Nova
02 Jul, 2026, 14:30 IDT
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REHOVOT, Israel, July 2, 2026 /PRNewswire/ -- Nova (NASDAQ: NVMI), today announced the selection of its Nova WMC™ platform by a leading global foundry customer for multiple layers' measurement in the most advanced packaging processes. The selection fol