Semiconductor News & Analysis Feed
20 articles
2026-09-29
datacenters.economictimes.indiatimes.com
2026-09-29
2026-09-09
technode.global
2026-09-09
2026-08-23
2026-08-02
finance.yahoo.com
2026-08-02
2026-07-31
www.benzinga.com
2026-07-31
TSMC is reportedly developing advanced chip packaging technology to challenge Intel's dominance in the semiconductor industry. This development signals a significant shift in the competitive landscape of the semiconductor sector. While Intel maintains strong position in traditional processor markets
2026-07-30
seekingalpha.com
2026-07-30
2026-07-30
asianews.network
2026-07-30
2026-07-24
interestingengineering.com
2026-07-24
NVIDIA's $1.5 billion investment in expanding US chip packaging capacity represents a significant strategic move in response to global supply chain reshoring trends and geopolitical pressures. This commitment underscores the semiconductor industry's growing emphasis on supply chain security and dome
2026-07-22
2026-07-16
www.forbes.com
2026-07-16
2026-07-16
tech.yahoo.com
2026-07-16
2026-07-13
news.google.com
2026-07-13
2026-07-13
news.google.com
2026-07-13
2026-07-04
247wallst.com
2026-07-04
Camtek, an Israeli semiconductor inspection equipment provider, plays a pivotal role in advanced chip packaging. As demand for high-bandwidth memory (HBM) and 2.5D/3D chiplet stacking increases to support AI accelerators, its inspection tools have become mission-critical. In Q1 2026, Camtek reported
2026-06-29
www.insidermonkey.com
2026-06-29
Mizuho, a Wall Street firm, recently highlighted Intel's cost advantage in advanced chip packaging, particularly when competing against TSMC's CoWoS-L technology. The firm noted that Intel's EMIB-T approach offers superior efficiency and lower costs for connecting multiple chips, potentially enablin
2026-06-29
finance.yahoo.com
2026-06-29
Goldman Sachs recently stated that Intel holds a cost advantage over TSMC in the advanced chip packaging race, a key development in the semiconductor industry. The firm initiated coverage of Intel with a Neutral rating and a $150 price target, citing positive trends in the server CPU market driven b
2026-06-25
www.scmp.com
2026-06-25
Chinese chip packaging and testing giant JCET plans to invest 7.8 billion yuan (US$1.15 billion) to build a new advanced packaging and testing facility in Shanghai's Lingang Special Area. This move comes amid rapid growth in domestic chip demand driven by artificial intelligence development. The pro
2026-06-24
2026-06-17
www.sphericalinsights.com
2026-06-17
The rapid advancement of artificial intelligence has positioned chip packaging technology at the core of semiconductor industry competition. According to Spherical Insights' market analysis, the global advanced chip packaging market is experiencing significant growth with substantial expansion expec
2026-05-29
cryptobriefing.com
2026-05-29
MediaTek is adopting a dual chip packaging strategy in response to strained capacity at TSMC, the world's leading foundry, as demand for AI chips intensifies. By integrating Intel’s EMIB technology alongside TSMC’s CoWoS and SoIC services, MediaTek aims to mitigate risks associated with over-relianc