Semiconductor News & Analysis Feed
20 articles
2026-08-06
www.electrive.com
2026-08-06
2026-08-06
autonews.gasgoo.com
2026-08-06
2026-08-06
autonews.gasgoo.com
2026-08-06
2026-07-24
www.electronicdesign.com
2026-07-24
2026-07-21
chargedevs.com
2026-07-21
2026-07-16
www.indexbox.io
2026-07-16
2026-07-15
www.bisinfotech.com
2026-07-15
2026-07-14
news.google.com
2026-07-14
2026-07-08
www.autocarpro.in
2026-07-08
MAHLE and Infineon have collaborated to develop a specialized cooling architecture for data center power modules, addressing thermal challenges in high-current electronic systems. The project focuses on Infineon's new EasyPACK S module, designed for controlling power supply and switchgear in data ce
2026-07-08
manufacturing.economictimes.indiatimes.com
2026-07-08
MAHLE's development of a cooling unit for Infineon's power modules represents a significant advancement in thermal management for data center applications. This collaboration addresses the growing demand for efficient heat dissipation solutions in high-power density computing environments. As data c
2026-07-01
santoandre.biz
2026-07-01
This article reports the launch of a new power module, the DZ800S17K3, by Infineon, which is certified for quality and designed to meet the growing demands in industrial and automotive electronics. Power modules are critical components in semiconductor devices, widely used in electric vehicles, indu
2026-06-29
www.snsinsider.com
2026-06-29
The power module packaging market is experiencing significant growth driven by the rising adoption of electric vehicles, renewable energy systems, AI-based data centers, and industrial electrification. This technology is critical for enhancing thermal management, reliability, energy density, and eff
2026-06-18
timestech.in
2026-06-18
Infineon's CIPOS Prime 1200V CoolSiC power modules are now available through Mouser Electronics, a leading NPI distributor for semiconductors and electronic components. Designed for high-performance automotive applications in xEVs, these modules integrate automotive-grade CoolSiC MOSFETs in a compac
2026-06-17
www.ad-hoc-news.de
2026-06-17
ON Semiconductor has unveiled its latest silicon carbide and gallium nitride (GaN)-based power module, the EliteSiC FastCharge Power Module, aimed at enhancing the efficiency and performance of next-generation DC fast charging systems. Designed for public chargers, fleet depots, and industrial power
2026-06-16
www.ad-hoc-news.de
2026-06-16
Japanese semiconductor company Resonac has launched its new silicon carbide (SiC) power module line, the Hipo™ MOSFET module, targeting next-generation electric vehicle (EV) and industrial drive systems that demand high efficiency, reliability, and compact design. Built around SiC technology, the mo
2026-06-15
www.thelec.net
2026-06-15
Iron Device has been selected as a joint research institution for a government-backed project to develop embedded power modules for electric vehicle drive circuits. Led by Semi-Powerex, the initiative involves KETI, KATECH, Seoul National University, and Hanyang University, aiming to create gallium
2026-06-15
www.electronicsforyou.biz
2026-06-15
2026-06-12
www.ad-hoc-news.de
2026-06-12
Texas Instruments (TI) launched two compact isolated DC/DC power modules on June 12, 2026, targeting high-power-density designs in electric vehicles and data centers. These modules are engineered to deliver high power density while maintaining a small footprint, making them ideal for systems with ti
2026-06-12
www.digitimes.com
2026-06-12
As wide-bandgap semiconductors like silicon carbide (SiC) and gallium nitride (GaN) gain prominence in electric vehicle powertrains, electronic packaging engineers face mounting thermal challenges. The PCIM 2026 conference highlights the critical issue of thermal warping in direct-cooled EV power mo
2026-06-12