Semiconductor News & Analysis Feed
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2026-07-08
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2026-06-29
www.snsinsider.com
2026-06-29
SNS Insider
The Power Module Packaging market is showing significant growth due to an increase in the usage of electric vehicles, implementation of renewable energy, AI-based data centers, and industrial electrification. Power module packaging technology plays an essential part in improving thermal management, reliability, energy density, and energy efficiency of today's power electronics systems. Adoption of
2026-06-18
timestech.in
2026-06-18
TimesTech
BuzzProducts NewsT&M
Infineon CIPOS Prime 1200V CoolSiC Power Modules, Now at Mouser
By TimesTech -
June 18, 2026
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Mouser Electronics, the industry’s leading New Product Introduction (NPI) distributor with the widest selection of semiconductors and electronic components, is now stocking the CIPOS Prime automotive CoolSiC power modules from Infineon Technologies.
The CIPOS Prime automotive C
2026-06-17
www.ad-hoc-news.de
2026-06-17
AD HOC NEWS
ON Semiconductor, US6821891035
ON Semiconductor unveils new GaN power module for faster, cooler EV charging
17.06.2026 - 01:42:35 | ad-hoc-news.de
ON Semiconductor’s latest silicon carbide and GaN based power module targets next generation DC fast charging, promising higher efficiency, smaller footprints, and lower total cost of ownership for demanding B2B charging operators and industrial power
2026-06-16
www.ad-hoc-news.de
2026-06-16
AD HOC NEWS
Resonac, JP3521500008
New SiC power module push, Resonac Hipo™ MOSFET aims at next-gen EV inverters
16.06.2026 - 13:43:03 | ad-hoc-news.de
Resonac is expanding its silicon carbide portfolio with the Hipo SiC MOSFET module line, targeting high-efficiency inverters for electric vehicles and industrial drives. The modules focus on low loss, high reliability and support for 800-volt architectures in
2026-06-15
www.thelec.net
2026-06-15
thelec.net
(Source: Iron Device)
Iron Device has been selected as a joint research institution for a government-backed project to develop embedded power module technology for electric vehicle drive circuits, the company disclosed on June 15.
The consortium will develop gallium nitride (GaN) modules for electric vehicles operating in 650-volt (V) environments. Semi-Powerex, the lead institution, will overse
2026-06-15
www.electronicsforyou.biz
2026-06-15
Electronics For You BUSINESS
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2026-06-12
www.ad-hoc-news.de
2026-06-12
AD HOC NEWS
Texas Instruments, US8825081040
Texas Instruments Launches Compact Isolated Power Modules for EVs and Data Centers
12.06.2026 - 13:24:32 | ad-hoc-news.de
Texas Instruments has introduced two compact isolated DC/DC power modules for high-power-density designs in EVs and data centers. The launch adds a fresh option for engineers working on tighter power budgets and smaller board spaces.
Texas Inst
2026-06-12
www.digitimes.com
2026-06-12
digitimes
As wide-bandgap (WBG) semiconductors like silicon carbide (SiC) and gallium nitride (GaN) take the lead in electric vehicle (EV) powertrains, electronics packaging engineers are facing a thermodynamic reckoning. To extract maximum performance from these...
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2026-06-12
digitimes.com
2026-06-12
As wide-bandgap (WBG) semiconductors like silicon carbide (SiC) and gallium nitride (GaN) take the lead in electric vehicle (EV) powertrains, electronics packaging engineers are facing a thermodynamic reckoning. To extract maximum performance from these high-frequency, high-efficiency chips, the industry is driving an architectural shift: shrinking inverter volumes, eliminating heavy copper basepl
2026-06-10
www.thelec.net
2026-06-10
thelec.net
Siemens' SENTRON 3QD2 semiconductor circuit breaker. (Photo: Infineon)
Infineon Technologies said on June 8 local time that it will supply 1200V silicon carbide (SiC) power modules, branded as CoolSiC MOSFETs, to Siemens.
Siemens will integrate the modules into its SENTRON 3QD2 solid-state circuit breaker system.
Circuit breakers are designed to protect electrical systems from overloads and sho
2026-06-10
www.newelectronics.co.uk
2026-06-10
New Electronics
www.newelectronics.co.uk
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2026-06-09
www.electronicsmedia.info
2026-06-09
Electronics Media
Nexperia and Semikron Danfoss Explore Strategic Collaboration on SiC Power Modules for Automotive Applications
By Electronics Media -
June 9, 2026
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SiC Power Modules – Nexperia B.V. and Semikron Danfoss GmbH have signed a Memorandum of Understanding (MoU) to explore a strategic collaboration on silicon carbide (SiC)-based power modules for automotive trac
2026-06-07
digitimes.com
2026-06-07
JCET has opened a new advanced manufacturing facility at its Chengdong production base in Jiangyin, strengthening the Chinese OSAT provider's push into advanced packaging for AI computing, power modules, and next-generation data centers.
2026-06-03
www.eurekalert.org
2026-06-03
EurekAlert!
Power module with 1200-V-class GaN transistors (IMAGE)
FRAUNHOFER INSTITUTE FOR APPLIED SOLID STATE PHYSICS
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Close-up of the power module developed and manufactured at Fraunhofer IAF, featuring 1200-V-class GaN transistors on an insulating substrate for use in bidirectional DC charging systems
CREDIT
© Fraunhofer IAF
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2026-06-01
www.eejournal.com
2026-06-01
EEJournal
June 1, 2026
Infineon sets new benchmark for electric vehicle inverters and introduces first silicon carbide power module operating at 205°C
Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) has achieved a new milestone in power modules for electric vehicle inverters: The company is introducing a new 1300 V silicon carbide (SiC) module within the HybridPACK™ Drive family that is capable of cont
2026-05-30
www.ad-hoc-news.de
2026-05-30
AD HOC NEWS
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2026-05-29
www.semiconductor-today.com
2026-05-29
Semiconductor Today
Infineon introduces first silicon carbide power module operating at 205°C
Infineon Technologies AG of Munich, Germany is introducing a new 1300V silicon carbide (SiC) module within the HybridPACK Drive family that is capable of continuous operation at temperatures up to 205°C. Existing designs typically allow up to 175°C. This increase enables automotive OEMs and tier-1 suppliers to deliver highe